Conductive Die Attach Film - CDAF - MEPTEC.ORG

1 Conductive Die Attach film - CDAFHi hR li bilit CdtiDi Att h FilHigher Reliability Conductive Die Attach Films: Compatible with Si and GaAs WafersMEPTEC Luncheon December 11th2013 Presented by Shashi Gupta1. Market & Package TrendContentsa et & ac agee d2. Current Material Challenges & Needs3. cdaf Technology4. Bulk vs In-package measurements5. Product Roadmap6. cdaf on GaAs wafer technology7. cdaf 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 2 Market TrendsSmaller, Faster, Higher Functionalities Higher density design Higher functionalities Faster signal speed Faster signal speed Power Management Lower TCoO Reduce package thickness Applications space covers consumer, mobile, computing, communication health care, energy, industrial and automotive.

2 December 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 3 Market TrendsAn Example Source PrismarkDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 4 Package Trends - WirebondedHigher Functionality & Efficiency Miniaturized packages (QFN, DFN, SOs) Increased die-to-pad ratioIncreased dietopad ratio In some case D/P ratio close to (QFN SO QFP) Thinner packages (QFN, SO, QFP) Packages < Thinner die <75um Thinner DA bondline thickness <20um Higher density packagesHigher density packages Multi-dies packages SiP LGA/PBGAD ecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 5 Current Material Challenges on LFsConducting Die Attach Paste Dispensing: Optimize dispense patterns for various die sizes - mm to >10x10mm.

3 Fill t & Bl dFithiikt ddi Fillet & Bleed: Forces engineers to have a minimum keep out zone around die Bondline Control: Specially for smaller die BLT control is challenging and leads to die tilt Kerf creep: For thinner wafers uneven fillet height can lead to kerf creep December 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 6 Future Material NeedsWhat does the market really need moving forward ? Lower Cost Higher Reliability Higher Reliability Zero Delamination Zero Bleed Minimal fillet Consistent BLT control Thin Wafer handling capability Low to no outgassing Drop in solutionDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 7pNew Materials Conductive Die Attach FilmsControlled flow technologyLaminationDicingHeatLamination Process.

4 WaferPrecut cDAFHeatWaferPtdtiditthfil ffPrecut Conductive die Attach films offera single step lamination to wafer backDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 8 Control FlowEnables MiniaturizationControlled FilletWith FilletDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 9 Control FlowThin Wafer HandlingPackage with FilletControlled Fillet HeightDie Attach PasteDie Attach film Thinner wafer handling enabled Consistent Thinner bondlines achieved Eliminated Fillet Eliminated bleedDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 10 Advantages of Control FlowPackage level Enables emerging packages: Miniaturized High density Ultra thin Indirectly improves package performance: Faster signal speed (shorter interconnection) Better power management (low RdSon) Better heat dissipationp Indirectly reduces TCoO: Cheaper design choice (SiP vs.)

5 SoC) Less material used (high packaging density)Less material used (high packaging density) Improve yieldCDAF technology is well-aligned with emerging package trendsDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 11 Henkel s Solution to Control FlowProduct Spaceormancermal (Rth) perfoMSL2 on all LF finishDSon) and TherMSL1 on all LF finishr Electrical (RDMSL2 on LaminatesHigheDie SizeDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 12 Why cdaf has higher reliabilityPaste and film comparisonPaste materialLiiFilm materialLow viscosityThermoset monomer with lower molecular weightHigh viscosityThermoset monomer with higher molecular weight (solid resins)

6 High cross-linking densityLow toughnessLoweradhesionLower crosslinking densityHigh toughnessBetteradhesionLower adhesionInferior MSL performanceBetter adhesionBetter MSL performanceDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 13 Material Benefits of cDAFP otential for Zero Delam applicationsBleedNo BleedMCMCP asteRough SubstrateBleedNo BleedCDF 215 PRough Substrate Conductive films do not bleed and do not have a fillet so the Conductive films do not bleed and do not have a fillet, so the adhesion of MC to LF is stronger regardless of LF finish: smooth or rough. cdaf also has minimal out-gassing, which ensures clean WB bond pads & die top wirebonding or MC-die top delamination not observedDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 14 Thermal & Electrical for cDAFS table In-Package performance Thermal Conductivity [W/mK] is an intrinsic material property Thermal Resistance, Rth[K/W]

7 , is a geometry dependant value that allows us to better compare materials in a functional package7090% f thRid tthit fdi t t dithl 70 90% of the Rthis due to the interfaces and is not captured in thermal conductivity valuesConductive films are designed to have optimal performance in the z-axis directionDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 15 Conductive films are designed to have optimal performance in the zaxis directionPortfolio of cdaf ProductsProperty table for film and pasteunitCDF 200 PQMI51984-1 LMI SR482908008 HTCDF 800 PQMI529 HTCDF 500 PFS849-TICDF 6002100 AMaterial PropertyVolume - alpha1ppm/C4840408137405360447565 CTE l h 2/C12014015018162118156245155320200 CTE alpha 2ppm/C12014015018162118156245155320200Tg C15751203826411310211"-560 Modulus @ 25 CMpa5,4005,3003,9303,0346,6597,1003,3001 1,3007,8003,0003,200 Modulus @ 250 CMpa1,0002873031172.

8 450900-1301,07040230 PerformanceHDSS (260 C) on Agkg/mm^ Temp DSS on PPFkg/mm^ > Temp DSS on Agkg/mm^ > ^231718122515>20 Room Temp DSS on Cukg/mm^ > ModeCohesiveCohesiveCohesiveCohesive-Coh esiveCohesiveCohesive-CohesiveCohesiveTh ermal Resistance, Shift (500 TC)% Shift (1000 TC)% MSL 260 C(on 7x7mm PPF QFN with MSL level1 MSL1 capable for ll di3 MSL1 capable for ll di31 MSL1 capable for ll di1 MSL1 capable for ll di2 (PBGA)2 (PBGA) die)small diesmall diesmall diesmall dieJEDEC MSL 260 C(on 7x7mm PPF QFN with die)MSL level2 - - --2-132 (PBGA)2 (PBGA)ProcessingCf30 min ramp to 200C+30 min. ramp + hold 60 min @ 100 C 30 min ramp to C30 min ramp to 175C+20 seconds30 min ramp to 200C+30 min ramp to 185C+3030 min ramp to 200C+30 min ramp to 175C+3030 min ramp + 100C/30min30 min ramp to 175C+Cureprofileto 200C 1hr soak @ 200C+ 15 min ramp + hold 60 min @ 200 + 1hr soak @ 175 Cto 175C 15min soak @ 175C20 seconds @ 280 Cto 200C 1hr soak @ 200 Cto 185C 30 min soak @ 185 Cto 200C 1hr soak @ 200 Cto 175C 30 min soak @ 175C100C/30min + 30 min ramp + 170C/1hrto 175C 15min soak @ 175 CDecember 11.

9 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 16 Thermal Resistance Comparison of paste and film Si-back dieQFN 7x7mm, PPF (pad )QFN 7x7mm, PPF (pad )30min RAMP + 200 C 1hr cure December 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 17 RDSonIn package ; TiNiAg-back dieTO-220, Cu [ohms] ilDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 18 Conductive Die Attach film Laser DicingBlade DicingLaser DicingProcess methodMechanical cuttingSurface absorption laser process (melting, evaporation)Water (cooling / cleaning)RequiredRequired for cleaning onlyChii?

10 YLhiiChipping?YesLess chippingDebris generation?YesYesT-shape and round shape dicingNot possiblePossible in certain casesUltra-thin wafer dicing possible?LimitedPossibleKerf Width15 to 25 mLess than 15 mProcessing speed5 to 10 mm/s225 mm/sCDAF is compatible with both blade and laser dicing on Si or GaAs wadersDecember 11, 2013 MEPTEC December 11th2013 Luncheon Presentation Henkel CONFIDENTIALS lide 19 Advantages of Control FlowCDAF Material Advantages Thin wafer handling with precut format Excellent electrical conductivity, very low RDSon shift (<10%) Thinner package and smaller footprint (higher density packaging)