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Highly Scalable TI DLP Technology for 3D Machine …

Highly Scalable TI DLP Technology for 3D Machine vision Get more speed and accuracy with structured light using TI DLP technology3D Machine vision is a fast and accurate optical technique used to capture physical measurements of an object. With the digitized 3D scan data, the dimensions of any object including surface area, volume, and feature size can be extracted. Structured light is an optical method of 3D scanning where a series of patterns are projected upon an object and a camera or sensor detects distortions of the patterns. Image processing and triangulation algorithms then convert these distortions into a 3D point cloud. The point cloud can be used directly for analysis of the object or easily exported to a variety of CAD modeling formats. TI DLP Technology enables programmable structured light solutions for portable and high resolution applications. DLP systems can produce non-contact, Highly accurate 3D data in real-time, facilitating 3D Machine and benefits Fast, programmable pattern rates up to 32 kHz Acquire 3D scan data in real-time on moving objects Optimize scan speed and accuracy for multiple objects and environments using adaptive pattern sets Precise depth capture Achieve measurement accuracy to m level Digital switching using reflective, reliable MEMS micromirrors Minimal sensitivity to color, distance, movement and environment improves

Highly Scalable TI DLP® Technology for 3D Machine Vision Get more speed and accuracy with structured light using TI DLP® technology 3D machine vision is …

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Transcription of Highly Scalable TI DLP Technology for 3D Machine …

1 Highly Scalable TI DLP Technology for 3D Machine vision Get more speed and accuracy with structured light using TI DLP technology3D Machine vision is a fast and accurate optical technique used to capture physical measurements of an object. With the digitized 3D scan data, the dimensions of any object including surface area, volume, and feature size can be extracted. Structured light is an optical method of 3D scanning where a series of patterns are projected upon an object and a camera or sensor detects distortions of the patterns. Image processing and triangulation algorithms then convert these distortions into a 3D point cloud. The point cloud can be used directly for analysis of the object or easily exported to a variety of CAD modeling formats. TI DLP Technology enables programmable structured light solutions for portable and high resolution applications. DLP systems can produce non-contact, Highly accurate 3D data in real-time, facilitating 3D Machine and benefits Fast, programmable pattern rates up to 32 kHz Acquire 3D scan data in real-time on moving objects Optimize scan speed and accuracy for multiple objects and environments using adaptive pattern sets Precise depth capture Achieve measurement accuracy to m level Digital switching using reflective, reliable MEMS micromirrors Minimal sensitivity to color, distance, movement and environment improves performance over time and temperature Active illumination with LEDs, lasers, or lamps Multiple wavelengths for scanning a wide range of materials Enables strong low light performanceDLP solutions for 3D Machine visionDLP chipsets are available with different DMD (Digital Micromirror Device)

2 Sizes, pixel pitches, resolutions, and wavelength range, The best choice for a DLP chipset may depend on the desired object feature size, patterning speed and system form factor. Smaller DMDs offer more compact system designs while high PartsEvaluation ModulesAccelerate your design cycle by evaluating DLP Technology with a broad selection of evaluation modules (EVMs). Our portfolio of EVMs offer a compelling combination of resolution, brightness, pattern speed, and programmability of DLP Technology . TI provides free software and firmware downloads allowing developers to easily create, store, and display high-speed pattern sequences through USB-based application programming interface (API) and easy-to-use graphical user interface (GUI). Visit for more ResolutionHigh SpeedDLP3000 DLP4500 DLP4500 NIRDLP5500 DLP6500 FYEDLP6500 FLQDLP9000 DLP7000 DLP9500triangulation baseExample applicationsFactory AutomationIndustrial RoboticsMedical ImagingDental ScanningIndustrial MetrologyBiometricsVisit for more SensingandFan ControlFanLEDD riversNIRRGGI lluminatorObjectPattern Data3D & MachineVision SoftwareRobotic ControlSoftwarePC or EmbeddedProcessorConfigEPROMYZXM otionControlMVHead(DMD & Camera)ObjectRobotMemoryDLPC ontrollerChipSYNCF rame DataReset(ActivateMirrors)Digital MicromirrorDeviceLensCameraShutterTrigge rVideoDataDMDL ogicSystem Block Diagram The DLP solution for 3D Machine vision is shown in the diagram.

3 DLP Technology enables 3D Machine vision capabilities by providing single or multiple camera 3D image capture. The system utilizes a DMD as a spatial light modulator and a DMD Controller to provide high-speed control of the micromirrors. TI LED drivers provide illumination for the DMD to project the image. From power management to embedded processors to support the system, TI s vast portfolio provides a complete system solution to create your ideal 3D Machine vision point cloud generationTo enable customers to get to market faster, Texas Instruments also provides a TI Design for 3D Machine vision applications. A TI Design is a comprehensive reference design that includes schematics, block diagrams, bill of materials, design files, software, and test reports. The 3D Machine vision reference design encompasses Texas Instruments DLP structured light Software Development Kit (SDK). This design empowers developers with a framework to construct accurate 3D point clouds quickly by integrating TI s DMD in structured light solutions with cameras, sensors, motors or other peripherals.

4 Get started at chipsets for 3D Machine visionDMD NumberMicromirror ArrayArray DiagonalControllerMicromirror DriverMax Pattern RateOptimized WavelengthsPixel PitchPixel OrientationEVMDMD Package Dimensions (lxwxh)DMD 100u Price ($ )Controller 100u Price ($ )Micromirror Driver100u Price ($ )DLP3000608 x DLPC300 4,000 Hz (binary)420-700 x 7 x mm9516 DLP4500912 x DLPC350 4,225 Hz (binary)420-700 mDiamondLightCrafter x x mm14356 DLP4500 NIR912 x DLPC350 4,225 Hz (binary)700 - 2500 x x mm31556 DLP55001024 x DLPC200 DLPA2005,000 Hz (binary)420-700 mOrthogonal x x x DLPC900 9,500 Hz (binary)420-700 mOrthogonalLightCrafter650032 x 32 mm588160 DLP6500 FLQ1920 x DLPC900 9,500 Hz (binary)400-700 mOrthogonal 32 x 41 mm1,137160 DLP70001024 x DLPC410 DLPA20032,552 Hz (binary)400-700 mOrthogonalDiscovery x x x DLPC900 9,500 Hz (binary)400-700 x x 7 mm2,783160 DLP95001920 x DLPC410 DLPA20023,148 Hz (binary)400-700 mOrthogonalDiscovery x x 7 mm2, 2015 Texas Instruments Incorporated.

5 DLP is a registered trademark of Texas Instruments. NIRscan and the platform bar are trademarks of Texas Instruments. DLPT021 CIMPORTANTNOTICET exasInstrumentsIncorporatedand its subsidiaries(TI) reservethe rightto makecorrections,enhancements,improvement sand otherchangesto its semiconductorproductsand servicesper JESD46,latestissue,and to discontinueany productor serviceper JESD48, latestrelevantinformationbeforeplacingor dersand shouldverifythat suchinformationis semiconductorproducts(alsoreferredto hereinas components ) are sold subjectto TI s termsand conditionsof salesuppliedat the time of warrantsperformanceof its componentsto the specificationsapplicableat the time of sale,in accordancewith the warrantyin TI s termsand conditionsof sale of otherqualitycontroltechniquesare usedto the extentTI deemsnecessaryto supportthis applicablelaw, testingof all parametersof eachcomponentis not assumesno liabilityfor applicationsassistanceor the designof Buyers responsiblefor theirproductsandapplicationsusingTI minimizethe risksassociatedwith Buyers productsand applications,Buyersshouldprovideadequate designand doesnot warrantor representthat any license,eitherexpressor implied,is grantedunderany patentright,copyright,maskworkright,orot herintellectualpropertyrightrelatingto any combination, Machine .

6 Or processin whichTI componentsor servicesare TI regardingthird-partyproductsor servicesdoesnot constitutea licenseto use suchproductsor servicesor a of suchinformationmay requirea licensefroma thirdpartyunderthe patentsor otherintellectualpropertyof thethirdparty,or a licensefromTI underthe patentsor otherintellectualpropertyof significantportionsof TI informationin TI databooksor datasheetsis permissibleonly if reproductionis withoutalterationand is accompaniedby all associatedwarranties,conditions,limitati ons,and is not responsibleor liablefor thirdpartiesmay be subjectto TI componentsor serviceswith statementsdifferentfromor beyondthe parametersstatedby TI for that componentor servicevoidsall expressand any impliedwarrantiesfor the associatedTI componentor serviceand is an unfairand is not responsibleor liablefor any agreesthat it is solelyresponsiblefor compliancewith all legal,regulatoryand safety-relatedrequirementsconcerningits products,and any use of TI componentsin its applications,notwithstandingany applications-relatedinformationor supportthat may be providedby TI.

7 Buyerrepresentsand agreesthat it has all the necessaryexpertiseto createand implementsafeguardswhichanticipatedanger ousconsequencesof failures,monitorfailuresand theirconsequences,lessenthe likelihoodof failuresthat mightcauseharmand take fully indemnifyTI and its representativesagainstany damagesarisingout of the useof any TI componentsin somecases,TI componentsmay be promotedspecificallyto ,TI s goal is tohelp enablecustomersto designand createtheirown end-productsolutionsthat ,suchcomponentsare subjectto TI componentsare authorizedfor use in FDAC lassIII (or similarlife-criticalmedicalequipment)unl essauthorizedofficersof the partieshaveexecuteda componentswhichTI has specificallydesignatedas militarygradeor enhancedplastic are designedand intendedfor use inmilitary/aerospaceapplicationsor agreesthat any militaryor aerospaceuse of TI componentswhichhavenotbeenso designatedis solelyat the Buyer's risk, and that Buyeris solelyresponsiblefor compliancewith all legalandregulatoryrequirementsin connectionwith has specificallydesignatedcertaincomponentsa s meetingISO/TS16949requirements,mainlyfor automotiveuse.

8 In any caseof use ofnon-designatedproducts,TI will not be responsiblefor any failureto ,Avionicsand :TexasInstruments,PostOfficeBox 655303,Dallas,Texas75265 Copyright 2016,TexasInstrumentsIncorporat


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