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새로운 수직형 멤스 프로브 - koreatest.or.kr

1 Manuscript form of the Korea Test Conference Abstract We have designed and fabricated a novel vertical MEMS probe card, named GigaprobeTM, for multiple wafer testing of the fine pitch and high speed devices. The GigaprobeTM consists of probe pins and MEMS guides, in which simple etching and assemble process involved compared to the conventional MEMS probe cards. Due to its simple fabrication and structural merits, it can be applied to effective production level wafer testing of various types of modern semiconductor devices ranged from high speed memory to Soc. Keywords: probe card, vertical, MEMS, guide, fine pitch, high speed I. , , Cantilever Needle [1][2]. MEMS.

1 Manuscript form of the Korea Test Conference Abstract We have designed and fabricated a novel vertical MEMS probe card, named GigaprobeTM, for multiple wafer testing

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Transcription of 새로운 수직형 멤스 프로브 - koreatest.or.kr

1 1 Manuscript form of the Korea Test Conference Abstract We have designed and fabricated a novel vertical MEMS probe card, named GigaprobeTM, for multiple wafer testing of the fine pitch and high speed devices. The GigaprobeTM consists of probe pins and MEMS guides, in which simple etching and assemble process involved compared to the conventional MEMS probe cards. Due to its simple fabrication and structural merits, it can be applied to effective production level wafer testing of various types of modern semiconductor devices ranged from high speed memory to Soc. Keywords: probe card, vertical, MEMS, guide, fine pitch, high speed I. , , Cantilever Needle [1][2]. MEMS.

2 Cobra . (Area) , . MEMS Cantilever .. , 70um , Area (Peripheral) . MEMS . GigaprobeTM . II. GigaprobeTM MEMS . 1 MEMS . 1. MEMS 2. MEMS GigaprobeTM Novel Vertical MEMS Probe Card for High Speed Devices 1, 2, 2 ,. 2, 2, 2, ,2 1, 1 1 ( ) , 2 System LSI : 031-233-7325, E mail : 1 MEMS , , 2.

3 1. GigaprobeTM MEMS MEMS , LOC(Line on center) Area Peripheral . , 5 MEMS 2 Staggered . MEMS 3D , GigaprobeTM 2D . GigaprobeTM MEMS MEMS . MEMS , Multi-para . 3. Cantilever Needle GigaprobeTM GigaprobeTM 10 GHz . 3 Cantilever Needle GigaprobeTM.

4 Cantilever Needle 1dB Bandwidth 150 MHz , GigaprobeTM 2 GHz High-Speed Test . 1 . 1. 2. SoC 2 GigaprobeTM . SoC 60um 213 Peripheral . 4x1 MEMS 8x2 . 3. GigaprobeTM , 4-para Cantilever Needle . wafer . 4 wafer Cantilever Needle GigaprobeTM BIST SCAN Shmoo . 4 , GigaprobeTM BIST SCAN Shmoo Cantilever Needle . 5 wafer Cantilever Needle 3 Manuscript form of the Korea Test Conference GigaprobeTM.

5 5 GigaprobeTM Cantilever Needle 4% . Open Fail Analog Fail . Analog Cleaning . GigaprobeTM Cleaning Cantilever Needle , Cleaning Film Gel Type Cleaning Motion Z Up-Down XY Octagonal . XY-Octagonal Motion , Cleaning Analog Loss . Open Fail Loss Pin Alignment . 4. Cantilever Needle GigaprobeTM BIST SCAN Shmoo 5. wafer Cantilever Needle GigaprobeTM Test . III. Future Works MEMS MEMS , SoC.

6 4-para Cantilever Needle BIST SCAN Shmoo . 4% Cleaning Pin Alignment . 2 Cantilever Needle 16-para GigaprobeTM . Cantilever Needle . Reference [1] , , , (1 -38-117), 2006 12 [2] W. Mann, F. Taber, P. Seitzer, and J. Broz, The leading edge of production wafer probe test technology, ITC International Test Conference, pp. 1168-1195, June 2004.