PD 955 M SMT-Adhesive - mectronics.in

1 955 MSMT-AdhesiveThermosetting Polymer SMT-Adhesive for High-Speed DispensingDescriptionPD 955 M is a thermosetting single-component, solvent-freepolymer adhesive , developed especially for the surfacemounting of SMT components on to PCBs and for use onbare rheology is especially adapted for high-speed-dispensing. It allows for very low advantages- Very wide processing window, no tendency to Specially developed for high-speed Dispensing with very low Z-Height-return Form stable glue Excellent adhesion with standard and also with difficult-to-glue Very low humidity absorption. Steep temperature increases and very short curing times are possible without danger of formation of air bubbles or worse High surface insulation resistance (SIR).- Constant batch-to-batch characteristicsColour: g/ccHomogeneity:no particle >50 mAdhesion: 25 N/mm2 at room temperature,after curing in conventional box oven, 5 min /125 C, Cu-nailon SO component, with a low-stress rate DViscosity ascending curves[s-1][Pa s]PD 955 M30 10 - 40 Haake Rotovisco RV 20, PK 100, PK I/2 T,plate/cone, without border, temperature: 23 :ascending curve 0-40 s-1, 6 characteristicsSurface insulation resistance and electrolytic corrosionproperty: see adhesive is suitable for machine and standard curing conditions are: 125 C / 3.

2 Max. curing temperature should not be higher than 200 minimum* curing times are shown in the following C125 C150 C180 C8 '3 ' '1 '* Optimal curing conditions depend on the curing curing:The uncured adhesive can be removed with Zestron HC andother Zestron and Vigon cleaning materials - see separateapplication cleaned parts must be completely dry before installingthem in the curing:Because of the known residual thermoplasticity of the curedadhesive, defective components can be easily replaced byheating (with hot air) the cured adhesive joint above 100 removing the component (torsion movement), the hotair should be focused on the remaining adhesive in order toremove it with a sharp adhesives PD 955 M can be filled in various machine-specified descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testingequipment,and have been compiled as according to the latest factual knowledge in our possession.

3 The information was up-to date on the date this document wasprinted (latest versionscan always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained fromits use, or any patent infrresulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that theuser shall conduct tests todetermine materials suitability for a particular Heraeus GmbH & Co. KGHeraeus IncorporatedHeraeus LtdCircuit Materials DivisionCircuit Materials DivisionHeraeus Technology CentreHeraeusstr. 12-1424 Union Hill Road30 On Chuen Street63450 HanauW. Conshohocken, PA 19428On Lok TsuenGermanyUSAF anling, NT., Hong KongTel: +49 (6181) 35-4233 Tel: +1 (610) 825-6050 Tel: + (852) 2675-1200 Internet: : 955 MSMT-AdhesiveThermosetting Polymer SMT-Adhesive for High-Speed DispensingStorageStorage time:6 months in a refrigerator, at a storage temperature of 5 -12 in a refrigerator is : Storage at temperatures >30 C should be reverse for additional 955 MSMT-AdhesiveThermosetting Polymer SMT-Adhesive for High-Speed DispensingTest results with the SMT-Adhesive PD 955M according to Siemens Norm SN 59651**Report date:April 29, 1996 Item:* visible colour, filled in syringesbubble-free,particle size < 50 mred colourbubble-freeparticles < 30 to the Conditionsacc.

4 To manufacturer s data6 potlifemin. 8 - without timemin. 8 adhesionbefore curing of adhesiveposition change mm< cleanableZestron characteristicsacc. to manufacturer s data125 C, 3 corrosion effectknown value should be no worsepassedaccording to IEC 426than A insulation resistance> Ohm(comb sample test) corrosion effectno blistering, no dendritic growthpassed(comb sample test) loss at working temperaturemass loss 1 % spreading during curingincrease of diameter 10% adhesionafter curing of adhesive > 5 N/mm2 per component0603: N/mm20805: N/mm21206: N/mm2 SOT23: N/mm2SO14: adhesion> 1 N with the component Nafter curing of adhesive (measured in soldering bath) replacement without damagepassed*According to SN 59651, Issue November 1994. **The tests were performed in the Siemens Central Laboratory ZPL1TW22 in Berlin.

5 Person who performed the tests: Mr. TrodlerIssue from March 31,1999 AZM-TAThe descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testingequipment,and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document wasprinted (latest versionscan always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained fromits use, or any patent infrresulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that theuser shall conduct tests todetermine materials suitability for a particular Heraeus GmbH & Co.

6 KGHeraeus IncorporatedHeraeus LtdCircuit Materials DivisionCircuit Materials DivisionHeraeus Technology CentreHeraeusstr. 12-1424 Union Hill Road30 On Chuen Street63450 HanauW. Conshohocken, PA 19428On Lok TsuenGermanyUSAF anling, NT., Hong KongTel: +49 (6181) 35-4233 Tel: +1 (610) 825-6050 Tel: + (852) 2675-1200 Internet: : 955 MSMT-AdhesiveThermosetting Polymer SMT-Adhesive for High-Speed DispensingAdhesion is sufficient at 85 % full cured strength.