Search results with tag "Warpage"
Low Warpage Coreless Substrate for IC Packages
www.jiep.or.jp56 Transactions of The Japan Institute of Electronics Packaging Vol. 5, No. 1, 2012 less substrates include no core layers with high rigidity, thermal warpage of coreless substrates becomes larger
Application of Soft Computing for the Prediction of ...
www.jestr.org56 Research Article Application of Soft Computing for the Prediction of Warpage of Plastic Injection Molded Parts B. Sidda Reddy 1,*, J. Suresh Kumar2, Vijaya Kumar Reddy2 and G. Padmanabhan3 1Department of Mechanical Engineering, R. G. M. College of Engineering & Technology,
Troubleshooting Guide for Injection Molding
www.jppc.ir5. Warpage Non-uniform stress due to excessive orientation and/or shrinkage Part ejected too hot (increase cycle time) Mold at high temperatures, low pressures, and moderate fill rates Decrease injection fill rate Molded in stress due to low stock temperature and cold mold Minimize hot spots in …