General Description Features - Diodes

1 STEP-UP DC-DC CONVERTER AP30121 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet General DescriptionThe AP3012 is a high power, constant frequency, cur-rent mode PWM, inductor based, step-up (boost) con-verter. The converter operates at high frequency( ) so that a small, low profile inductor can AP3012 has built-in overvoltage protection (OVP)to allow the device goes into shutdown mode when theoutput voltage exceeds the OVP threshold of AP3012 is available in standard SOT-23-5 High Efficiency up to 81% Adjustable Output Voltage up to 29V Shutdown Current 1 A Typical Switching Frequency 36V 500mA Rugged Integrated Bipolar Switch Built-in Soft-start to Reduce Inrush Current Dur-ing Start-up On-chip overvoltage protection Uses Low ESR Ceramic Output Capacitor Uses Small InductorApplications LCD/OLED Display Bias Supply White LED Driver for LCD Display Backlights Cellular PhonesFigure 1.

2 Package Type of STEP-UP DC-DC CONVERTER AP30122 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet Figure 2. Pin Configuration of AP3012 (Top View)Pin DescriptionPin NumberPin NameFunction1 SWSwitch Pin. Connect inductor/diode here. The output voltage can go up to 29V but should notexceed this limit. If the voltage on this pin is higher than the overvoltage protection (OVP)threshold, the device can go into shutdown mode. It can be restarted by a low to high pulse onthe SHDN pin, or by a power on reset on the VIN supply2 GNDG round Pin. Connect directly to local ground plane 3 FBFeedback Pin. Internally compares to Connect R1 and R2 resistor divider here. Calcu-late the Output Voltage according to the formula: VOUT= * (1+R1/R2)4 SHDNS hutdown Pin.

3 Connect to or higher to enable device (ON), or lower to disabledevice (OFF) 5 VIN Input Supply Pin. Must be locally bypassedPin ConfigurationK Package (SOT-23-5)SW STEP-UP DC-DC CONVERTER AP30123 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet Functional Block Diagram Figure 3. Functional Block Diagram of AP3012 FB SHDN VIN GND SWQ1 STEP-UP DC-DC CONVERTER AP30124 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet Ordering InformationCircuit TypePackageK: SOT-23-5E1: Lead Free AP3012 - TR: Tape and ReelPackageTemperature RangePart Number Marking IDPacking TypeLead FreeGreenLead FreeGreenSOT-23-5 -40 to 85oCAP3012 KTR-E1AP3012 KTR-G1E6BG6 BTape & ReelBCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.

4 Products with"G1" suffix are available in green : STEP-UP DC-DC CONVERTER AP30125 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage tothe device. These are stress ratings only, and functional operation of the device at these or any other conditionsbeyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max-imum Ratings" for extended periods may affect device reliability. ParameterSymbolMinMaxUnitInput TemperatureTOP-4085oCRecommended Operating ConditionsAbsolute Maximum Ratings (Note 1) Parameter SymbolValueUnitInput VoltageVIN20 VSW Voltage 38 VFB Voltage 5 VSHDN Voltage 16 VThermal Resistance (Junction to Atmosphere, no Heat sink) R JA265oC/WOperating Junction Temperature150oCStorage Temperature RangeTSTG-65 to 150oCLead Temperature (Soldering, 10sec)TLEAD260oCESD (Machine Model)250 VESD (Human Body Model) STEP-UP DC-DC CONVERTER AP30126 May 2010 Rev.

5 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet (VIN=3V, VSHDN=3V, TA=25oC, unless otherwise specified.)ParameterSymbolConditionsMinT ypMaxUnitMinimum Operating Operating Volt-age16 VFeedback VoltageVFBVIN=5V, VOUT=24V, IOUT= Pin Bias CurrentVFB= Current ICCVSHDN =VFB=VIN, No Current IQVSHDN =0V, VFB= ASwitching Duty CycleDMAX8590%Switching Current LimitDuty Cycle=80%500mASwitch VCESATVCESATISW=250mA300mVSwitch Leakage CurrentVSW= ASHDN Voltage High (ON) Vo l t a g e L o w ( O F F ) Pin Bias Current55 AOVP Voltage ThresholdVOVP29 VSoft-Start Time550 SThermal Resistance (Junction to Case) Characteristics7 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData STEP-UP DC-DC CONVERTER AP3012 Typical Performance Characteristics Figure 4.

6 Quiescent Current vs. Input Voltage Figure 5. SHDN Pin Bias Current Figure 6. Switching Frequency Figure 7. Feedback Bias Current Current (mA)VIN (V) -50oC 25oC Frequency (MHz)Junction Temperature (oC)-50-250255075100010203040506070 Feedback Bias Current (nA)Junction Temperature (oC)-50-25025507510040801201602002402803 20 SHDN Pin Bias Current ( A)Junction Temperature (oC) SHDN=10V SHDN= SHDN=3V SHDN= Junction Temperaturevs. Junction Temperature vs. Junction STEP-UP DC-DC CONVERTER AP30128 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet Figure 9. Switching Current Limit vs. Duty CycleTypical Performance Characteristics (Continued)Figure 10. Feedback Voltage vs. Junction TemperatureFigure 11. Efficiency vs. Output Current Figure 8.

7 Efficiency vs. Junction Temperature05101520253035404560657075808 5 Efficiency (%)Output Current (mA) VIN= VIN= VIN= VIN= Voltage (V)Junction Temperature (oC)020406080100020040060080010001200 Switching Current Limit (mA)Duty Cycle (%)-50-2502550751005055606570758085 VIN=5 VVOUT=24 VIOUT=30mAEfficiency (%)Junction Temperature (oC)9 May 2010 Rev. 1. 6 BCD Semiconductor Manufacturing LimitedData STEP-UP DC-DC CONVERTER AP3012 Typical ApplicationFigure 12. LCD/OLED Display Bias Driver Typical Circuit Note: VOUT= *(1+R1/R2)= * VIN SWSHDN AP3012 FB GNDVINL110 5 VOFFONC11 FC21 : X5R or X7R DielectricL: SUMIDA CDTH3D14/HPNP-100NC or Equivalent STEP-UP DC-DC CONVERTER AP301210 May 2010 Rev.

8 1. 6 BCD Semiconductor Manufacturing LimitedData Sheet SOT-23-5 Unit: mm(inch)Mechanical ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( )8 0 ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( ) ( )MAX IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for anyparticular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or useof any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights orother rights nor the rights of Wafer FabShanghai SIM-BCD Semiconductor Manufacturing Limited800, Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing LimitedMAIN SITEREGIONAL SALES OFFICES henzhen OfficeShanghai SIM-BCD Semiconductor Manufacturing Co.

9 , Ltd. Shenzhen OfficeAdvanced Analog Circuits (Shanghai) Corporation Shenzhen OfficeRoom E, 5F, Noble Center, , 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan OfficeBCD Semiconductor (Taiwan) Company Limited4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, TaiwanTel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA OfficeBCD Semiconductor Corporation30920 Huntwood Ave. Hayward,CA 94544, : +1-510-324-2988 Fax: +1-510-324-2788- IC Design GroupAdvanced Analog Circuits (Shanghai) Corporation8F, Zone B, 900, Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-cations herein.

10 BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for anyparticular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or useof any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights orother rights nor the rights of Wafer FabShanghai SIM-BCD Semiconductor Manufacturing Co., Yi Shan Road, Shanghai 200233, ChinaTel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITEREGIONAL SALES OFFICES henzhen OfficeShanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen OfficeUnit A Room 1203, Skyworth Bldg., Gaoxin , Nanshan District, Shenzhen,China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan OfficeBCD Semiconductor (Taiwan) Company Limited4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Ta iwanTel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA OfficeBCD Semiconductor Huntwood Ave.