Data sheet acquired from Harris Semiconductor …

1 data sheet acquired from Harris SemiconductorSCHS027C Revised February 2004 The CD4017B and CD4022B types are supplied in16-lead hermetic dual-in-line ceramic packages(F3A suffix), 16-lead dual-in-line plastic package(E suffix), 16-lead small-outline packages (NSR suffix),and 16-lead thin shrink small-outline packages (PW andPWR suffixes). The CD4017B types also are supplied in16-lead small-outline packages (M and M96 suffixes).ripple-clock the succeeding device in amulti-device counting 2004, Texas Instruments IncorporatedPACKAGE OPTION 1 PACKAGING INFORMATIONO rderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp ( C)Device Marking(4/5)SamplesCD4017 BEACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4017 BECD4017 BEE4 ACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4017 BECD4017 BFACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125CD4017 BFCD4017BF3 AACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125CD4017BF3 ACD4017 BMACTIVESOICD1640 Green (RoHS& no Sb/Br)

2 CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4017 BMCD4017BM96 ACTIVESOICD162500 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4017 BMCD4017BM96G4 ACTIVESOICD162500 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4017 BMCD4017 BMG4 ACTIVESOICD1640 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4017 BMCD4017 BNSRACTIVESONS162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4017 BCD4017 BNSRG4 ACTIVESONS162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4017 BCD4017 BPWACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM017 BCD4017 BPWRACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM017 BCD4017 BPWRE4 ACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM017 BCD4017 BPWRG4 ACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM017 BCD4022 BEACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4022 BECD4022 BEE4 ACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4022 BECD4022 BFACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125CD4022 BFCD4022BF3 AACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125CD4022BF3 APACKAGE OPTION 2 Orderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp ( C)

3 Device Marking(4/5)SamplesCD4022 BNSRACTIVESONS162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4022 BCD4022 BNSRE4 ACTIVESONS162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4022 BCD4022 BPWACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM022 BCD4022 BPWE4 ACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM022 BCD4022 BPWRACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM022 BCD4022 BPWRE4 ACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM022 BCD4022 BPWRG4 ACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM022 BJM38510/05651 BEAACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125JM38510/05651 BEAM38510/05651 BEAACTIVECDIPJ161 TBDA42N / A for Pkg Type-55 to 125JM38510/05651 BEA (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new : TI has announced that the device will be discontinued, and a lifetime-buy period is in : Not recommended for new designs.

4 Device is in production to support existing customers, but TI does not recommend using this part in a new : Device has been announced but is not in production. Samples may or may not be : TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check for the latest availabilityinformation and additional product content : The Pb-Free/Green conversion plan has not been (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean Semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed by weight in homogeneous materials.

5 Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed by weightin homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

6 PACKAGE OPTION 3(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.

7 TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

8 OTHER QUALIFIED VERSIONS OF CD4017B, CD4017B-MIL, CD4022B, CD4022B-MIL : Catalog: CD4017B, CD4022B Military: CD4017B-MIL, CD4022B-MIL NOTE: Qualified Version Definitions: Catalog - TI's standard catalog product Military - QML certified for Military and Defense ApplicationsTAPE AND REEL INFORMATION*All dimensions are nominalDevicePackageTypePackageDrawingPi nsSPQReelDiameter(mm)ReelWidthW1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm) MATERIALS Materials-Page 1*All dimensions are nominalDevicePackage TypePackage DrawingPinsSPQL ength (mm)Width (mm)Height (mm) MATERIALS Materials-Page 2 IMPORTANTNOTICET exasInstrumentsIncorporated(TI) reservesthe rightto makecorrections,enhancements,improvement sand otherchangesto itssemiconductorproductsand servicesper JESD46,latestissue,and to discontinueany productor serviceper JESD48, latestrelevantinformationbeforeplacingor dersand shouldverifythat suchinformationis currentand s publishedtermsof sale for semiconductorproducts( )

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10 Lessenthe likelihoodof failuresthat mightcauseharmandtake priorto usingor distributingany applicationsthat includeTI products,Designerwillthoroughlytest suchapplicationsand the functionalityof suchTI productsas usedin s provisionof technical,applicationor otherdesignadvice,qualitycharacterizatio n,reliabilitydataor otherservicesor information,including,but not limitedto, referencedesignsand materialsrelatingto evaluationmodules,(collectively, TI Resources ) are intendedtoassistdesignerswho are developingapplicationsthat incorporateTI products;by downloading,accessingor usingTI Resourcesin anyway,Designer(individuallyor, if Designeris actingon behalfof a company,Designer s company)agreesto use any particularTI Resourcesolelyfor this purposeand subjectto the termsof this s provisionof TI Resourcesdoesnot expandor otherwisealterTI s applicablepublishedwarrantiesor warrantydisclaimersfor TIproducts,and no additionalobligationsor liabilitiesarisefromTI providingsuchTI reservesthe rightto makecorrections,enhancements,improvement sand otherchangesto its TI has not conductedany testingotherthanthat specificallydescribedin the publisheddocumentationfor a particularTI authorizedto use, copyand modifyany individualTI Resourceonly in connectionwith the developmentof applicationsthatincludethe TI product(s)