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JEDEC PUBLICATION 95 - Texas Instruments

JEDECP ublication95 MicroelectronicPackageStandard1999 ApplicationReportPrinted in 1 JEDEC PUBLICATION 95 Microelectronic Package StandardSZZA006 January 1999 2 IMPORTANT NOTICET exas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of warrants performance of its semiconductor products to the specifications applicable at thetime of sale in accordance with TI s standard warranty. Testing and other quality controltechniques are utilized to the extent TI deems necessary to support this warranty.

2 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest

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Transcription of JEDEC PUBLICATION 95 - Texas Instruments

1 JEDECP ublication95 MicroelectronicPackageStandard1999 ApplicationReportPrinted in 1 JEDEC PUBLICATION 95 Microelectronic Package StandardSZZA006 January 1999 2 IMPORTANT NOTICET exas Instruments and its subsidiaries (TI) reserve the right to make changes to their productsor to discontinue any product or service without notice, and advise customers to obtain the latestversion of relevant information to verify, before placing orders, that information being relied onis current and complete. All products are sold subject to the terms and conditions of sale suppliedat the time of order acknowledgement, including those pertaining to warranty, patentinfringement, and limitation of warrants performance of its semiconductor products to the specifications applicable at thetime of sale in accordance with TI s standard warranty. Testing and other quality controltechniques are utilized to the extent TI deems necessary to support this warranty.

2 Specific testingof all parameters of each device is not necessarily performed, except those mandated bygovernment APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVEPOTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY ORENVIRONMENTAL DAMAGE ( CRITICAL APPLICATIONS ). TI SEMICONDUCTORPRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FORUSE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLYAT THE CUSTOMER S order to minimize risks associated with the customer s applications, adequate design andoperating safeguards must be provided by the customer to minimize inherent or assumes no liability for applications assistance or customer product design. TI does notwarrant or represent that any license, either express or implied, is granted under any patent right,copyright, mask work right, or other intellectual property right of TI covering or relating to anycombination, machine, or process in which such semiconductor products or services might beor are used.

3 TI s PUBLICATION of information regarding any third party s products or services doesnot constitute TI s approval, warranty or endorsement 1999, Texas Instruments IncorporatediiiContentsTitlePageAbstract 1.. What Is EIA/ JEDEC ?1.. What Is PUBLICATION 95?3.. Purpose3.. Registered Outlines vs Standard Outlines3.. How Are Documents Controlled?4.. How Are Changes Made?5.. Does Our Package Outline Conform to JEDEC ?5.. What Is Contained in PUBLICATION 95?5.. Contents5.. Requirements for Document Registration5.. Definitions and Symbology5.. Various Registered-Outline Types6.. Various Standard-Outline Types6.. How to Access PUBLICATION 95 on the Web6.. How to Find a Registration or Standard Number7.. Option 17.. Option 28.. Option 38.. Option 49.. Option 59.. Search Procedure9.. Guides for Designers11.. Summary11.. Glossary13.. Acknowledgment13.. Bibliography13.. Appendix A14.. ivList of IllustrationsFigureTitlePage1 EIA Web Page1.

4 2 JEDEC Web Page2.. 3 Access to PUBLICATION 953.. 4 PUBLICATION 95 Web Page4.. 5 PUBLICATION 95 Web-Page Extension4.. 6 Master Index7.. 7 Other Sections (Design Guides)8.. 8 Standard Practices and Procedures (SPP)8.. 9 Microelectronic Outlines (MO)9.. 10 Index of MOs by Family10.. 11 Listing of Ball Grid Array Registrations10.. A 1 Example of a Registered-Outline Drawing Top Sheet14.. A 2 Example of a Standard-Outline Drawing Top Sheet15.. A 3 Example of a Carrier Registered-Outline Drawing Top Sheet16.. A 4 Example of a Diode Registered-Outline (DO) Drawing Top Sheet17.. 1 AbstractMany electronics companies have joined the Joint Electron Device Engineering Council ( JEDEC ) and the JC-11 Mechanical(Package Outline) Standardization committee to gain further understanding of industry package standards and to register theirproduct lines. As a member of JC-11, the company receives a hardcopy of PUBLICATION 95 that generally is in the custody ofthe committee member.

5 The PUBLICATION is updated and maintained by the member or the alternate. The JC-11 member, oralternate, often is contacted for information, a drawing copy, or instructions for registering a package with provides free access to PUBLICATION 95 on the JEDEC web page. This document is intended to familiarize the readerwith the JC-11 procedures, requirements for registration, and how to locate and use PUBLICATION 95. The available informationis useful to packaging engineers, component engineers, product engineers, end users, designers, and marketing Is EIA/ JEDEC ?EIA is the Electronic Industries Alliance (formerly the Electronic Industries Association), which provides many services andbenefits to the electronics industry. EIA is the umbrella organization for many standardization activities and committees, oneof which is JEDEC . The EIA web-page address is (see Figure 1) . JEDEC can be accessed from this page byselecting JEDEC Solid-State Products Electronics Technology 1.

6 EIA Web PageJEDEC became a full division of the EIA in January 1998 and now controls its own budget and operation. JEDEC has beenserving the industry for many decades in standardization efforts in the areas of test methods, nomenclature, packaging, andproduct characterization. JEDEC is governed by a board of directors composed of representatives of various membercompanies. JEDEC , with its many committees, is the engineering standardization body for solid-state products in the UnitedStates, with membership of more then 300 companies. The JEDEC web-page address is (see Figure 2). 2 Figure 2. JEDEC Web PageThe JEDEC Committee Roster can be found on the JEDEC web page (Figure 2) by accessing Committee Roster, under theJEDEC seal. This roster provides information on the JEDEC office staff and the various JEDEC committees and chairs, withtheir company committees within JEDEC are:JC10 Terms, Definitions, and SymbolsJC-11 Mechanical (Package Outline) StandardizationJC-13 Government LiaisonJC-14 Quality and Reliability of Solid-State ProductsJC-15 Electrical and Thermal Characterization Techniques for Electronic Packages and InterconnectsJC-16 Electrical Interface and Power-Supply Standards for Electronic ComponentsJC-17 Microelectromechanical Systems (MEMS)JC-22 Diodes and ThyristorsJC-25 TransistorsJC-40 Standardization of Digital LogicJC-41 Linear Integrated CircuitsJC-42 Solid-State MemoriesJC-44 Semicustom Integrated CircuitsThis document provides insight into the JC-11 Package Outline committee and PUBLICATION No.

7 95. The JC-11 committee meetsfour times a year. Due to the size of the committee, attendance is restricted to company members and alternates, or by invitationand approval of the committee Is PUBLICATION 95?PurposePublication 95 (Pub-95, JEP95), JEDEC Registered and Standard Outlines for Solid State and Related Products, is one of manydocuments published by EIA/ JEDEC . Pub-95 documents several-hundred Registered Outlines, Standard Outlines, and variousDesign Guides endorsed by JC-11, Mechanical (Package Outline) Standardization. The PUBLICATION has grown to threeloose-leaf binders, which are divided into sections for easier use. The first few sections provide general information and thelatter sections contain the various Registration and Standard documents. Pub-95 can be accessed from the JEDEC web page(see Figure 2) by selecting Free Standards, located just to the left of the JEDEC seal.

8 The screen shown in Figure 3 is this screen, scroll down and select PUBLICATION 3. Access to PUBLICATION 95 The resulting screen (Figures 4 and 5) is the web page for PUBLICATION Outlines vs Standard OutlinesRegistered- and Standard-Outline drawings look identical, except for the outline number and the statement above the page 1title Registered Outline has the following statement at the bottom of page 1 of the drawing:This Registered Outline has been prepared by the JEDEC JC-11 committee and reflects a product withanticipated usage in the electronics industry; changes are likely to Appendix A, Figure A 1 for an example. Note the MO number near the lower right Standard Outline has the following statement on page 1 of the drawing:This Standard Outline has been prepared by the JEDEC JC-11 committee and approved by the JEDEC Counciland reflects a product with wide acceptance in the electronics industry; changes are not likely to Appendix A, Figure A 2 for an example.

9 Note the MS number near the lower right corner. 4 How Are Documents Controlled?The JC-11 committee approves all additions or changes to Pub-95. Changes to Standards, or new Standards, also must havethe JEDEC Board of Directors approval. Once approved, a change is forwarded to the JEDEC office in Arlington, Virginia,and the update is made to Pub-95. In 1997, Pub-95 was placed on the JEDEC web page (see Figures 4 and 5).Figure 4. PUBLICATION 95 Web PageFigure 5. PUBLICATION 95 Web-Page Extension5 How Are Changes Made?Any JC-11 member company can propose a new Registration or Registration change. All proposals approved for ballot musthave a two-thirds affirmative vote before being published. Organizations within a company should contact their JC-11 memberfor needed changes or registrations. If a company listing of committee members is not available, contact the company JEDEC board Standard (a Registration that is being elevated to a Standard) process includes the same JC-11 committee ballot approvaland, in addition, must have unanimous JEDEC board approval to be Our Package Outline Conform to JEDEC ?

10 One of the first questions asked is, Does our package conform to JEDEC ? Checking for JEDEC conformance is a manualprocess of finding potential similar Registrations or Standards and performing a dimensional comparison Is Contained in PUBLICATION 95?ContentsInformation in Pub-95 is useful to package designers, component engineers, product engineers, designers, and marketingpersonnel. The question that frequently is asked is, Does our package meet or conform to JEDEC ? Package designers areconcerned that new design concepts conform to the JEDEC Design is divided into sections for easier reference; each section has a table of contents. The Master Index provides an overviewof the entire document. The sections are: Guide for Outline Preparation Symbol List, Terminal Positions (drawings now conform to ASME ) Outline Classifications JEDEC Std 95-1: Standard Practices & Procedures.


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