Die Attach Film

1 Die Attach FilmDie Attach FilmINNOSEM WL SeriesINNOSEM WL SeriesJanuary. 2012 January. 2012R&D CenterR&D Center--PKG materials 1team PKG materials 1team -- Activities of INNOX DAF Structure of INNOX DAF Product Code Description DAF Product Line-up General Properties of WL Series Recommend Condition of DAF Evaluation of DAF Appendix. Appendix. 1. PKG Description2. Process Condition3. Workability & ReliabilityWorld Best INNOXVISION 2015 ConfidentialR&D CENTERC ustomerModelApplication PKGR eliabilityMSLL1 MSLL2aMSLL1 MSLL2aH WL -03 DEnd-customerS (PKG)uSD&SDPKG QualifiedS A LGA PKG QualifiedBGA PKG QualifiedB K W MCP PKG QualifiedTaiwan customerSe TSOP PKG QualifiedFBGA PKG QualifiedH B (Card)WL -02DS(WL -05A)uSD&SD, UFD QualifiedL DDP PKG QualifiedDDP/ODP PKG QualifiedHa WL -02DS(WL -05A)TSOP PKG Under Eval A (Non-filler type)

2 H Customer List _ Domestic Activities of INNOX DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTERC ustomerModelApplication PKGR eliabilityMSLL2aEnd-customerS (TWN)uSD/SD Card QualifiedTFBGA Qualified TSOP QualifiedLGA Under Eval S /Sa Sa Sa M O (TWN)uSD/SD Card QualifiedTFBGA Qualified LGA Under Eval S /Sa Sa K (TWN)MCP PKG QualifieduSD/BGA Under Eval Sd (TWN)uSDCard QualifiedSa E (CHN)WL -02DS(WL -05A)uSD/SD Card QualifiedSa P (TWN)uSD/TFBGA Under Eval T /E Sa (CHN)uSD/LGA/BGA/MCP Under Eval A (TWN)FBGA/aQFNU nder Eval C (CHN)uSD/LGA/BGA/MCP Under Eval WL -02DS(WL -05A)I Activities of INNOX DAF Customer List _ OverseasWorld Best INNOXVISION 2015 ConfidentialR&D CENTERWL SeriesItemsMaterialWL0010WL0020WL0025WL0 040 Cover FilmPET Film36 Die Attach FilmEpoxy Composite10 20 25 40 PSAUV Adhesive10 Dicing FilmBase FilmPO Film100 Structure of INNOX DAFC ross-sectionPrecut shapeABCover filmAdhesive LayerPSABase filmDicing filmPrecut dimensionABC8 220 1mm279 5mm290 2mm12 320 1mm378 5mm390 2mmCWorld Best INNOXVISION 2015 ConfidentialR&D CENTERINNOSEM WL002002 DSRevision Attach Film Thickness( )Base Film Thickness(mil)WL : Wafer Backside Lamination FilmPW.

3 Penetration WBLP roducts Name Product Code DescriptionWorld Best INNOXVISION 2015 ConfidentialR&D CENTERINNOXH ItemUnitWL -02 DSFH-9211 STest MethodCover Film 3638 Die Attach Film 2020 DimensionThicknessMicro-GaugeDicing Film 110110 Glass Transition Temperature (Tg) C208197 DMA 1( < Tg )ppm / 2( > Tg )ppm / C(Before Cure) Modulus250 C(After Cure) Strength between DAF and Dicing FilmAdhesivePropertiesN/25 After Strength of DAFN/m8401150 UTMD well time (@150 C) Shear Strengthkgf> > Absorption%< < Life (at room temp.)Day< 90-INNOXM ethod General Properties of WL SeriesWorld Best INNOXVISION 2015 ConfidentialR&D CENTERP rocessItemUnitRecommend ConditionTemp C65~70 Wafer MountTemp C125~150D/A CureTimePressureN/ 10~15 Blade Rotationrpm40~45 KFeed Speed /sec30~80 SawingBlade height 70~80 Center Wave Length 365 Illuminationmw/ 60~80UV CureLight Amountmj/ 200 Temp C120~ ~ ~ 30~60 Wire BondTemp C120~175 EMC MoldUser ConditionTemp C175~180 CureTimemin 60~120 Recommend Condition of DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTERW afer MountDicingPick upBlade Rotation : 40,000~45,000rpmFeed Speed.

4 30~80 /secBlade Height : 70 Temp. : 65~70 CUV CureUV Radiation : 150~200mj/ 1stDie AttachTemp. : 120~150 CTime : ~ : ~ AttachTemp. : 120~150 CTime : ~ : ~ SubstrateUV DicingDAFW afer Application of Application of 4 Die Stack3rdDie AttachTemp. : 120~150 CTime : ~ : ~ Best INNOXVISION 2015 ConfidentialR&D CENTER4thDie AttachTemp. : 120~150 CTime : ~ : ~ Application of Application of 4 Die StackWire BondingTemp. : 120~150 CDie Attach CureTemp. : 125 CTime : 30minMode : Ramp up 30minMoldingTemp. : 175~180 CTime : 60~120minMode : Ramp up 30minCureUser ConditionWorld Best INNOXVISION 2015 ConfidentialR&D CENTER Package Description(unit : )IDItemsDimensionASubstrate BMold C1~C4 Film Thickness20+/-3 DDie Assembly BOM setItemSupplierModelSubstrateL AdhesiveINNOXWL0020-02 DSGold WireH Pd Alloy(US-U Type)Mold CompoundC (14pi * )1.

5 PKG DescriptionC1AC2DC3C4B Evaluation of DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTERP arameterItemsUnitNandControllerMachine-Y AMAHA YV100 XTLamination Temp. C6767 Lamination Speedmm/sec1717 Wafer Thickness 70200 ItemsUnitParameterNandControllerMachine- DISCO DFD-6361 Die Size x x Type-ZH05 CD / ZH05 BB27 HDCD / 27 HCBCB lade Height 160 / 70200 / 70 Rotation SpeedRPM40K / 50K40K / 45 KFeed Speed /sec40402-1. Wafer Lamination Condition2-2. Sawing Condition2. Process Condition Evaluation of DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTERP arameterItemsUnitNandControllerMachine-S hinkawa SPA-300 Die Size x x Thickness 70200 Quantity of PinEA132 Pick-up Time[msec.]

6 ]200200 Pin Height 350200 Wafer Expanding Type-High Pressure Mercury LampIlluminationmw/ 80 Light Amountmj/ 2002-3. UV Cure Condition2-4. Pick-up Condition Evaluation of DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTERP arameterItemsUnitNandControllerMachine-S hinkawa SPA-300 Temperature C120135 Bond Forcegf500~1000400 Bond Die Attach Condition Evaluation of DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTER Sawing Result (Nand)3-1. Workability of WL00203. Workability & ReliabilityRotation SpeedFeed SpeedWafer Sawing LineBase Film Sawing Line45k rpm40 /s Pick up Result (Nand)Pin HeightPick-up missPick-up QuantitySub Parameter300 01500ea Wafer Expanding : Pin Quantity : 13ea Pick up Force : 70gf Pick up Time : 200 Evaluation of DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTER3-2.

7 Reliability of WL0020(1) MRT L2 : Pass Reliability Condition of WL0020 ItemMRT(85 C/60%RH, 168hr)WL0020 Level 2 Pass (0/190ea) Evaluation of DAFW orld Best INNOXVISION 2015 ConfidentialR&D CENTER Appendix 1. Appendix 1. Storage ConditionItemsSpecificationShelf LifeBefore openingBelow 5 C / 1 yearRT / 3 monthAging conditionRT / 4hrAfter wafer mountRT / 60 daysWorking ConditionAfter UV IrradiationRT / 60 daysIt is recommended that UV cure should be proceeded within 60days from wafer mount UV Irradiation, pick up process should be finished within 60daysWorld Best INNOXVISION 2015 ConfidentialR&D CENTER1.

8 Test Purpose - Checking Void after Mold by Stage Hold Time / Temperature2. Test testing by Stage Hold Time / Temperature- 30, 60, 90, 120min / 150 C3. Test Condition`Die AttachStage HoldMoldPMC & MRT30min60min90minReliability(Dwell Time)Process130 CRoll Lamination150 C190 C120sec,50kgfPMC : 180 C 120min(Rising 30min)MRT : 115 C Boiling120minSolder 260 C30sec 120minBT [ Sample Structure ]4. Test Result30min60min90min120minWL0020-02 DSVanishVanishVanishVanishFH-9211 SVanishTrapTrapTrap Appendix 2. Dwell Time (Void Vanish)World Best INNOXVISION 2015 ConfidentialR&D CENTERSub attachStage holdMoldPMCMRTR esult150 C30minVanish150 C60minVanish150 C90minVanish02DS150 C120minVanish(stage hold 150 C ; 30,60,90,120min)(stage hold (stage hold 150150 C C; ; 30,60,90,120min30,60,90,120min)) Appendix Time (Void Vanish)World Best INNOXVISION 2015 ConfidentialR&D CENTERSub attachStage holdMoldPMCMRTR esult150 C30minVanish150 C60minTrap150 C90minTrapFH-9211S150 C120minTrap Appendix 2.

9 Dwell Time (Void Vanish)(stage hold 150 C ; 30,60,90,120min)(stage hold (stage hold 150150 C C; ; 30,60,90,120min30,60,90,120min))Thank youThank youThank you