Enhanced Products Guide (Rev. A) - TI.com

1 2015 Enhanced Products (EP) GuideAmplifiers and LinearInterfaceData ConvertersPower ManagementProcessor PlatformsLogicHIRELC lass N2 | Enhanced Products Guide 2015 texas InstrumentsEnhanced Products GuideTable of ContentsTable of ContentsIntroductionTI s Enhanced product (EP) line offers design flexibility while still meeting Aerospace, Defense and Industrial stan-dards for operating environments where high reliability and long service life are a requirement. In addition, designers in other rugged operating environments and long service life application fields can benefit from the EP s Enhanced product line is a commercial of-the-shelf (COTS) solution with the following key benefits: Fabrication and assembly controlled baseline No use of Pure Sn bond pads, balls or Cu bond wires DLA Vendor Items Drawings (VID or V62) part numbers that eliminate the need for source controlled drawings Extended product change notification (PCN) Extended temperature performance (typically -55 C to +125 C or customer specified) Standalone data sheet Qualification and Reliability reports Extended HAST testing product traceability Long product life cyclesTI s EP line offers the additional benefit of support from the TI High Reliability Group to offer capabilities that surpass TI s standard catalog offering.

2 Among these capabilities are : Different choice of packages from our TI standard catalog offering Enhanced testing coverage for devicesThe TI HiRel group can work with the customer to understand their require-ments to release EP devices with the features specified s EP Products are warranted to perform to data sheet specifications in environments that require extended temperatures (typically -55 C to +125 C). To ensure that a device exhibits the highest quality and reliability possible for targeted applications, TI performs the following qualification before the device is released: Qualification data is reviewed and audited for accuracy and compliance Reliability and electromigration monitoring is performed at maximum recommended operating conditions in the targeted package Certified test programs and test hardware Electrical characterization is performed across specified temperature range Package performance is confirmed over extended temperatures (some mold compounds are not suitable for extended temperatures)EP versus upscreening:TI s EP portfolio offers an alternative to third party upscreening for design-ers who need higher reliability compo-nents.

3 Although our EP Products receive additional testing and process verifica-tion over and above their commercial counterparts, they may still not be suit-able for all environments, so TI strongly suggests that OEMs qualify devices for their s EP line eliminates the following issues with upscreening: Yield loss and damage caused by electrical overstress and handling Mechanical damage, which causes moisture issues Burn-in, which can cause lead finish degradation Lack of support by IC manufacturers Few upscreening test facilities have the ability to test complex parts No access to TI s wafer processing history by third partiesAdditional value that can be expected from TI s EP line: Qualification summary report Access to leading-edge commercial technology Commitment to the Industrial, Medical, Avionic and Defense markets Customer-driven portfolio Enhanced obsolescence managementIn addition to the active EP Products listed in this Guide and on our website, TI will evaluate the release of other TI s catalog devices in an EP versions based on customer contact TI s product Information Center to discuss your needs.

4 (Contact information on page 32.)2 OverviewFeatured Products3 Motor Drivers4 Digital Signal Processors6 Microcontrollers9 Power ManagementSelection Tables10 Amplifiers and Linear12 Interface13 Data Converters14 Power Management20 Processor Platforms22 Logic30 HIREL31 Class N32 ResourcesSection TitleSection SubtitleTexas instruments Enhanced Products Guide 2015 | 3 Featured ProductsMotor DriversStepper DriversDRV8842-EPDRV8842-EP block diagramKey features Single H-Bridge Current-Control Motor Driver 5-A Maximum Drive Current at 24 V, 25 C Built-In Reference Output Industry-Standard PWM Control Interface Thermally Enhanced Surface Mount Package -55 C to 125 C operationApplications Printers Scanners Office Automation Machines Gaming Machines Factory Automation RoboticsGet more information: DRV8842-EP provides an integrated motor driver solution for printers, scanners, and other automated equipment applications.

5 The device has one H-bridge driver, and is intended to drive one DC motor, one coil of a stepper motor, or other loads. The output driver block consists of N-channel power MOSFETs configured as an H-bridge. The DRV8842-EP can supply up to 5-A peak or RMS output current (with proper heatsinking at 24 V and 25 C).Thermal Shut downOUT1 OUT1 OUT2 OUT2 GNDGNDStep MotorVMVMISEN ISENIN2I0I2I3 VREFVMI nternal Reference& Regs LogicnRESETM otor DriverIN1 nSLEEPVMVM Gate Drive+ + - I1I4 DCMDECAYC harge VMCP1 CP2 VCPHS Gate Drive1M 4 | Enhanced Products Guide 2015 texas InstrumentsSection TitleSection SubtitleFeatured ProductDigital Signal ProcessorsThe SM320C6678 DSP is a highest-performance fixed/floating-point DSP that is based on TI s KeyStone multicore architecture. Incorporating the new and innovative C66x DSP core, this device can run at a core speed of up to 1 GHz.

6 For developers of a broad range of applications, such as mission critical, medical imaging, test and automation, and other applications requiring high performance, TI s SM320C6678 DSP offers 8 GHz cumulative DSP and enables a platform that is power-efficient and easy to use. In addition, it is fully backward compatible with all existing C6000 family fixed and floating point features 8 C66x DSP Core @ 1 GHz GMAC/Core for Fixed Point @ 1 GHz GFLOP/Core for Floating Point @ 1 GHz Network Coprocessor Temperature range -55 C to +115 CApplications Mission-Critical Systems High-Performance Computing Systems Communications Audio Video Infrastructure Imaging Analytics Networking Media Processing Industrial Automation Automation and Process ControlSM320C6678-HIRELM ulticore Fixed and Floating-Point DSPGet more information.

7 Functional block diagram8 Cores @ up to GHzPowerManagementDebug & TraceBoot ROMS emaphoreSRIO4 PCIe2 UARTTSIP2 SPII C2 PacketDMAM ulticore NavigatorQueueManagerGPIO3 PLLEDMA3 EMIF 164 MBMSMSRAM64-BitDDR3 EMIFM emory SubsystemMSMCC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheC66x CorePac32KB L1P-Cache32KB L1D-Cache512KB L2 CacheTeraNetHyperLinkTeraNetNetwork CoprocessorSwitchtenrehtEhctiwSSGMII2 PacketAcceleratorSecurityAcceleratorSM32 0C6678-HIRELT exas instruments Enhanced Products Guide 2015 | 5 Section TitleSection SubtitleFeatured ProductsDigital Signal Processors31621 UCD7242 VINVGGG eneratorVGGDISVGGT hermalSenseTMON22BP3 GND32251826 BST-BBSW-BSW-B121011 PGNDIMON-BFLT-BSRE-BPWM-B8 Testmode302917345 CurrentSenseProcessor2028292719 DriveLogic13 DriverDriverVINBST-ABSW-ASW-A242314 DriverDriverVINVDDLDOIMON-AFLT-ASRE-APWM -ACurrentSenseProcessorDriveLogicVINVINV INVOUT-AVOUT-BShortVIN1516 PGND17 Get more information: functional block diagramDigital Power ControlUCD7242-EPThe UCD7242 is a complete power system ready to drive two independent buck power supplies.

8 High side MOSFETs, low side MOSFETs, drivers, current sensing circuitry and necessary protection functions are all integrated into one monolithic solution to facili-tate minimum size and maximum efficiency. Driver circuits provide high charge and discharge current for the high-side NMOS switch and the low-side NMOS synchronous rectifier in a synchronous buck circuit. The MOSFET gates are driven to + V by an internally regulated VGG supply. The internal VGG regulator can be disabled to permit the user to supply an independent gate drive voltage. This flexibility allows a wide power conversion input voltage range of V to 18 features Fully Integrated Power Switches Wide Input Voltage Range: V to 18 V Up to 10-A Output Current per Channel Switching Frequencies Up to 2 MHz Thermal Protection Temperature range -55 C to +125 CApplications Digitally-Controlled Synchronous-Buck Power Stages High Current Dual-Phase VRM/EVRD Regulators for Desktop, Server, Telecom and Notebook Processors6 | Enhanced Products Guide 2015 texas InstrumentsSection TitleSection SubtitleFeatured ProductsMicrocontrollers (MCU)MSP430 MicrocontrollersMSP430FR5739-EPMSP430FR5 739-EP block diagramKey features Optimized Ultra-Low Power Modes Ultra-Low-Power Ferroelectric RAM (FRAM) Intelligent Digital Peripherals Enhanced Serial Communication Power Management System -55 C to 85 C operationApplications Home Automation Security Data Acquisition Sensor ManagementGet more information.

9 texas instruments MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430 CPU, and different peripherals targeted for various appli-cations. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibil-ity, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit analog-to-digital converter (ADC), a 16-channel comparator with voltage reference generation and hysteresis capabilities, three Enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital System16 KB 8 KB FRAM(FR5739) (FR5735)4 KB(FR5731)1 KB RAMMCLKACLKSMCLKCPUXV2 and Working RegistersEEM (S: 3+1) SBW InterfaceDMA 3 ChannelPower Management SVSSYS WatchdogMPY32TA0 TA1 (2) Timer_A 3 CC RegistersTB0 TB1 TB2 (3) Timer_B 3 CC RegistersADC10_B 200 KSPS 14 channels (12 ext/2 int) 10 BitDVCC DVSSAVCCAVSSRST/NMI/SBWTDIORTC_BComp_D 16 channelsVCOREMAB MDB Ports P1/P2 2 8 I/Os Interrupt & Wakeup PA 1 16 I/Os Ports P3/P4 1 8 I/Os 1x 2 I/Os Interrupt & Wakeup PB 1 10 I/Os eUSCI_A0: UART, IrDA, SPI eUSCI_B0.

10 SPI, I2 CBoot ROMM emory Protection UniteUSCI_A1: UART, IrDA, SPIC lock System16 KB 8 KB FRAM(FR5739) (FR5735)4 KB(FR5731)1 KB RAMMCLKACLKSMCLKCPUXV2 and Working RegistersEEM (S: 3+1) SBW InterfaceDMA 3 ChannelPower Management SVSMPY32TA0 TA1 (2) Timer_A 3 CC RegistersTB0 TB1 TB2 (3) Timer_B 3 CC RegistersADC10_B 200 KSPS 14 channels (12 ext/2 int) 10 BitDVCC DVSSAVCCAVSSRST/NMI/SBWTDIORTC_BComp_D 16 channelsVCOREMAB MDB Ports P1/P2 2 8 I/Os Interrupt & Wakeup PA 1 16 I/Os Ports P3/P4 1 8 I/Os 1x 2 I/Os Interrupt & Wakeup PB 1 10 I/Os eUSCI_A0: UART, IrDA, SPI eUSCI_B0: SPI, I2 CBoot ROMM emory Protection UniteUSCI_A1: UART, IrDA, SPISYS WatchdogTexas instruments Enhanced Products Guide 2015 | 7 Section TitleSection SubtitleFeatured ProductsMicrocontrollers (MCUs)sGet more information: functional block diagramHercules MicrocontrollersTMS570LS3137-EPThe TMS570LS3137-EP device is a high-performance microcontroller family for safety systems.