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3DIC Wafer Level Packaging for CMOS Sensor and …

2008/10/9 3DIC Wafer Level Packaging for CMOS Sensor and Logic IC’s Wei-Ming Chen, Ph.D. Vice President, R&D, Xintec Inc.

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  Packaging, Levels, Cmos, Sensor, Wafer, 3dic wafer level packaging for cmos sensor, 3dic

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