TPD2E007 2-Channel ESD Protection Array …

1 123 GNDTPD2E007RS232 TransceiverRS232 ConnectorTXdRXdGNDIO1IO2 GNDP roductFolderSample &BuyTechnicalDocumentsTools &SoftwareSupport &CommunityAn IMPORTANTNOTICEat the end of this datasheetaddressesavailability,warranty, changes,use in safety-criticalapplications,intellectual propertymattersand SEPTEMBER2008 REVISEDMARCH2016 TPD2E0072-ChannelESD ProtectionArray for AC-Coupled/Negative-RailData Interfaces11 Features1 IEC 61000-4-2 Level4 ESDP rotection 8-kVIEC 61000-4-2 ContactDischarge 15-kVIEC 61000-4-2 Air-GapDischarge IEC 61000-4-5 SurgeProtection (8/20- s Pulse) IO Capacitance15 pF (Max) Low 50-nALeakageCurrent Space-SavingPicoStar and SOTP ackage2 Applications Cell Phones AudioInterfaceConnections ConsumerElectronics(DVR,Set-TopBox,TV) IndustrialInterfaces(RS-232,RS-485,RS-42 2,LVDS)3 DescriptionThisdeviceis a transientvoltagesuppressor(TVS)basedelec trostaticdischarge(ESD)protectiondeviced esignedto offersystemlevelESDsolutionsfor widerangeof (audiointerface,LVDS,RS-485,RS-232,andso forth) IEC 61000-4-2(Level4) ESDprotectionand isidealfor providingsystemlevelESDprotectionfor theinternalICs whenplacednearthe TPD2E007is offeredin a 4-bumpPicoStarand3-pinSOT(DGK) PicoStarpackage(YFM), (Max)

2 Packageheight,isrecommendedfor ultraspacesavingapplicationwherethe packageheightis a key be usedin eitherembeddedPCBboardapplicationsor in (1)PARTNUMBERPACKAGEBODYSIZE(NOM)TPD2E00 7 SOT(3) x (4) x (1) For all availablepackages,see the orderableaddendumatthe end of the SEPTEMBER2008 : TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016,TexasInstrumentsIncorporatedTableof Contents1 Pin Configurationand Applicationand Deviceand Mechanical,Packaging,and RevisionHistoryNOTE:Pagenumbersfor previousrevisionsmay differfrompagenumbersin the (January2016)to RevisionIPage (December2015)to RevisionHPage Updatedthe break-downvoltagefor (August2014)to RevisionGPage UpdatedtheHandlingRatingstableto anESDR atingstableand movedTstgto Added = 10 MHzto theChannelinputcapacitancetest conditionin (August2010)to RevisionFPage AddedPin Configurationand Functionssection,HandlingRatingtable,Fea tureDescriptionsection,DeviceFunctionalM odes,Applicationand Implementationsection,PowerSupplyRecomme ndationssection,Layoutsection,Deviceand DocumentationSupportsection,andMechanica l,Packaging,and (October2009)

3 To RevisionEPage Addedmax continuouspowerdissipationvaluefor SEPTEMBER2008 REVISEDMARCH2016 ProductFolderLinks: TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016,TexasInstrumentsIncorporated5 Pin Configurationand FunctionsDCKP ackage3-PinSOTTop mm mm ( mm pitch)Pin , B2 GGroundIO11A1 IOESD protectedchannelIO22A2 IOESD protectedchannel4 TPD2E007 SLVS796I SEPTEMBER2008 : TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016,TexasInstrumentsIncorporated(1)Stre ssesbeyondthoselistedunderAbsoluteMaximu mRatingsmay causepermanentdamageto the stressratingsonly,and functionaloperationof the deviceat theseor any otherconditionsbeyondthoseindicatedin the operationalsectionsof thespecificationsis not absolutemaximum-ratedconditionsfor extendedperiodsmay (unlessotherwisenoted)(1)MINMAXUNITVIO (TA= 70 C)YFMpackage270mWDCK package218 Operatingtemperature 4085 CTJJ unctiontemperature150 CBumptemperature(soldering)Infrared(15 s)220 CVaporphase(60 s)215 Leadtemperature(soldering,10 s)300 CTstgStoragetemperature 65150 C(1)

4 JEDEC documentJEP155statesthat 500-VHBM allowssafe manufacturingwith a standardESDcontrolprocess.(2)JEDEC documentJEP157statesthat 250-VCDM allowssafe manufacturingwith a (ESD)ElectrostaticdischargeHumanbodymode l(HBM),per ANSI/ESDA/JEDECJS-001,all pins(1) 15000 VChargeddevicemodel(CDM),per JEDEC specificationJESD22-C101,all pins(2) :SurgeProtectionVALUEUNITV(ESD)Electrost aticdischargeIEC 61000-4-2 ESDratingsContact 8000 VAir gap (unlessotherwisenoted)MINNOMMAXUNITVIOO peratingvoltage 1313 VOperatingtemperature 4085 C(1)For moreinformationabouttraditionaland new thermalmetrics,see theSemiconductorand IC PackageThermalMetricsapplicationreport, (1) TPD2E007 UNITDCK(SOT)YFM(PicoStar)3 PINS4 PINSR C/WR JC(top)Junction-to-case(top) C/WR C/W C/W C/WR JC(bot)Junction-to-case(bottom)thermalre sistanceN/AN/A 2 Device 1 Input Voltage (V)Capacitance (F) + 2 Device 1 4004080120160200240280020406080 100 120 140 160 180 200 Time (ns)Amplitude (V)Time (ns)Amplitude (V)

5 280 260 240 220 200 180 160 140 120 100 80 60 40 2002040020 406080 100 120 140 160 180 SEPTEMBER2008 REVISEDMARCH2016 ProductFolderLinks: TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016,TexasInstrumentsIncorporated(1)Typi calvaluesare at VCC= 5 V and TA= 25 40 C to 85 C (unlessotherwisenoted)PARAMETERTESTCONDI TIONSMINTYP(1)MAXUNITVBRFB reak-downvoltage,pin 1 or 2 to GNDIIO= 10 mA14 VVBRRB reak-downvoltage,GNDto pin 1 or 2 IIO= 10 CINC hannelinputcapacitanceVIO= V; = 10 ClampingWaveforms(20 ns/div)Figure1. 8-kVContactFigure2. 8-kVContactFigure3. Capacitancevs InputVoltageat TA= 27 CFigure4. DiodeBreakdownVoltageDataat TA= 27 CIO1IO2 GND6 TPD2E007 SLVS796I SEPTEMBER2008 : TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016,TexasInstrumentsIncorporated7 ESDprotectiondevicedesignedto offersystemlevelESDsolutionsfor widerangeofportableand back-to-backdiodearrayallowsAC-coupledor negative-goingdatatransmission(audiointe rface,LVDS,RS-485,RS-232,etc.)

6 PicoStarpackageis intendedto be embeddedinsidethe printedcircuitboardwhichsavesboardspacei n IEC 61000-4-2(Level4) ESDprotectionand is idealfor providingsystemlevelESDprotectionfor the internalICs whenplacednearthe ESDprotectiondevicedesignedto offersystemlevelESDsolutionsfor widerangeofportableand back-to-backdiodearrayallowsAC-coupledor negative-goingdatatransmission(audiointe rface,LVDS,RS-485,RS-232,etc.) PicoStarpackageis intendedto be embeddedinsidethe printedcircuitboardwhichsavesboardspacei n IEC 61000-4-2(Level4) ESDprotectionand is idealfor providingsystemlevelESDprotectionfor the internalICs whenplacednearthe 61000-4-2 Level4 ESDP rotectionThe I/O pins can withstandESDeventsup to 12-kVcontactand 15 ESD/surgeclampdivertsthecurrentto 61000-4-5 SurgeProtectionThe I/O pinscan withstandsurgeeventsup to A (8/20 s waveform).

7 An ESD/surgeclampdivertsthiscurrentto CapacitanceThe capacitancebetweeneachI/O pin to groundis 15 I/O pins featurea low 50-nA(max) SOTP ackageThis deviceis offeredin botha space-savingPicoStarpackage,as well as a a passiveintegratedcircuitthat triggerswhenvoltagesare aboveor belowVBR. DuringESDevents,voltagesas highas 15 kV (air)can be directedto groundvia the the protectedline fall belowthe triggerlevelsof TPD2E007 (usuallywithin10 s of nano-seconds)thedevicerevertsto SEPTEMBER2008 REVISEDMARCH2016 ProductFolderLinks: TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016,TexasInstrumentsIncorporated8 Applicationand ImplementationNOTEI nformationin the followingapplicationssectionsis not partof the TI componentspecification,and TI doesnot warrantits accuracyor s customersareresponsiblefor determiningsuitabilityof componentsfor test theirdesignimplementationto a diodetype TVSwhichis typicallyusedto providea pathto groundfor dissipatingESDeventsonsignallinesbetween a humaninterfaceconnectorand a the currentfromESDpassesthroughtheTVS,only a smallvoltagedropis presentacrossthe is the voltagepresentedto the this designexample,a singleTPD2E007is usedto protectan application.

8 The followingparametersare DesignParametersDESIGNPARAMETERVALUES ignalrangeon all pins exceptGND 12 V to 12 VSurgeWithstand- IEC 61000-4-5150 beginthe designprocess,someparametersmustbe decidedupon;the designerneedsto knowthe following: Signalvoltagerangeon all protectedlines IO1 and IO2 PinsThe TPD2E007has 2 IO pins whichcan supportup to 13 TPD2E007can withstandup to 170 Wof IEC 61000-4-58/20- s VIA to GNDIO2IO10204060801001201401601800123450 1020304050 Power (W) Current (A) Time ( s) Current (A)Power (W)C014 8 TPD2E007 SLVS796I SEPTEMBER2008 : TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016, SurgePulseWaveform9 PowerSupplyRecommendationsThis deviceis a passiveESDdeviceso thereis no needto powerit.

9 Takecarenot to violatethe recommendedI/O specification( 13 V) to ensurethe The optimumplacementis as closeto the connectoras possible. EMIduringan ESDeventcan couplefromthe tracebeingstruckto othernearbyunprotectedtraces,resultingin earlysystemfailures. The PCBdesignerneedsto minimizethe possibilityof EMI couplingby keepingany unprotectedtracesawayfromthe protectedtraceswhichare betweenthe TVSand the connector. Routethe protectedtracesas straightas possible. Eliminateany sharpcornerson the protectedtracesbetweenthe TVSand the connectorby usingroundedcornerswith the largestradii possible. Electricfieldstendto buildup on corners,increasingEMI SEPTEMBER2008 REVISEDMARCH2016 ProductFolderLinks: TPD2E007 SubmitDocumentationFeedbackCopyright 2008 2016,TexasInstrumentsIncorporated11 Deviceand followinglinksconnectto TI provided"AS IS" by the not constituteTI specificationsand do not necessarilyreflectTI's views.

10 See TI's E2E OnlineCommunityTI's Engineer-to-Engineer(E2E) ,you can ask questions,shareknowledge,exploreideasand helpsolveproblemswith 's DesignSupportQuicklyfind helpfulE2E forumsalongwith designsupporttoolsandcontactinformationf or ,E2E are trademarksof othertrademarksare the propertyof be damagedby all integratedcircuitsbe observeproperhandlingand installationprocedurescan rangefromsubtleperformancedegradationto be moresusceptibleto damagebecausevery smallparametricchangescouldcausethe devicenot to meetits TI glossarylists and explainsterms,acronyms,and Mechanical,Packaging,and OrderableInformationThe followingpagesincludemechanical,packagin g,and the mostcurrentdataavailablefor the subjectto changewithoutnoticeand revisionofthis browser-basedversionsof this datasheet,referto the OPTION 1 PACKAGING INFORMATIONO rderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp ( C)Device Marking(4/5)SamplesTPD2E007 DCKRACTIVESC70 DCK33000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-2-260C-1 YEAR-40 to 8545 UTPD2E007 YFMRG4 ACTIVEDSLGAYFM43000 Green (RoHS& no Sb/Br)Call TILevel-1-260C-UNLIM-40 to 8545 TTPD2E007 YFMTG4 ACTIVEDSLGAYFM4250 Green (RoHS& no Sb/Br)Call TILevel-1-260C-UNLIM-40 to 8545T (1) The marketing status values are defined as follows:ACTIVE: Product device recomm