Transcription of August-2010 - Bonding Source
1 TechnicalDataSheet ABLEBOND JM7000 august - 2010 PRODUCTDESCRIPTIONABLEBOND JM7000provides thefollowingproductcharacteristics:Techn ologyCyanateEsterAppearanceSilverCureHea tcureFillerTypeSilverProduct Benefits Excellentadhesion Lowmoisturein cavity Lowweightlossduringcure Lowionicimpurities Highreliability Minimalvoiding Electricallyconductive ThermallyconductiveApplicationDieattachS ubstratesAlumina, Goldplatedalumina andHeatsinksTypicalPackageApplicationVLS I packages, Soldersealedceramicpackages andSoldersealedhermeticpackagingABLEBOND JM7000 dieattachadhesivehasbeenformulatedforuse in highthroughputdieattachapplications. Thismaterialhasbeenusedsuccessfullyonrig idsubstrateswithdiesizesupto 700 ,HAAKERV-20 Rotoviscometer,1 cone@22 sec-1, cP9,000 WorkLife@25 C, hours8 to16 ShelfLife@-40 C(fromdateof manufacture), year1 TYPICALCURINGPERFORMANCECureSchedule30 minutes@150 C (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment,ov enloadingandactualoventemperatures.
2 TYPICALPROPERTIESOFCUREDMATERIALP hysicalProperties:Coefficientof ThermalExpansion:BelowTg,ppm/ C33 GlassTransitionTemperature (Tg) by TMA, C240 BulkThermalConductivity,:@90 C, @165 C, , DMTA, MPa:Cured30 minutes@300 C 10,000 ExtractableIonicContent,@100 C ppm:Chloride(Cl-)<10 Sodium(Na+)<15 Potassium(K+)<15 Decomposition(inN2):TGAanalysis@10 C/ minuterampfrom25 to400 C@340 C,% @400 C,% :VolumeResistivity,ohms-cm :2 X 2 mmSidie, kg-f,cured20 minutes@150 CSubstrateDSSAg/CuLF 5 TensileStrength:cured30 minutes@300 C, MPaAfterCureAfter1000TC'C">17>17 Radiusof Curvature:SidieonAlumina, meterscured30 minutes@300 CChipSize:ROC15x 15mm> 5 GENERALINFORMATIONF orsafehandlinginformationonthisproduct,c onsulttheMaterialSafetyDataSheet,(MSDS). TDSABLEBOND JM7000, august - 2010 containerto , C, JM7000is non-seperatingandis resistanttosettlingsojarrollingis notrequired.
3 Temperature, CSyringe Thaw Time, , to38 mwet bondlinethickness,dispensedwithapproxima tely25 to50%filletingonallsidesof JM7000adhesiveexhibitsminimumshrinkagedu ringcure,consequentlythewetandfiredbondl ineis POTLIFEABLEBOND JM7000adhesivehasdemonstratedstabledispe nseweightsoveran8-hourperiodofcontinuous usage. Useofthematerialupto16 hoursispossiblewithminormachineadjustmen tstomaintainconsistentdispensedvolumeand weight CURINGGUIDELINESS uggestedtemperaturecuresarefrom150 to350 . Forapplicationsrequiringhigherelectrical conductivity,acurecycleat300 Cfor15 minutesisrecommended. Productpropertiesgenerallywillnotbereduc edbysubsequentpostdieattachthermalexposu re, ,wirebond,and/orlidsealupto370 C. AcceptablecuringequipmentforABLEBOND JM7000adhesiveincludesboxovens,heatertun nels,heaterrailsandbeltfurnaces. Curingincleandryairatmosphereisrecommend ed. drylocation.
4 : -40 C. Storagebelowminus(-)40 Corgreaterthanminus(-)40 Donotreturnproducttotheoriginalcontainer . additionalinformationis required,pleasecontactyourlocalTechnical ServiceCenterorCustomerServiceRepresenta tive. Conversions( Cx )+ 32= FkV/mmx V/milmm/ inchesN x lbN/mmx lb/inN/mm x 145= psiMPax 145= psiN m x lb inN mx lb ftN mm oz inmPa s= cPAmericas+ + + JM7000, august - 2010 NoteThedatacontainedhereinarefurnishedfo rinformationonlyandarebelievedtobereliab le. Wecannotassumeresponsibilityfortheresult sobtainedbyothersoverwhosemethodswehaven ocontrol. It istheuser'sresponsibilitytodeterminesuit abilityfortheuser' ,HenkelCorporationspecificallydisclaimsa llwarrantiesexpressedorimplied,including warrantiesofmerchantabilityorfitnessfora particularpurpose,arisingfromsaleoruseof HenkelCorporation sproducts. HenkelCorporationspecificallydisclaimsan yliabilityforconsequentialorincidentalda magesofanykind,includinglostprofits.
5 Thediscussionhereinofvariousprocessesorc ompositionsisnottobeinterpretedasreprese ntationthattheyarefreefromdominationofpa tentsownedbyothersorasa licenseunderanyHenkelCorporationpatentst hatmaycoversuchprocessesorcompositions. Werecommendthateachprospectiveusertesthi sproposedapplicationbeforerepetitiveuse, usingthisdataasa guide. ,alltrademarksinthisdocumentare trademarksof + + +
