H&S HighTech Corp. - 株式会社 JASP

1 H&S HighTech & & ScienceCompany History1995 Start R&D of ACF & IPDE nter ACF & IPD market1995 Established DSI company name to TELEPHUS20052005 Inauguration of President Jung-HeeKim2007 Specialized in ACFIPD Biz. was acquired by Samsung200720092009 Changed company name to H&S HighTech201120122013 Factory relocation & Expansion20112012M&A ACF Biz. of EXAX Crystal Biz. of KQTM&A ACF Biz. of LG Innotek2013 IPD : Integrated Passive Device 1 / 24 Human & ScienceYantai FactoryElectronics Device divisionSeongnam Office : Sales & AdministrationAddress : 106-2 Imae-Dong,bundang-gu, Name : H&S HighTech : KimEstablishment : Dec,1995 Employees : 150 PersonsMain Products : ACF,Crystal Oscillator, OCRC ompany ProfileAddress : #89 Huanghai Road,Yantai City,Shandong Province, ChinaFactory Area : 3,000 m Clean room : m Headquarter: ACF Division / ED division (R&D,Production,QA)Address : 757-2 Gwanpyeong-Dong, Yuseong-Gu,Daejeon, KoreaTotal Area : 4,500 m Office Area : 1,300 m Factory Area.

2 3,200 m Clean Room : 1,000m (1000 Class)2 / 24 Human & ScienceOrganizationCEOQ ualityAssuranceAdministrationACF / OLB / COG / COF Team2TP / PCB / CMDomesticSalesOverseasSalesProductionAs semblyEquipmentResearch(Sample)Developme ntOCR / 24 Human & Science Human & ScienceCapa. Capa. (P/O ) & & : -5 C~5 C, : -5 C~5 C 6 ( ) : 25 C, 75%RH 3 : 25 C, 75%RH 24 * 30 Telephus ACFACF /ReelFullCapacity(2014)100m/Roll320,000 Roll (32KK m) / Month 7 [ ] 14 [ forwarder]Human & ScienceWhat is the ACF ?

3 Process Human & ScienceLSI or TABG lass or PCBI nsulationConductionAdhesion Conduction Insulation AdhesionHeat, Pressure and TimeSubstrate2 : Glass or PCBS ubstrate1 : FPC or ICACFE lectrode/BumpConductorsManufacturing ProcessACF is a connective material that satisfy 3 functions: ConductiveparticleMixing processResinMixingMixtureCuringAgentResi n&AdditivesCoating ProcessPacking ProcessCoating on SeparatorSlittingSlitting processReelCutting Knife4 / 24 Human & SciencePolymer AgentComposition of ACF -1 BinderParticlesThermoplastic typeThermosetting typeCarbon fiberMetallic powderPolymer (Ni, Au plating)Insulation Additives : Inorganic filler, Antioxidant, Particle, Size = 3~30 (Au/Ni plated polymer beads or Ni particle)Matrix adhesive system(Thermoset & thermoplastic resin mixture)Thickness = 4~50 Release film (PET)ACF5 / 24 Human & ScienceApplicationTouch/OLB/CMPCBCOG/COF Type ofConductorRemarksPlastic:PS, PMMA, etc.

4 3um~30um(Ni:~ :~ Au/Ni`DendritetypeSphericaltypeOr using inorganic fillers with OLB conductorsPlastic BeadNiAu Composition of ACF -26 / 24 Human & ScienceTAB Bonding_Input [TCP / LCD]TouchscreenpanelFOG ProductFOF bonding_[FPCB / PET]PCB Bonding_Output [TCP / PCB]FOG bonding [FPCB / LCD]Camera module [CMOS sensor/TCP]COG bonding [IC / LCD]FPCBFOG ProductACF applicationOLB ProductFingerprint Recognition Sensor [FOB/FOF]7 / 24 Human & ScienceIntroduction to H&S ACFs Human & ScienceNormal cureLow temp. cureLow condition170 C / 13sec or 180 C / 10sec or 190 C / 7secConductor Size20um10um4um20um10um5/4um10/5umModelT OU3020 CPTOU3010 CPTOU8810 JPTSC3140 TYTOU5000YZ1 TOU5010 DYTSC535(4)0seriesTOU_SeriesRemarkApplic able on the Ag(BM coated on the glass), ITOandMetal Product Line Up -TOUCH Film type Glasstype8 / 24 Normal cureAdhesion ImproveFast cureLowTemp.)

5 & Fast cureBonding Condition150~160 C / 10~15sec150~160 C / 10~15secConductor Size20um10um20um10um20um10um20 / 10umModelTGP20520 AGTOU2051 ASTCH8020 MPTCH8010 MPTOU5000 SPTOU5010 SPTOU_SeriesRemarkNormal issue & adhesion withPET. Low pressure bonding ~160 C/5sec130~160 C/10sec120 C/10sec130 C/5sec130~150 C/10sec130~170 C/5sec140~180 C/4sec120~160 C/4secHuman & ScienceH&S Product Line Up FOG&COG FOG COG9 / 24 ItemHigh-temp cureMiddle-temp cureLow-temp cureTCG1031 GYTCG9031 METCG9031 UNUnder developmentBondingcondition190~230 C/5sec150~190 C/5sec135~175 C/5s120~150 CConductor(Size)Insulation coated3 , 4um3 3 3 RemarkConventional Storage.

6 500 2 Normal cureFast cureFast cure &Low temperatureBonding Condition180~190 C / 10sec180~190 C 7sec160~200 C 5~10sec140~180 C / 4secConductor Size10um5um4um4/5um4/5umItemTSC22000 NTSC3050 BPTSC3140 TYTSC5300SM seriesTSC5300 DMseriesRemarkNormal typeHigh .Bonding at fast at fast goodSalt resistance & ScienceModelTGP5010 UBHTSB20522 FTCM5022UZ2 Bonding condition140~200 C, 4 Sec180~200 C, 7 Sec130~180 C, 6 SecConductor(Size)10 8+20 20+8umRemarkWaterproof/ Reliability CameraModuleH&S Product Line Up Camera Module Fingerprint RecognitionModule10 / 24 Epoxy gradeAcryl gradeBonding Condition180~200 C >15 Sec180~200 C 7 Sec180~200 C 7 Sec140~170 C 10 Sec140~170 C 10 Sec130~180 C 6 SecConductor SizeNormal typeSoft typesoft + hardSoft type10 10 8+20 10 15 20 ItemTSB21000 SDTSB21001F TSB20522 FTCM5010 UZTCM5015UZ3 TCM5000UZ2 RemarkNormal cure & goo protect electrical open, used the mixed ball.

7 (metal +polymer)Low & Science PCB OLBH&S Product Line UP PCB&OLB11 / 24 ModelHigh cureLow cureTGP20505 NEMA8888E TGP5552 UBHTGP5552 UATGP5552US3 BondingCondition180 ~ 200 C/ 8sec130 ~ 190 C/ 4sec140 ~ 200 C/ 4sec150 ~ 220 C/ 4sec130 ~ 200 C/ 4secConductor(size)Ni ball5 3 5 RemarkEpoxy flow & Press Temp. (300~700 )pitch adhesion condition150~200 C/4sec170( 20) C / 4~10sec130~180 C/4secConductor(Size)3um3um3/4umRemarkFi ne pitch 1layer (ACF)Good Adhesion2layer (ACF/NCF)Fine pitch, Low-Temp. & Fast (ACF/NCF)Human & ScienceH&S / 12 / 24 / Flexible ACF Bonding Just In Time 1W, 2 Just In Time ACF Bondingsolution VOC ISSUE, Line Tool SMT ACF C S , Application Flexible PET COP I / D Human & ScienceTest/Process condition Guidefor Touch PanelHuman & ScienceEvaluation System _ Pressure.

8 Temperature, Time-> Before Pre-bondingTemperature conditionPressure conditionIn case of target pressure 3 MPa( 30kgf/cm2) x 3cm = 30kgf/cm2= pressure device is set up so that the pressure of may be applied3cm FilmCushion bandHeat toolFPCACF 90% of target bonding temperature shouldbe reached within 3 sec in case of 7sec bondingthermocoupleRKC ST-50 ACF width13 / 24 Human & ScienceChecking Flatness of Bonding Tool -> Before Pre-bondingPIPressure sensitive paper Left/Right -balance NGForward/rear -balanceNGTool balance OK-. A tool tip have to manage balance and surface of tip, because it might be caused bubble and uneven conductor tip -roughness NG14 / 24 Human & Science[ Proper pre-bonding pressure ][ Excessive pre-bonding pressure ]Base filmACFPET(TSP)ACFPET(TSP)Base film About pre-bonding pressureThe pre-bonding pressure and the temperature should be as low as possible since the purpose of pre-bonding isonly for attaching ACF on the image shows the failure case due to excessive pre-bonding pressure.

9 The ACF thickness is decreased due to severe resin overflow out of the base film. It would cause the lack of resin filling on the electrode & space,and would increase the possibility of bubble occurrence in the conditionACFPET(TSP)FPCCuCuVoid[Bubble-f ormation on the space due do the excessive pre-bonding pressure]15 / 24 Human & ScienceMain reasonFailure factorExample Resin Overflow Excessive bonding temp. Excessive bonding pressure Low viscosity of ACF resin If bubble shape do not change duringthe reliability, it has no problem withthe product cure ratio Insufficient bonding temperature Slow cure speed of ACF Increasecontact resistance during reliabilityDelamination from substrates Excessive bonding pressure Low adhesion with substrate Reliability condition Increasecontact resistance or reducethe adhesion during reliabilityBubble formation After Main Bonding16 / 24 Human & ScienceHow todefine a Proper Bonding ?

10 Bonding temperature If bonding temperature is too high, it might be thermal damage such as delamination between PET and silver electrode. If bonding temperature is insufficient, it might be bubbles in space or on electrode. Bonding pressure(conductor deformation)1. Before peel-off, method to observe through transparent PET or miss-aligned electrode. This method cannot observe through unclear substrates such as DPW(direct patterning window) to be coated black After peel-off, method to observe conductor deformation in ACF residue on the electrode. Crushed ball size is smaller than ball size before peel-off , because of conductor s restoration electrodeSilver electrodePETLow(Insufficient) high pressureDelaminating between PET film andSilver paste electrode in case of high temperature AG Damage AG Crack Delamination 17 / 24 Human & ScienceAB-202468101214161820406080100120 140160 Temperature ( C)Time (sec) B position A positionB positionA ~18 CTemp.