Data sheet acquired from Harris Semiconductor …

1 data sheet acquired from Harris SemiconductorSCHS031B Revised July 2003 Copyright 2003, Texas Instruments IncorporatedThe CD4026B- and CD4033B-series types aresupplied in 16-lead dual-in-line plastic packages(E suffix), 16-lead small-outline packages (NSRsuffix), and 16-lead thin shrink small-outlinepackages (PW and PWR suffixes).PACKAGE OPTION 1 PACKAGING INFORMATIONO rderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp ( C)Device Marking(4/5)SamplesCD4026 BEACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4026 BECD4026 BEE4 ACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4026 BECD4026 BNSRACTIVESONS162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CD4026 BCD4026 BPWACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM026 BCD4026 BPWE4 ACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)

2 CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM026 BCD4026 BPWRACTIVETSSOPPW162000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM026 BCD4033 BEACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4033 BECD4033 BEE4 ACTIVEPDIPN1625Pb-Free(RoHS)CU NIPDAUN / A for Pkg Type-55 to 125CD4033 BECD4033 BPWACTIVETSSOPPW1690 Green (RoHS& no Sb/Br)CU NIPDAUL evel-1-260C-UNLIM-55 to 125CM033B (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new : TI has announced that the device will be discontinued, and a lifetime-buy period is in : Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new : Device has been announced but is not in production.

3 Samples may or may not be : TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check for the latest availabilityinformation and additional product content : The Pb-Free/Green conversion plan has not been (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean Semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe.

4 The component is otherwise considered Pb-Free (RoHS compatible) as defined (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed by weightin homogeneous material) PACKAGE OPTION 2(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device.

5 If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information.

6 Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackageTypePackageDrawingPi nsSPQReelDiameter(mm)ReelWidthW1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm) MATERIALS Materials-Page 1*All dimensions are nominalDevicePackage TypePackage DrawingPinsSPQL ength (mm)Width (mm)Height (mm) MATERIALS Materials-Page 2 IMPORTANTNOTICET exasInstrumentsIncorporatedand its subsidiaries(TI)

7 Reservethe rightto makecorrections,enhancements,improvement sand otherchangesto its semiconductorproductsand servicesper JESD46,latestissue,and to discontinueany productor serviceper JESD48, latestrelevantinformationbeforeplacingor dersand shouldverifythat suchinformationis semiconductorproducts(alsoreferredto hereinas components ) are sold subjectto TI s termsand conditionsof salesuppliedat the time of warrantsperformanceof its componentsto the specificationsapplicableat the time of sale,in accordancewith the warrantyin TI s termsand conditionsof sale of otherqualitycontroltechniquesare usedto the extentTI deemsnecessaryto supportthis applicablelaw, testingof all parametersof eachcomponentis not assumesno liabilityfor applicationsassistanceor the designof Buyers responsiblefor theirproductsandapplicationsusingTI minimizethe risksassociatedwith Buyers productsand applications,Buyersshouldprovideadequate designand doesnot warrantor representthat any license,eitherexpressor implied.

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