Handling, Packing, Shipping and Use of …

1 IPC/JEDEC Amendment 1 Handling, Packing, Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesA joint standard developed by the JEDEC Committee onReliability Test Methods for Packaged devices and the B-10a PlasticChip Carrier Cracking Task Group of IPCU sers of this standard are encouraged to participate in thedevelopment of future :JEDEC2500 Wilson BoulevardArlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7583 IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel (847) 615-7100 Fax (847) 615-7105 Supersedes:IPC/JEDEC J-STD-033B -October 2005 IPC/JEDEC J-STD-033A -July 2002 IPC/JEDEC J-STD-033 -April 1999 JEDEC JEP124 IPC-SM-786A - January 1995 IPC-SM-786 - December 1990 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of.

2 Packages .. Processes .. Mass Reflow .. Localized Heating .. Socketed Components .. Point-to-Point Soldering .. and Definitions .. Active Desiccant .. Bar Code Label .. Bulk Reflow .. Carrier .. Desiccant .. Floor Life .. Humidity Indicator Card (HIC) .. Manufacturer s Exposure Time (MET) .. moisture Barrier Bag (MBB) .. Rework .. Shelf Life .. SMD .. Solder Reflow .. Water Vapor Transmission Rate (WVTR) .. 22 APPLICABLE Society for Testing and Materials(ASTM) .. Industries Alliance (EIA, JEDEC) .. Standards .. Industry Standards .. of Defense.

3 33 DRY .. of SMD Packages and CarrierMaterials Before Being Sealed in MBBs .. Requirements - Levels 2a - 5a .. Requirements - Carrier Materials .. Requirements - Other .. Time Between Bake and Bag .. Pack .. Labels .. moisture Barrier Bag Sealing .. Shelf Life .. Exposure to Factory Ambient .. Any Duration Exposure .. Short Duration Exposure .. Considerations for Baking .. High Temperature Carriers .. Low Temperature Carriers .. Paper and Plastic Container Items .. Bakeout Times .. ESD Protection .. Reuse of Carriers .. Solderability Limitations .. Bag Inspection.

4 Upon Receipt .. Component Inspection .. Life .. Storage .. Dry Pack .. Life .. Atmosphere Cabinet .. MBB .. Temperature Extremes .. Thermal Profile Parameters .. Reflow Passes .. Reflow Passes .. Indicators .. Humidity in the Dry Pack .. Floor Life or Ambient Temperature/Humidity Exceeded .. 6 SMD Packages .. 126 BOARD Removal, Rework and Remount .. for Failure Analysis .. and Remount .. of Populated Boards .. 127 DERATING DUE TO FACTORYENVIRONMENTAL 12 January 2007 IPC/JEDEC - Includes Amendment 1vAppendix ATest Method for Humidity IndicatorCard used with ElectronicComponent 14 Appendix BDerivation of Bake 15 Appendix CAmendment1-Differences and 15 FiguresFigure 3-1 Typical Dry Pack Configuration for moisture - sensitive SMD Packages in Shipping Tubes.

5 4 Figure 3-2 Example Humidity Indicator Card .. 5 Figure 3-3 moisture - sensitive Identification Label(Example) .. 6 Figure 3-4 moisture - sensitive Caution Label (Example) .. 7 Figure A-1 Photo of Testing Apparatus .. 14 TablesTable 3-1 Dry Packing Requirements .. 3 Table 3-2 Typical HIC Spot Compliance .. 6 Table 4-1 Reference Conditions for Drying Mountedor Unmounted SMD Packages .. 8 Table 4-2 Default Baking Times Used Priorto Dry-Pack that were Exposedto Conditions 60% RH(Supplier Bake: MET = 24 h) .. 9 Table 4-3 Resetting or Pausing the Floor Life Clockat User Site .. 9 Table 5-1 moisture Classification Level and Floor Life.

6 10 Table 7-1 Recommended Equivalent Total Floor Life(days) @ 20 C, 25 C & 30 C, 35 C For ICswith Novolac, Biphenyl and MultifunctionalEpoxies .. 13 IPC/JEDEC - Includes Amendment 1 January 2007viHandling, Packing, Shipping and Use of moisture /Reflow sensitive Surface mount Devices1 FOREWORDThe advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding packagedamage cracks and delamination from the solder reflow process. This document describes the standardized levels of floorlife exposure for moisture /reflow- sensitive SMD packages along with the handling, packing and Shipping requirements nec-essary to avoid moisture /reflow-related failures.

7 Companion documents J-STD-020 and JEP113 define the classification pro-cedure and the labeling requirements, from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solderSMD packages to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 C. Duringsolder reflow, the combination of rapid moisture expansion, materials mismatch, and material interface degradation can resultin package cracking and/or delamination of critical interfaces within the solder reflow processes of concern are convection, convection/IR, infrared (IR), vapor phase (VPR) and hot air reworktools.

8 The use of assembly processes that immerse the component body in molten solder are not recommended for mostSMD PurposeThe purpose of this document is to provide SMD manufacturers and users with standardized methods forhandling, packing, Shipping , and use of moisture /reflow sensitive SMD packages that have been classified to the levelsdefined in J-STD-020. These methods are provided to avoid damage from moisture absorption and exposure to solder reflowtemperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow canbe achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags of 12 months fromthe seal NonhermeticThis standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processesduring PCB assembly, including plastic encapsulated packages and all other packages made with moisture -permeable poly-meric materials (epoxies, silicones, etc.)

9 That are exposed to the ambient HermeticHermetic SMD packages are not moisture sensitive and do not require moisture precautionary Assembly Mass ReflowThis standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR), andvapor phase (VPR) processes. It does not apply to bulk solder reflow processes that immerse the component bodies in mol-ten solder ( , wave soldering bottom mounted components). Such processes are not allowed for many SMDs and are notcovered by the component qualifications standards used as a basis for this Localized HeatingThis standard also applies to moisture sensitive SMD packages that are removed or attached sin-gly by local ambient heating, , hot air rework.

10 See Clause Socketed ComponentsThis standard does not apply to SMD packages that are socketed and not exposed to solderreflow temperatures. Such SMD packages are not at risk and do not require moisture precautionary Point-to-Point SolderingThis standard does not apply to SMD packages in which only the leads are heated toreflow the solder, , hand-soldering, hot bar attach of gull wing leads, and through hole by wave soldering. The heatabsorbed by the package body from such operations is typically much lower than for bulk surface mount reflow or hot airrework, and moisture precautionary measures are typically not 2007 IPC/JEDEC - Includes Amendment 11