Power-Line Communications Analog Front-End …

1 AFE032. SBOS669A AUGUST 2013 REVISED DECEMBER 2013. Power-Line Communications Analog Front-End Check for Samples: AFE032. 1 FEATURES The integrated receiver is able to detect signals down to 10 VRMS (G3-FCC mode) and is capable of a wide Supports: 2345. range of gain options to adapt to varying input-signal CENELEC Bands A, B, C, D conditions. The monolithic integrated circuit provides ARIB STD-T84, FCC high reliability in demanding Power-Line communication applications. FSK, SFSK, and NB-OFDM. Conforms To: The AFE032 transmit power amplifier operates from a single supply in the range of 7 V to 24 V.

2 At typical EN50065-1, -2, -3, -7 load current (IOUT = APEAK), a wide output swing FCC, Part 15 provides a 12-VPP capability with a nominal 15-V. ARIB STD-T84 supply. Standards: The device is internally protected against G3, PRIME, , overtemperature and short-circuit conditions. The device also provides a selectable current limit. An Programmable Tx Low-Pass Filters and interrupt output is provided, indicating current limit, Rx Band-Pass Filters thermal limit, and undervoltage. A shutdown pin is Integrated Power-Line Driver with Thermal and also available, and can be used to quickly place the Overcurrent Protection device into the lowest- power state.

3 Each functional Low- power Consumption: block can be enabled or disabled to optimize power dissipation through the serial peripheral interface 50 mW (Receiver Mode) (SPI), Receive Sensitivity: 10 VRMS (Typ). The AFE032 is housed in a thermally-enhanced, Four-Wire SPI Interface surface-mount, PowerPAD, QFN-48 package. Three Integrated Zero-Crossing Detectors Operation is specified over the extended industrial Package: QFN-48 PowerPAD junction temperature range of 40 C to +125 C. TX_RX_NRF. Extended Temperature Range: DAC_NRF. PA_NRF. 40 C to +125 C PA_IN PA_VS PA_ISET PA_OUT ZC_IN3 ZC_IN2 ZC_IN1.

4 DVDD. APPLICATIONS DGND. ZC1 ZC_OUT1. AVDD1 Bias eMetering AVDD2. and References power ZC2 ZC_OUT2. AGND1 Amplifier ZC3 ZC_OUT3. Home Area Networks AGND2. PA_GND. Lighting SCLK. DIN. TSENSE. Digital Interface Solar DOUT. (SPI). AFE032. RX PGA2. RX_PGA2_IN. CS. Pilot Wires and EVSEs DAC. RX_PGA2_OUT. SD TX PGA. Programmable RX_FLAG Control Registers DAC RX_F_OUT. DESCRIPTION TX_FLAG Filter RX PGA1. The AFE032 is a low-cost, integrated, Power-Line INT. Communications (PLC), Analog Front-End (AFE). XCLK DAC_OUT TX_PGA_IN RX_PGA1_IN TX_F_OUT. device capable of transformer-coupled connections to the Power-Line while under the control of a digital signal processor (DSP) or microcontroller.

5 This device is ideal for driving high-current, low-impedance lines up to A into reactive loads. 1. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 PowerPAD is a trademark of Texas Instruments. 3 Illinois Capacitor is a trademark of Illinois Capacitor, Inc. 4 SPI is a trademark of Motorola Inc. 5 All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date.

6 Copyright 2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. AFE032. SBOS669A AUGUST 2013 REVISED DECEMBER 2013 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7 ORDERING INFORMATION (1). (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at ABSOLUTE MAXIMUM RATINGS (1). Over operating free-air temperature range, unless otherwise noted. VALUE UNIT. PA_VS Supply voltage (pins 44, 45) +26 V. Pins 3, 4, 6, 7, 8, 10 DGND to DVDD + V. Pins 13, 21, 28, 31, 32, 38, 39 AGND to AVDD + V. Voltage (2). Pins 18, 19 PA_GND to PA_VS + V. Pin 27 AVDD + to 26 V. Signal input terminals Pins 3, 4, 6, 7, 8, 10 10 mA. Pins 13, 21, 28, 31, 32, 38, 39 10 mA.

8 Current (2). Pins 18, 19 10 mA. Pin 35 10 mA. Pins 5, 9, 47, 48 DGND to DVDD + V. Voltage Pins 14, 17, 20, 22, 33, 36, 37 AGND to AVDD + V. Pins 42, 43 PA_GND to PA_VS + V. Signal output terminals Current; short-circuit to GND Pins 5, 9, 47, 48 Continuous Current; short-circuit to GND Pins 14, 17, 20, 22, 33, 36, 37 Continuous Current; short-circuit to GND Pins 42, 43 Continuous AVDD Analog supply voltage (pins 11, 30) V. DVDD Digital supply voltage V. TA Operating temperature (3) 40 to +150 C. Tstg Storage temperature 55 to +150 C. TJ Junction temperature +150 C. Human body model (HBM) 3000 V.

9 Electrostatic discharge ESD Machine model (MM) 200 V. ratings Charged device model (CDM) 500 V. (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated. Exposure to absolute- maximum-rated conditions for extended periods may affect device reliability. (2) Input terminals are diode-clamped to the power -supply rails. Input signals that can swing more than V beyond the supply rails should be current limited to 10 mA or less.

10 (3) The device automatically goes to shutdown above +165 C. THERMAL INFORMATION. AFE032. THERMAL METRIC (1) RGZ (QFN) UNITS. 48 PINS. JA Junction-to-ambient thermal resistance JCtop Junction-to-case (top) thermal resistance JB Junction-to-board thermal resistance C/W. JT Junction-to-top characterization parameter JB Junction-to-board characterization parameter JCbot Junction-to-case (bottom) thermal resistance (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright 2013, Texas Instruments Incorporated Product Folder Links: AFE032.