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Low Warpage Coreless Substrate
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Low Warpage Coreless Substrate for IC Packages
www.jiep.or.jp55 Kurashina et al.: Low Warpage Coreless Substrate (1/8) 1. Background With a continuous enhancement of performance and feature downsizing of electronic products, the use of Ball grid array (BGA) packages is spreading rapidly as elec-
Low Df Build-up Material for High Frequency Signal ...
www.ectc.net5/30/2013 1 Low Df Build-up Material for High Frequency Signal Transmission of Substrates The 63rd Electronic Components and Technology Conference (ECTC)