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Low Warpage Coreless Substrate for IC Packages

Low Warpage Coreless Substrate for IC Packages

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56 Transactions of The Japan Institute of Electronics Packaging Vol. 5, No. 1, 2012 less substrates include no core layers with high rigidity, thermal warpage of coreless substrates becomes larger

  High, Substrates, Warpage, Coreless, Low warpage coreless substrate

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