Automotive grade High current power inductors

1 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power inductorsProduct features AEC-Q200 grade 1 qualified high current carrying capacity Magnetically shielded, low EMI Frequency range up to 1 MHz Inductance range from H to 100 H current range from A to 40 A mm x mm footprint surface mount-package in a mm height Alloy powder core material Moisture Sensitivity Level (MSL): 1 Halogen free, lead free, RoHS compliantApplications Body electronics Central body control module Vehicle access control system Headlamps, tail lamps and interior lighting Heating ventilation and air conditioningcontrollers (HVAC) Doors, window lift and seat control Advanced driver assistance systems Adaptive cruise control (ACC) Automatic parking control Collision avoidance system/Car black box system Infotainment and cluster electronics Audio subsystem.

2 Head unit and trunk amp Digital instrument cluster In-vehicle infotainment (IVI) and navigation Port power /USB HUB for front andrear passengers Chassis and safety electronics Airbag control unit Electronic stability control system (ESC) Electric parking brake Engine and Powertrain Systems Electric pumps, motor control and auxiliaries Powertrain control module (PCU)/EngineControl unit (ECU) Transmission Control Unit (TCU)Environmental Data Storage temperature range (Component):-55 C to +155 C Operating temperature range: -55 C to +155 C(ambient plus self-temperature rise) Solder reflow temperature:J-STD-020 (latest revision) compliantPbHALOGENHFFREE2 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power Specifications Part Number6 OCL1 ( H) 20%FLL2 ( H) minimumIrms3 (A)Isat4 (A)DCR (m ) typical @ +20 CDCR (m ) maximum @ +20 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, Vrms, Adc, +25 C2.

3 Full Load Inductance (FLL) Test Parameters: 100 kHz, Vrms, Isat, , +25 C3. Irms: DC current for an approximate temperature rise of 30 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 155 C under worst case operating conditions verified in the end Isat: Peak current for approximately 20% rolloff @ +25 C5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I. Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in H), I (Peak to peak ripple current in Amps).6. Part Number Definition: HCM1A1104-xxx-R HCM1A1104 = Product code and size xxx= inductance value in H, R= decimal point, If no R is present then last character equals number of zeros-R suffix = RoHS compliantDimensions (mm)Part marking: 1 AXXX= Automotive grade , XXX=inductance value in uH, R=decimal point.

4 If no R is present then last character equals number of zeros. xxxx=Lot code All soldering surfaces to be coplanar within millimeters Tolerances are millimeters unless stated otherwise DCR measured from point a to point b Color: Grey Do not route traces or vias underneath the inductorxxxx3 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power information (mm)Drawing not to scaleSupplied in tape and reel packaging, 500 parts per 13 diameter Loss (mW)Bp-p(Gauss)HCM1A1104-R20-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-R36-R1 MHz500 kHz300 kHz100 kHz50 kHz25 kHzCore loss vs Bp-p4 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power loss vs Loss (mW)Bp-p(Gauss)HCM1A1104-R45-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-R47-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-R56-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-R90-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)

5 HCM1A1104-1R0-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-1R5-R1 MHz500 kHz300 kHz100 kHz50 kHz25 kHz5 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power loss vs Loss (mW)Bp-p(Gauss)HCM1A1104-2R2-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-3R3-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-4R7-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-5R6-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-6R8-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-100-R1 MHz500 kHz300 kHz100 kHz50 kHz25 kHz6 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power loss vs Loss (mW)Bp-p(Gauss)HCM1A1104-150-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-220-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-330-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-470-R1 MHz500 kHz300 kHz100 kHz50 kHz25 Loss (mW)Bp-p(Gauss)HCM1A1104-101-R1 MHz500 kHz300 kHz100 kHz50 kHz25 kHz7 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power and temperature rise vs.

6 Rise ( C)Inductance ( H)Idc (A) Rise ( C)Inductance ( H)Idc (A) Rise ( C)Inductance ( H)Idc(A) Rise ( C)Inductance ( H)Idc(A) erature Rise ( C)Inductance ( H)Idc(A) Rise ( C)Inductance ( H)Idc(A)HCM1A1104-R90-R8 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power and temperature rise vs. Rise ( C)Inductance ( H)Idc(A) Rise ( C)Inductance ( H)Idc(A) Rise ( C)Inductance ( H)Idc(A) Rise ( C)Inductance ( H)Idc(A) Rise ( C)Inductance ( H)Idc(A)HCM1A1104-4R7-R01020304050607080 9010001234560246810121416 Temperature Rise ( C)Inductance ( H)Idc(A)HCM1A1104-5R6-R9 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power and temperature rise vs. current010203040506070809010001234567024 6810121416 Temperature Rise ( C)Inductance ( H)Idc(A)HCM1A1104-6R8-R01020304050607080 90100024681012024681012 Temperature Rise ( C)Inductance ( H)Idc(A)HCM1A1104-100-R01020304050607080 9010002468101214160246810 Temperature Rise ( C)Inductance ( H)Idc(A)HCM1A1104-150-R01020304050607080 90100048121620240246810 Temperature Rise ( C)Inductance ( H)Idc(A)HCM1A1104-220-R01020304050607080 9010005101520253035012345678 Temperature Rise ( C)Inductance ( H)Idc(A)HCM1A1104-330-R01020304050607080 90100051015202530354045500123456 Temperature Rise ( C)Inductance ( H)Idc(A)HCM1A1104-470-R10 Technical Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power and temperature rise vs.

7 Rise ( C)Inductance ( H)Idc(A)HCM1A1104-101-R 2016 EatonAll Rights ReservedPublication No. 10550 BU-MC16071 August 2016 Eaton is a registered other trademarks are property of their respective Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this Division1000 Eaton BoulevardCleveland, OH 44122 United Data 10550 Effective August 2016 HCM1A1104 Automotive grade high current power inductorsTemperaturettP tsTC -5 CTime 25 C to Peak Time25 CTsminTsmaxTLTPP reheatAMax.

8 Ramp Up Rate = 3 C/sMax. Ramp Down Rate = 6 C/sSolder reflow profileReference JDEC J-STD-020 Profile FeatureStandard SnPb SolderLead (Pb) Free SolderPreheat and Soak Temperature min. (Tsmin)100 C150 C Temperature max. (Tsmax)150 C200 C Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 SecondsAverage ramp up rate Tsmax to Tp3 C/ Second C/ Second temperature (Tl) Time at liquidous (tL)183 C 60-150 Seconds217 C 60-150 SecondsPeak package body temperature (TP)*Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc)20 Seconds**30 Seconds**Average ramp-down rate (Tp to Tsmax)6 C/ Second C/ Second 25 C to Peak Temperature6 Minutes Minutes Max.* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user 1 - Standard SnPb Solder (Tc)Package ThicknessVolume mm3 <350 Volume mm3 350< )235 C220 C C220 CTable 2 - Lead (Pb) Free Solder (Tc)Package ThicknessVolume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000< C260 C260 C250 C245 C> C245 C245 C