Build Your Own LaunchPad or LaunchPad …

1 DesignGuideSLAA542 December2012 BuildYourOwnLaunchPad orLaunchPadBoosterPack ,theseguidelinescanalsomaximizesuccesswh encreatinga is importanttonotethatthisstandardensureson lyphysicalandelectricalcompatibilitybetw eenaLaunchPadbaseboardanda ,nordoesit ensurethattheembeddedprocessorontheLaunc hPadcansupportthefunctionsofa , ,it is bettertocreatea 20-pinBoosterPackratherthana 40-pinBoosterPackif a December2012 BuildYourOwnLaunchPad orLaunchPadBoosterPack DevelopmentToolSubmitDocumentationFeedba ckCopyright 2012, A baseboardthatis basedona ,C2000,Stellaris, differentpincounts: 20pins 40pins 80pins(future) ( ) : On-boardemulationforprogramming,debuggin g,andserialcommunicationtoPC Resetbutton General-purposebuttonsandLEDsBoosterPack A pluginmodulethatfitsontopofa differentpincounts: 20pins 40pins 80pins(future) ,stackableheaderscanbeused, , youareinterestedin makingyourBoosterPackstackable, :SamtecSSW-110-23-S- (Partnumber:19950) ,a BoosterPackDesignGuideis a ,in additiontothisBoosterPackstandard,givesd eveloperstheinformationneededtodesigna newBoosterPackthatis thisstandardis followed, "docks"in , andFigure2 showexamplesofhowBoosterPackkitscanbeplu ggedintoa 20-pinBoosterPackcanalsostackona orLaunchPadBoosterPack DevelopmentSLAA542 December2012 ToolSubmitDocumentationFeedbackCopyright 2012, December2012 BuildYourOwnLaunchPad orLaunchPadBoosterPack DevelopmentToolSubmitDocumentationFeedba ckCopyright 2012, :Allpinsareona 100mil( ) BoosterPackis 1350milif thereis noneedtoaccessthe3-pinGND,GND,VCCheader( J3).

2 AllpinscanbeusedasGPIO sexceptVCC,GND,TEST, is ,thisis onlya recommendationandshouldnotrestrictdesign if changesarenecessary.** NotethatTXandRXarein youarebuildinga BoosterPack,theRXandTXlinesarereversed.* CapacitiveTouchSense- thisfeatureis notavailableona specificdevice, orLaunchPadBoosterPack DevelopmentSLAA542 December2012 ToolSubmitDocumentationFeedbackCopyright 2012, :Allpinsareona 100mil( ) BoosterPackis 1350milif thereis nodetailedstandardfortheinner20pins(head erJ3andJ4). ,GND,TEST, is ,thisis onlya recommendationandshouldnotrestrictdesign whennecessary** NotethatTXandRXarein youarebuildinga BoosterPack,theRXandTXlinesarereversed.* CapacitiveTouchSense- thisfeatureis notavailableona specificdevice, December2012 BuildYourOwnLaunchPad orLaunchPadBoosterPack DevelopmentToolSubmitDocumentationFeedba ckCopyright 2012, , :Allpinsareona 100mil( ) BoosterPackis 3150milif thereis (J6,J7,J8,andJ9) nodetailedstandardfortheinner20pins(head ersJ3,J4,J8,andJ9).

3 ,GND,TEST, is orLaunchPadBoosterPack DevelopmentSLAA542 December2012 ToolSubmitDocumentationFeedbackCopyright 2012, ,thisis onlya recommendationandshouldnotrestrictdesign whennecessary.** NotethatTXandRXarein youarebuildinga BoosterPack,theRXandTXlinesarereversed.* CapacitiveTouchSense- thisfeatureis notavailableona specificdevice, ( )LaunchPadandBoosterPackEaglefootprints( )7 SLAA542 December2012 BuildYourOwnLaunchPad orLaunchPadBoosterPack DevelopmentToolSubmitDocumentationFeedba ckCopyright 2012,TexasInstrumentsIncorporatedIMPORTA NTNOTICET exasInstrumentsIncorporatedanditssubsidi aries(TI)reservetherighttomakecorrection s,enhancements,improvementsandotherchang estoitssemiconductorproductsandservicesp erJESD46,latestissue,andtodiscontinueany productorserviceperJESD48, (alsoreferredtohereinas components ) aresoldsubjecttoTI s ,in accordancewiththewarrantyin TI s ,testingofallparametersofeachcomponentis productsandapplications, ,eitherexpressorimplied,is grantedunderanypatentright,copyright,mas kworkright,orotherintellectualpropertyri ghtrelatingtoanycombination,machine,orpr ocessin licensetousesuchproductsorservicesora licensefroma thirdpartyunderthepatentsorotherintellec tualpropertyofthethirdparty,ora TIdatabooksordatasheetsis permissibleonlyif reproductionis withoutalterationandis accompaniedbyallassociatedwarranties,con ditions,limitations, is solelyresponsibleforcompliancewithallleg al,regulatoryandsafety-relatedrequiremen tsconcerningitsproducts,andanyuseofTIcom ponentsin itsapplications, hasallthenecessaryexpertisetocreateandim plementsafeguardswhichanticipatedangerou sconsequencesoffailures,monitorfailuresa ndtheirconsequences.

4 TI s goalis , FDAC lassIII(orsimilarlife-criticalmedicalequ ipment)unlessauthorizedofficersofthepart ieshaveexecuteda enhancedplastic solelyattheBuyer's risk,andthatBuyeris solelyresponsibleforcompliancewithallleg alandregulatoryrequirementsin , , , :TexasInstruments,PostOfficeBox655303,Da llas,Texas75265 Copyright 2012,TexasInstrumentsIncorporat