DRV201 Voice Coil Motor Driver for Camera Auto Focus ...

1 Product Sample & Technical Tools & Support &. Folder Buy Documents Software Community DRV201 . SLVSB25C AUGUST 2011 REVISED JUNE 2015. DRV201 Voice Coil Motor Driver for Camera Auto Focus 1 Features 2 Applications 1 Configurable for Linear or PWM Mode VCM Cell Phone Auto Focus Current Generation Digital Still Camera Auto Focus High Efficiency PWM Current Control for VCM Iris and Exposure Controls Advanced Ringing Compensation Security Cameras Integrated 10-bit D/A Converter for VCM Current Web and PC Cameras Control Actuator Controls Protection Open and Short-Circuit Detection on VCM Pins 3 Description Undervoltage Lockout (UVLO) The DRV201 device is an advanced Voice coil Motor Thermal Shutdown Driver for Camera auto Focus . It has an integrated D/A. converter for setting the VCM current. VCM current is Open and Short-Circuit Protection on VCM controlled with a fixed frequency PWM controller or a Output linear mode Driver .

2 Current generation can be Internal Current Limit for VCM Driver selected via I2C register. The DRV201 device has an integrated sense resistor for current regulation and 4-kV ESD-HBM. the current can be controlled through I2C. I2C Interface When changing the current in the VCM, the lens Operating Temperature Range: 40 C to 85 C. ringing is compensated with an advanced ringing 6-Ball WCSP Package With Pitch compensation function. Ringing compensation Max Die Size: mm mm reduces the needed time for auto Focus significantly. Package Heights: The device also has VCM short and open protection functions. YFM: mm YMB: mm Device Information(1). PART NUMBER PACKAGE BODY SIZE (NOM). DSBGA (6) mm mm DRV201 . PICOSTAR (6) mm mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic to V. DRV201 ISOURCE. +. Controller SCL. VCM. SDA Voice Coil Motor Driver ISINK.

3 1. An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DRV201 . SLVSB25C AUGUST 2011 REVISED JUNE 2015 Table of Contents 1 Features .. 1 Device Functional 11. 2 Applications .. 1 Programming .. 12. 3 Description .. 1 Register Maps .. 15. 4 Revision 2 8 Application and Implementation .. 19. Application 19. 5 Pin Configuration and Functions .. 3. Typical Application .. 19. 6 3. Absolute Maximum Ratings .. 3 9 Power Supply 22. ESD Ratings .. 3 10 22. Recommended Operating 4 Layout Guidelines .. 22. Thermal Information .. 4 Layout Example .. 22. Electrical 4 11 Device and Documentation Support .. 23. Data Transmission Timing .. 6 Community 23. Typical Characteristics .. 7 Trademarks .. 23. 7 Detailed Description .. 8 Electrostatic Discharge Caution.

4 23. Overview .. 8 Glossary .. 23. Functional Block Diagram .. 9 12 Mechanical, Packaging, and Orderable Feature 9 Information .. 23. 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (November 2013) to Revision C Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .. 1. Changes from Revision A (June 2012) to Revision B Page Changed minor datasheet errata in register maps. Updated to reflect correct bit values .. 15. 2 Submit Documentation Feedback Copyright 2011 2015, Texas Instruments Incorporated Product Folder Links: DRV201 . DRV201 . SLVSB25C AUGUST 2011 REVISED JUNE 2015. 5 Pin Configuration and Functions YFM Package 8-Pin PICOSTAR YMB Package Bottom View and Top View 6-Pin DSBGA.

5 Bottom View and Top View SCL I. SOURCE. VBAT. 2. YMB package package markings: 201. I. YFM package has no top side markings SCL. SOURCE. VBAT. 2. I YM = YEAR / MONTH DATE CODE. SDA. SINK. GND. 1. D = DAY OF LASER MARK. SDA. I. SINK. GND. 1 YMDS S. 0. = ASSEMBLY SITE CODE. = Pin A1 ( filled Solid). C B A. C B A. Pin Functions PIN. I/O DESCRIPTION. NAME NO. VBAT 2A P Power GND 1A P Ground I_SOURCE 2B O Voice coil positive terminal I_SINK 1B O Voice coil negative terminal SCL 2C I I2C serial interface clock input SDA 1C I/O I2C serial interface data input/output (open drain). 6 Specifications Absolute Maximum Ratings (1). over operating free-air temperature range (unless otherwise noted). MIN MAX UNIT. VBAT, ISOURCE, ISINK pin voltage (2) V. Voltage at SDA, SCL V. Continuous total power dissipation Internally limited TJ Operating junction temperature 40 125 C. TA Operating ambient temperature 40 85 C. Tstg Storage temperature 55 150 C.

6 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. ESD Ratings VALUE UNIT. (1). Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins 4000. V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all V. 500. pins (2). (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright 2011 2015, Texas Instruments Incorporated Submit Documentation Feedback 3.

7 Product Folder Links: DRV201 . DRV201 . SLVSB25C AUGUST 2011 REVISED JUNE 2015 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted). MIN NOM MAX UNIT. VBAT - Supply voltage V. Voltage Range - SDA and SCL V. TJ - Operating junction temperature 40 125 C. Thermal Information DRV201 . YFM. THERMAL METRIC (1) YMB (DSBGA) UNIT. (PICOSTAR). 6 PINS 6 PINS. R JA Junction-to-ambient thermal resistance C/W. R JC(top) Junction-to-case (top) thermal resistance C/W. R JB Junction-to-board thermal resistance 37 C/W. JT Junction-to-top characterization parameter C/W. JB Junction-to-board characterization parameter 37 C/W. (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Electrical Characteristics Over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25 C) (unless otherwise noted).

8 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT. INPUT VOLTAGE. VBAT Input supply voltage V. VBAT rising VUVLO Undervoltage lockout threshold V. VBAT falling 2. VHYS Undervoltage lockout hysteresis 50 100 250 mV. INPUT CURRENT. Input supply current shutdown, ISHUTDOWN MAX: VBAT = V 1 A. includes switch leakage currents Input supply current standby, includes ISTANDBY MAX: VBAT = V 120 200 A. switch leakage currents STARTUP, MODE TRANSITIONS, AND SHUTDOWN. t1 Shutdown to standby 100 s t2 Standby to active 100 s t3 Active to standby 100 s t4 Shutdown time Active or standby to shutdown 1 ms VCM Driver STAGE. Resolution 10 bits IRES Relative accuracy 10 10. LSB. Differential nonlinearity 1 1. Zero code error 0 mA. Offset error At code 32 3 mA. % of Gain error 3. FSR. Gain error drift %/ C. Offset error drift %/ C. IMAX Maximum output current mA. 4 Submit Documentation Feedback Copyright 2011 2015, Texas Instruments Incorporated Product Folder Links: DRV201 .

9 DRV201 . SLVSB25C AUGUST 2011 REVISED JUNE 2015. Electrical Characteristics (continued). Over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25 C) (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT. (1). ILIMIT Average VCM current limit See 110 160 240 mA. Minimum VCM code for OPEN and (2). IDETCODE See 256 mA. SHORT detection fSW Switching frequency Selectable through CONTROL register 4 MHz (3). VDRP Internal dropout See V. LVCM VCM inductance 30 150 H. RVCM VCM resistance 11 22 . LENS MOVEMENT CONTROL. tset1 Lens settling time 10% error band 2/fVCM ms tset2 Lens settling time 10% error band 1/fVCM ms VCM resonance frequency 50 150 Hz fVCM When 1/fVCM compensation is used 10% 10%. VCM resonance frequency tolerance When 2/fVCM compensation is used 30% 30%. LOGIC I/Os (SDA AND SCL). V = V, SCL IIN Input leakage current A.

10 V = V, SDA 1 1. RPullUp I2C pull-up resistors SDA and SCL pins k . (4). VIH Input high level See V. (5). VIL Input low level See 0 V. tTIMEOUT SCL timeout for shutdown detection 1 ms RPD Pull down resistor at SCL line 500 k . 2. fSCL I C clock frequency 400 kHz INTERNAL OSCILLATOR. fOSC Internal oscillator 20 C TA 70 C 3% 3%. Frequency accuracy -40 C TA 85 C 5% 5%. THERMAL SHUTDOWN. TTRIP Thermal shutdown trip point 140 C. (1) During short circuit condition Driver current limit comparator will trip and short is detected and Driver goes into STANDBY and short flag is set high in the status register. (2) When testing VCM open or short this is the recommended minimum VCM code (in dec) to be used. (3) This is the voltage that is needed for the feedback resistor and high side Driver . It should be noted that the maximum VCM resistance is limited by this voltage and supply voltage. For example, 3-V supply maximum VCM resistance is: RVCM = (VBAT VDRP)/IVCM = (3 V - V) mA =.