DRV8825 Stepper Motor Controller IC datasheet (Rev. F)

1 STEPStep SizeDecay to 45 VControllerM+ -+ -DRV88251/32 stepStepper Motor ADIRnFAULTP roductFolderSample &BuyTechnicalDocumentsTools &SoftwareSupport &CommunityDRV8825 SLVSA73F APRIL2010 REVISEDJULY2014 DRV8825 StepperMotorControllerIC1 Features3 DescriptionTheDRV8825providesan integratedmotordriver1 PWMM icrosteppingStepperMotorDriversolutionfo r printers,scanners,and otherautomated devicehas two H-bridge Up to 1/32 Microsteppingdriversand a microsteppingindexer,and is intendedto drivea MultipleDecayModesblockconsistsof N-channelpowerMOSFET s MixedDecayconfiguredas full H-bridgesto drivethe Motor DRV8825is capableof drivingup A of currentfromeachoutput(withproperheat FastDecaysinking,at 24 V and 25 C).

2 45-VOperatingSupplyVoltageRangeA simpleSTEP/DIRinterfaceallowseasyinterfa cing 24 V andto allowfor configurationTA= 25 Cof the motorin full-stepup to 1 SimpleSTEP/DIRI nterfacemodeis configurableso that slowdecay,fast decay, Low CurrentSleepModeor mixeddecaycanbe low-powersleepmodeis providedwhichshutsdowninternalcircuitry achieveverylow SmallPackageand Footprintsleepmodecan be set usinga dedicatednSLEEP ProtectionFeaturespin. OvercurrentProtection(OCP)Internalshutdo wnfunctionsareprovidedfor ThermalShutdown(TSD)overcurrent,shortcir cuit, indicatedvia VM UndervoltageLockout(UVLO)the nFAULTpin.

3 FaultConditionIndicationPin (nFAULT)DeviceInformation(1)2 ApplicationsPARTNUMBERPACKAGEBODYSIZE(NO M) AutomaticTellerMachinesDRV8825 HTSSOP(28) MoneyHandlingMachines(1) For all availablepackages,see the orderableaddendumat VideoSecurityCamerasthe end of the datasheet . Printers Scanners OfficeAutomationMachines GamingMachines FactoryAutomation Robotics4 SimplifiedSchematicMicrosteppingCurrentW aveform1An IMPORTANTNOTICEat the end of this datasheetaddressesavailability,warranty, changes,use in safety-criticalapplications,intellectual propertymattersand APRIL2010 Applicationand Pin Configurationand Deviceand Mechanical,Packaging,and RevisionHistoryChangesfromRevisionE (August2013)to RevisionFPage Addednew sectionsand reordereddatasheetto fit new TI flow.

4 1 Updatedpin Addedpowersupplyramprate and updatedISENSE xpin UpdatedVILvoltageminimumand UpdatedIINand 2010 2014, APRIL2010 REVISEDJULY20146 Pin Configurationand FunctionsPin FunctionsPINEXTERNALCOMPONENTSI/O(1)DESC RIPTIONOR F 50-VcapacitorbetweenCP1and , 28 DevicegroundConnecta F 16-Vceramiccapacitorand a 1-M resistortoVCP3 BridgeA powersupplyConnectto motorsupply( to 45 V). Bothpins mustbeconnectedto the samesupply,bypassedwith a F capacitorVMB11 BridgeB powersupplyto GND,and connectedto appropriatebulk GNDwith a F currentset referenceinputReferencevoltagefor windingcurrentset.

5 NormallyAVREFandBVREFare connectedto the be connectedtoBVREF13 IBridgeB currentset = slowdecay,open= mixeddecay,DECAY19 IDecaymodehigh = fast the directionof the step mode- full, 1/2, 1/4, 1/8/MODE125 IMicrostepmode11/16,or 1 No connectLeavethis pin to disabledeviceoutputsand indexeroperation,logicnENBL21 IEnableinputlow to indexerlogicand to enabledevice,logiclow to indexerto moveone whenin fault condition(overtemp,overcurrent)(1)Direct ions:I = input,O = output,OD = open-drainoutput,IO = input/outputCopyright 2010 2014,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback3 ProductFolderLinks.

6 DRV8825 DRV8825 SLVSA73F APRIL2010 Functions(continued)PINEXTERNALCOMPONENT SI/O(1)DESCRIPTIONOR whenat homestateof step tableOUTPUTAOUT15 OBridgeA output1 Connectto AOUT1 AOUT2 AOUT27 OBridgeA output2 BOUT110 OBridgeB output1 Connectto BOUT1 BOUT2 BOUT28 OBridgeB output2 ISENA6I/OBridgeA ground/ IsenseConnectto currentsenseresistorfor ground/ IsenseConnectto currentsenseresistorfor (1)(2)MINMAXUNITP owersupplyvoltage (VMx)Powersupplyramprate1V/ sDigitalpin voltage (xVREF)Inputvoltage voltage(3) ,t < 1 sInternallylimitedAContinuousmotordriveo utputcurrent(4) powerdissipationSeeThermalInformationTJO peratingjunctiontemperaturerange 40150 C(1)StressesbeyondthoselistedunderAbsolu teMaximumRatingsmay causepermanentdamageto the stressratingsonly,and functionaloperationof the deviceat theseor any otherconditionsbeyondthoseindicatedunder RecommendedOperatingConditionsis not absolute-maximum-ratedconditionsfor extendedperiodsmay affectdevicereliability.

7 (2)All voltagevaluesare with respectto networkgroundterminal.(3)Transientsof 1 V for less than25 ns are acceptable(4)Powerdissipationand thermallimitsmustbe 60150 CHumanbodymodel(HBM),per ANSI/ESDA/JEDECJS-001,all pins(1) 20002000 ElectrostaticV(ESD)VdischargeChargeddevi cemodel(CDM),per JEDEC specificationJESD22-C101,all pins(2) 500500(1)JEDEC documentJEP155statesthat 500-VHBM allowssafe manufacturingwith a standardESDcontrolprocess.(2)JEDEC documentJEP157statesthat 250-VCDM allowssafe manufacturingwith a (VMx)Motorpowersupplyvoltagerange(1) (VREF)VREF inputvoltage(2) current01mA(1)All VMpins mustbe connectedto the samesupplyvoltage.

8 (2)Operationalat VREF between0 to 1 V, but accuracyis 2010 2014, APRIL2010 (1)PWPUNIT28 PINSR JAJunction-to-ambientthermalresistance(2 ) JC(top)Junction-to-case(top)thermalresis tance(3) JBJunction-to-boardthermalresistance(4) C/W JTJunction-to-topcharacterizationparamet er(5) JBJunction-to-boardcharacterizationparam eter(6) JC(bot)Junction-to-case(bottom)thermalre sistance(7) (1)For moreinformationabouttraditionaland new thermalmetrics,see theICPackageThermalMetricsapplicationrep ort,SPRA953.(2)The junction-to-ambientthermalresistanceunde rnaturalconvectionis obtainedin a simulationon a JEDEC-standard,high-Kboard,asspecifiedin JESD51-7,in an environmentdescribedin JESD51-2a.

9 (3)The junction-to-case(top)thermalresistanceis obtainedby simulatinga cold platetest on the packagetop. No specificJEDEC-standardtest exists,but a closedescriptioncan be foundin the ANSISEMI standardG30-88.(4)The junction-to-boardthermalresistanceis obtainedby simulatingin an environmentwith a ring cold platefixtureto controlthe PCBtemperature,as describedin JESD51-8.(5)The junction-to-topcharacterizationparameter , JT, estimatesthe junctiontemperatureof a devicein a real systemand is extractedfromthe simulationdatafor obtaining JA, usinga proceduredescribedin JESD51-2a(sections6 and 7).

10 (6)The junction-to-boardcharacterizationparamet er, JB, estimatesthe junctiontemperatureof a devicein a real systemand is extractedfromthe simulationdatafor obtaining JA, usinga proceduredescribedin JESD51-2a(sections6 and 7).(7)The junction-to-case(bottom)thermalresistanc eis obtainedby simulatinga cold platetest on the exposed(power) specificJEDEC standardtest exists,but a closedescriptioncan be foundin the 2010 2014,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback5 ProductFolderLinks: DRV8825 DRV8825 SLVSA73F APRIL2010 40 C to 85 C (unlessotherwisenoted)PARAMETERTESTCONDI TIONSMINTYPMAXUNITPOWERSUPPLIESIVMVM operatingsupplycurrentV(VMx)= 24 V58mAIVMQVM sleepmodesupplycurrentV(VMx)= 24 V1020 AV3P3 OUTREGULATORV3P3V3P3 OUTvoltageIOUT= 0 to 1 currentVIN = 0 2020 AIIHI nputhigh currentVIN = V100 ARPDI nternalpulldownresistance100k nHOME,nFAULTOUTPUTS(OPEN-DRAINOUTPUTS)