TLIN1029-Q1 Local Interconnect Network (LIN) …

1 LIN ControllerorSCI/UARTVDDVDDVDDVSUPVSUPVDD I/OENRXDTXDMCU w/o pullupVSUPMCUGNDI/OVREGLIN1 k LIN BusMaster NodePullup56378142220 pFVBATNCNCC opyright 2017, Texas Instruments IncorporatedLIN ControllerorSCI/UARTVDDVDDVDDVSUPVSUPVDD I/OENRXDTXDMCU w/o pullupVSUPMCUGNDI/OVREGLINLIN Bus56378142220 pFVBATNCNCC opyright 2017, Texas Instruments IncorporatedProductFolderOrderNowTechnic alDocumentsTools &SoftwareSupport &CommunityAn IMPORTANTNOTICEat the end of this datasheetaddressesavailability,warranty, changes,use in safety-criticalapplications,intellectual propertymattersand OCTOBER2017 REVISEDFEBRUARY2018 TLIN1029-Q1 Local InterconnectNetwork(LIN) Transceiverwith DominantState Timeout11 Features1 AEC-Q100 Qualifiedfor AutomotiveApplications DeviceTemperature: 40 C to 125 C Ambient DeviceHBMC ertificationLevel: 8 kV DeviceCDMC ertificationLevel: kV Compliantto LIN , LIN , LIN , LIN ISO/DIS17987 Conformsto SAEJ2602 RecommendedPracticefor LIN Supports12 V Applications LIN TransmitDataRateup to 20 kbps.

2 WideOperatingRanges 4 V to 36 V SupplyVoltage 45 V LIN Bus FaultProtection SleepMode:Ultra-LowCurrentConsumptionAll owsWake-UpEventFrom: LIN Bus LocalWakeup throughEN PowerUp and DownGlitchFreeOperation ProtectionFeatures: UnderVoltageProtectionon VSUP TXDD ominantTimeOut Protection(DTO) ThermalShutdownProtection UnpoweredNodeor GroundDisconnectionFailsafeat SystemLevel. Availablein SOIC(8) Packageand LeadlessVSON(8) Packagewith ImprovedAutomatedOpticalInspection(AOI)C apability2 Applications BodyElectronicsand Lighting Infotainmentand Cluster HybridElectricVehiclesand PowerTrainSystems PassiveSafety Appliances3 DescriptionTheTLIN1029-Q1is a LocalInterconnectNetwork(LIN)

3 Physicallayertransceiverwith integratedwake-up and protectionfeatures,compliantto LIN , , , a singlewirebidirectionalbustypicallyusedf or low speedin-vehiclenetworksusingdataratesup to 20 support12 V applicationswithwideroperatingvoltageand LIN receiversupportsdataratesup to 100 kbpsfor TLIN1029-Q1convertsthe LIN protocoldatastreamon the TXDinputinto aLIN bus signalusinga current-limitedwave-shapingdriverwhichre duceselectromagneticemissions(EME).The receiverconvertsthe datastreamto logiclevelsignalsthatare sentto the microprocessorthroughthe open-drainRXDpin. Ultra-lowcurrentconsumptionis possibleusingthe sleepmodewhichallowswake-upvia LIN bus or pin. Theintegratedresistor,ESDand faultprotectionallowsdesignerstosaveboar dspacein (1)PARTNUMBERPACKAGEBODYSIZE(NOM)TLIN102 9-Q1 SOIC(D) (8) x (DRB)(8) x (1) For all availablepackages,see the orderableaddendumatthe end of the ,MasterModeSimplifiedSchematics,SlaveMod e2 TLIN1029-Q1 SLLSEY5B OCTOBER2017 : TLIN1029-Q1 SubmitDocumentationFeedbackCopyright 2017 2018,TexasInstrumentsIncorporatedTableof Contents1 Pin Configurationand IEC.

4 Applicationand Deviceand Mechanical,Packaging,and RevisionHistoryNOTE:Pagenumbersfor previousrevisionsmay differfrompagenumbersin the (December2017)to RevisionBPage ChangedFrom:"Complaintto LIN " To: "Compliantto LIN " in ChangedFrom:"complaintto LIN " To: "compliantto LIN " in (October2017)to RevisionAPage Changedthe to scaleThermalPad1 RXD8 NC2EN7 VSUP 3NC6 LIN4 TXD5 GNDNot to OCTOBER2017 REVISEDFEBRUARY2018 ProductFolderLinks: TLIN1029-Q1 SubmitDocumentationFeedbackCopyright 2017 2018,TexasInstrumentsIncorporated5 Pin Configurationand FunctionsD Package8-Pin(SOIC)Top ViewDRBP ackage8-Pin(VSON)Top ViewPin (open-drain)interfacereportingstateof LIN bus voltageEN2 DIEnableinput- Highput the devicein normaloperationmodeand low put the devicein sleepmodeNC3 Not connectedTXD4 DITXD inputinterfaceto controlstateof LIN output- Internalpulledto groundGND5 GNDG roundLIN6HV I/OLIN bus single-wiretransmitterand receiverVSUP7HV SupplyDevicesupplyvoltage(connectedto batteryin serieswith externalreverseblockingdiode)NC8 Not connectedThermalPadGNDG roundand shouldbe soldered(DRBpackageonly)4 TLIN1029-Q1 SLLSEY5B OCTOBER2017.

5 TLIN1029-Q1 SubmitDocumentationFeedbackCopyright 2017 2018,TexasInstrumentsIncorporated(1)Stre ssesbeyondthoselistedunderAbsoluteMaximu mRatingsmay causepermanentdamageto the stressratingsonly,whichdo not implyfunctionaloperationof the deviceat theseor any absolute-maximum-ratedconditionsfor extendedperiodsmay (unlessotherwisenoted)(1)SymbolParameter MINMAXUNITVSUPS upplyvoltagerange(ISO/DIS17987 Param10) bus inputvoltage(ISO/DIS17987 Param82) 4545 VVLOGICL ogicpin voltage(RXD,TXD,EN) 40125 CTJJ unctiontemperaturerange 55150 C(1)JEDEC documentJEP155statesthat 500-VHBM allowssafe manufacturingwith a standardESDcontrolprocess.(2)LIN bus a stressedwith respectto (ESD)ElectrostaticdischargeHumanbodymode l(HBM)TXD,RXD,EN Pins,per AECQ100-002(1) 4000 VHumanbodymodel(HBM)LIN and VSUPPin, per AECQ100-002(2) 8000 Chargeddevicemodel(CDM),per AECQ100-011 All terminals 1500(1)IEC 61000-4-2is a systemlevelESDtest.

6 Resultsgivenhereare specificto the IBEELIN lead to differentresults(2)SAEJ2962-1 Testingperformedat 3rd partyUS3approvedEMCtest facility,test reportavailableuponrequest(3)ISO 7637is a lead to IECESDand SurgeProtectionRatingsVALUEUNITV(ESD)Ele ctrostaticdischarge(1)IEC 61000-4-2contactdischarge 8000VV(ESD)PoweredESDP erformance,perSAEJ2962-1(2)contactdischa rge 8000 Vair-gapdischarge 25000 ISO 7637-2and IEC 62215-3transientsaccordingto IBEELIN EMCtest specifications(3)(LIN and VSUP)Pulse1 100 VPulse275 VPulse3a 150 VPulse3b100V(1)For moreinformationabouttraditionaland new thermalmetrics,see the Semiconductorand IC PackageThermalMetricsapplicationreport, (1)TLIN1029 DTLIN1029 DRBUNITD (SOIC)DRB(VSON)8-PINS8-PINSR C/WR JC(top)Junction-to-case(top) C/WR C/W C/W C/WR JC(bot)Junction-to-case(bottom) OCTOBER2017 REVISEDFEBRUARY2018 ProductFolderLinks: TLIN1029-Q1 SubmitDocumentationFeedbackCopyright 2017 2018, (unlessotherwisenoted)PARAMETER- DEFINITIONMINNOMMAXUNITVSUPS upplyvoltage436 VVLINLIN Bus inputvoltage036 VVLOGICL ogicPin Voltage(RXD,TXD,EN) CTSD(HYS)Thermalshutdownhysteresis15 (unlessotherwisenoted)PARAMETERTESTCONDI TIONSMINTYPMAXUNITP owerSupplyVSUPO perationalsupplyvoltage(ISO/DIS17987 Param10)Deviceis operationalbeyondthe LINdefinednominalsupplyvoltagerangeSee Figure8 and Figure9436 VVSUPN ominalsupplyvoltage(ISO/DIS17987 Param10)Normaland StandbyModes.

7 RampVSUP whileLIN signalis a 10 kHZ squarewavewith 50 % duty cycleand Figure8 and Figure9436 VSleepMode436 VUVSUPU ndervoltageVSUP thresholdMin is fallingedgeand Max is :EN = high,bus dominant:total bus load whereRLIN> 500 andCLIN< 10 nF (SeeFigure14)15mAStandbyMode:EN = low, bus dominant:total bus load whereRLIN> 500 andCLIN< 10 nF (SeeFigure14) :EN = high,bus recessive:LIN = VSUP,300650 AStandbyMode:EN = low, bus recessive:LIN = VSUP,1030 V < VSUP 14 V, LIN= VSUP,EN = 0 V, TXDand RXDfloating812 ASleepMode:14 V < VSUP 36 V, LIN =VSUP, EN = 0 V, TXDand RXDfloating20 ATSDT hermalshutdown165 CTSD(HYS)Thermalshutdownhysteresis15 CRXDOUTPUTPIN (OPENDRAIN)VOLO utputlow voltageBaseduponexternalpull-upto leveloutputcurrent,opendrainLIN = 0 V, RXD= ,high-levelLIN = VSUP, RXD= 5 V 505 ATXDINPUTPINVILLow levelinputvoltage levelinputleakagecurrentTXD= low 505 ARTXDI nteralpull-downresitorvalue125350800k LIN PIN6 TLIN1029-Q1 SLLSEY5B OCTOBER2017.

8 TLIN1029-Q1 SubmitDocumentationFeedbackCopyright 2017 2018,TexasInstrumentsIncorporatedElectri calCharacteristics(continued)overoperati ngfree-airtemperaturerange(unlessotherwi senoted)PARAMETERTESTCONDITIONSMINTYPMAX UNITVOHHIGH leveloutputvoltageLIN recessive,TXD= high,IO= 0 mA,VSUP= 7 V to 36 recessive,TXD= high,IO= 0 mA,VSUP= 4 V VSUP< 7 V3 VVOLLOW leveloutputvoltageLIN dominant,TXD= low, VSUP= 7 V to36 dominant,TXD= low, VSUP= 4 V VSUP< 7 recessiveLINbus < 5% (ISO/DIS17987 Param11)TXD& RXDopenLIN = 4 V to 45 V (ISO/DIS17987 Param12)TXD= 0 V, VLIN= 18 V, RMEAS= 440 ,VSUP= 18 V, VBUSdom< Figure134090200mAIBUS_PAS_domReceiverleakagecurrent,dominant(ISO/DIS17987 Param13)LIN = 0 V, VSUP= 12 V Driveroff/recessiveFigure14 1mAIBUS_PAS_rec1 Receiverleakagecurrent,recessive(ISO/DIS17987 Param14)LIN > VSUP, 4 V VSUP 36 V Driveroff; Figure1520 AIBUS_PAS_rec2 Receiverleakagecurrent,recessive(ISO/DIS 17987 Param14)LIN = VSUP, Driveroff; Figure15 55 AIBUS_NO_GNDL eakagecurrent,loss of ground(ISO/DIS17987 Param15)GND= VSUP, VSUP= 18 V, LIN = 0V; Figure16 11mAIBUS_NO_BATL eakagecurrent,loss of supply(ISO/DIS17987 Param16)LIN = 18 V, VSUP= GND.

9 Figure175 AVBUSdomLow levelinputvoltage(ISO/DIS17987 Param17)LIN dominant(includingLIN dominantforwakeup) See Figure11, (ISO/DIS17987 Param18)Lin recessiveSee Figure11, (ISO/DIS17987 Param19)VBUS_CNT= (VIL+ VIH)/2 SeeFigure11, (ISO/DIS17987 Param20)VHYS= (VIL- VIH) SeeFigure11, termpull-uppathBy designand VSUPN ormaland standbymodes204560k IRSLEEPPull-upcurrentsourceto VSUPS leepmode,VSUP= 14 V, LIN = GND 2 20 ACLINPINC apacitanceof the LIN pin45pFEN INPUTPINVILLow levelinputvoltage designand characterization50500 VIILGLow levelinputcurrentEN = low 505 ARENI nternalpull-downresistor125350800k (1)Dutycycles:LIN driverbus load conditions(CLINBUS,RLINBUS):Load1= 1 nF, 1 k ; Load2= 10 nF, 500 . Dutycycles3 and 4 aredefinedfor TLIN1029also meetstheselowerdatarate requirements,whileit is capableof the higherspeed20-kbpsoperationas specifiedby duty cycles1 and 2.

10 SAEJ2602derivespropagationdelayequations fromthe LIN duty cycledefinitions,for detailssee the (unlessotherwisenoted)PARAMETERTESTCONDI TIONSMINTYPMAXUNITD112 VDutyCycle1 (ISO/DIS17987 Param27)(1)THREC(MAX)= VSUP, THDOM(MAX)= VSUP, VSUP= 7 V to 18 V, tBIT= 50 s (20 kbps),D1 = tBUS_rec(min)/(2 xtBIT) (SeeFigure18, Figure19) OCTOBER2017 REVISEDFEBRUARY2018 ProductFolderLinks: TLIN1029-Q1 SubmitDocumentationFeedbackCopyright 2017 2018,TexasInstrumentsIncorporatedSwitchi ngCharacteristics(continued)overoperatin gfree-airtemperaturerange(unlessotherwis enoted)PARAMETERTESTCONDITIONSMINTYPMAXU NITD112 VDutyCycle1 THREC(MAX)= VSUP, THDOM(MAX)= VSUP, VSUP= 4 V to 7 V, tBIT=50 s (20 kbps),D1 = tBUS_rec(min)/(2 xtBIT) (SeeFigure18, Figure19) (ISO/DIS17987 Param28)THREC(MAX)= VSUP, THDOM(MIN)= VSUP, VSUP= V to 18 V,tBIT= 50 s (20 kbps),D2 =tBUS_rec(MAX)/(2 x tBIT) (SeeFigure18,Figure19) (ISO/DIS17987 Param29)THREC(MAX)= VSUP, THDOM(MAX)= VSUP, VSUP= 7 V to 18 V, tBIT= 96 s ( ),D3 = tBUS_rec(min)/(2x tBIT) (SeeFigure18, Figure19) (MAX)= VSUP, THDOM(MAX)