Example: quiz answers
Package Details SOIC-8 Case - Central Semi
Package Details SOIC-8 Case Mechanical Drawing Mounting Pad Geometry(Dimensions in mm) Lead Code: Reference individual device datasheet. Part Marking: 4-5 Character Alpha/Numeric Code. www.centralsemi.com R0 (27-March 2013) Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm)
Tags:
Information
Domain:
Source:
Link to this page:
Documents from same domain
Package Details - Central Semi
www.centralsemi.comPackage Details DO-41 Case Mechanical Drawing Packing Options Lead Code: Cathode Band Bulk: White corrugated box with static shielded bags Bulk Packing Quantity: 2,000 Tape and Reel: Axial taped and reeled in accordance with EIA-296-E Tape and Reel Packing Quantity: 5,000.
Related documents
Data Sheet ADM3061E /ADM3062E /ADM3063E /ADM3064E ...
www.analog.comJan 18, 2022 · ing packages, including the 10-lead, 3 mm × 3 mm lead frame chip-scale package (LFCSP); the 8‑ lead or 10-lead, 3 mm × 3 mm mini small outline package (MSOP); and the 8-lead or 14-lead, narrow-body standard small outline packages (SOIC_N). Models with operating temperature ranges of −40°C to +125°C and −40°C to +85°C are available.
Semiconductor and IC Package Thermal Metrics (Rev. C)
www.ti.com32 SOIC 8 Cu Package Type J/ A (C/W) 0 10 20 30 40 50 60 ... between the tips of the lead in the package and the die pad as shown in Figure 3, or even the downset between the pad and lead fingers. The latter is an especially important thermal criterion in thin packages. In BGAs, design of the interposer trace configuration is important in ...
AN2409, Small Outline Integrated Circuit (SOIC) Package ...
www.nxp.comThe SOIC is a surface mount integrated circuit package. The sta ndard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB.
24AA256/24LC256/24FC256 Data Sheet - Microchip …
ww1.microchip.comDec 03, 2000 · • 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP, 8-Lead SOIC, 8-Lead SOIJ, 8-Lead TDFN, 8-Lead TSSOP and 8-Ball CSP Description The Microchip Technology Inc. 24XX256 (1) is a 32K x 8 (256 Kbit) Serial Electrically Erasable PROM, capable of operation across a broad voltage range (1.7V to 5.5V). It has been developed for advanced, low-power
Quadruple 2-Input Positive-NOR Gates datasheet
www.ti.comPACKAGE OPTION ADDENDUM www.ti.com 23-Oct-2021 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples JM38510/00401BCA ACTIVE CDIP J 14 1 Non-RoHS & Green SNPB N / A for …
Package Drawing - SO 8-Lead Plastic (Narrow .150 Inch) 05 ...
www.analog.comTitle: Package Drawing - SO 8-Lead Plastic (Narrow .150 Inch) 05-08-1610 Author: Linear Technology Corporation Keywords: Packaging Created Date: 3/6/2012 8:07:51 AM
TLC555 LinCMOS Timer datasheet (Rev. I) - Texas Instruments
www.ti.comPW Package 14-Pin TSSOP Top View FK Package 20-Pin LCCC Top View Pin Functions: PW and FK PIN I/O DESCRIPTION NAME TSSOP LCCC CONT 8 12 I Controls comparator thresholds. Outputs 2/3 VDD and allows bypass capacitor connection. DISCH 12 17 O Open-collector output to discharge timing capacitor. GND 1 2 — Ground. NC 2, 4, 6, 9, 11, 13 1, 3, 4, …
MCP6001/1R/1U/2/4 - 1 MHz, Low-Power Op Amp
ww1.microchip.comMay 14, 2019 · MCP6001/1R/1U/2/4 DS20001733L-page 4 2002-2020 Microchip Technology Inc. AC ELECTRICAL SPECIFICATIONS TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8 to 5.5V, VSS = GND, VCM = VDD/2, VL = VDD/2, VOUT VDD/2, RL = 10 k to VL and CL = 60 pF (refer to Figure 1-1). …