Understanding and Interpreting Standard-Logic …

1 1 SZZA036C December2002 RevisedJune2016 SubmitDocumentationFeedbackCopyright 2002 2016,TexasInstrumentsIncorporatedUnderst andingand InterpretingStandard-LogicDataSheetsAppl icationReportSZZA036C December2002 RevisedJune2016 Understandingand ,JoseM. Soltero,ShreyasRaoABSTRACTT exasInstruments(TI) standard-logicproductdatasheetsincludede scriptionsof functionalityandelectricalspecifications for the ,numericallimits,and testconditionsthat maybe foreignto the properunderstandingand interpretationof the direct,andsometimesimplied,meaningsof thesespecificationsare essentialto detail,howitaffectsthe device,and howit impactsthe enablecomponentand system-designengineersto derivethe maximumbenefitfromTI the TI Configurationand TI ConfigurationAnd December2002 RevisedJune2016 SubmitDocumentationFeedbackCopyright 2002 2016.

2 TexasInstrumentsIncorporatedUnderstandin gand applicationreportis organizedinto five the TI LogicDataSheet. Overalllayoutand componentpartsof a TI LogicDataSheet. JEDEC definition,the TI definition,an explanation,and,wherepossible,helpfulhin tsare presentedfor eachspecificationtermcommonlyfoundin TI Informationin TI logicdatasheetsfor determiningthe interfacecompatibilitybetweendifferentlo gicfamiliesis End matter,includingtheConclusion,Acknowledg ments, applicationreportis a synopsisof the informationavailablefroma typicalTI datasheetwith thepurposeof assistingcomponentand system-designengineersin selectingTexasInstruments(TI)

3 Briefdescriptionof terms,definitions,and testingprocedurescurrentlyusedfor commercial,automotiveand ,terms,anddefinitionsgenerallyare in accordancewith thosecurrentlyagreeduponby the JEDECS olidStateTechnologyAssociationfor use in the USAand by the InternationalElectrotechnicalCommission( IEC) the TI LogicDataSheet3 SZZA036C December2002 RevisedJune2016 SubmitDocumentationFeedbackCopyright 2002 2016,TexasInstrumentsIncorporatedUnderst andingand InterpretingStandard-LogicDataSheets3 Top-LevelLookat the TI LogicDataSheetThe TI logicdatasheetpresentspertinenttechnical informationfor a particulardeviceand is applicationreportdissectsa typicalTI logicdatasheetand describesthe organizationof all ,thereare ten sectionsin TI-logicdatasheets:1.

4 FrontPage(a) Features(b) Applications(c) Description(d) DeviceInformationTable(e) Front-PageGraphic(s)2. Tableof Contents3. RevisionHistory4. Pin Configurationand Functions5. Specifications(a) AbsoluteMaximumRatings(b) ESDR atings(c) RecommendedOperatingConditions(d) ThermalInformation(e) ElectricalCharacteristics(f) TimingRequirements(g) SwitchingCharacteristics(h) TypicalCharacteristics6. ParameterMeasurementInformation7. DetailedDescription(a) Overview(b) FunctionalBlockDiagram(c) FeatureDescription(d) DeviceFunctionalModes8. Applicationand Implementation(a) ApplicationInformation(b) TypicalApplication(c) DesignRequirements(d) DetailedDesignProcedure(e) ApplicationCurves9.

5 PowerSupplyRecommendations10. Layout(a) LayoutGuidelines(b) LayoutExample11. Deviceand DocumentationSupport12. Mechanical,Packaging,and OrderingInformationTop-LevelLookat the TI December2002 RevisedJune2016 SubmitDocumentationFeedbackCopyright 2002 2016,TexasInstrumentsIncorporatedUnderst andingand first pageof a datasheetcontainsall of the generalinformationabouta device(seeFigure1). Thisinformationincludes:1. Title,literaturenumber,and datesof originationand revision,as ,the top navigationcontainshyperlinksleadingdirec tlyto ProductFolder,Sample& Buy,TechnicalDocuments(relatedtothe device),Tools& Software,and Support& Exampleof DeviceSummary2.

6 TheFeaturessectionidentifiesthe mainfeaturesand benefitsof the sectionincludesfeaturesin a showsan exampleof the FeatureBullets3. TheApplicationssectionfor the deviceidentifiesthe applicationscenariosfor the exampleof TypicalApplications4 Revision HistoryChanges from Revision X (March 2014 to Revision YDevice Information(1)DEVICE NAMEPACKAGEBODY SIZESOT-23 (5) (5) (6) (6) (1) For all available packages, see the orderable addendum atthe end of the (4) the TI LogicDataSheet5 SZZA036C December2002 RevisedJune2016 SubmitDocumentationFeedbackCopyright 2002 2016,TexasInstrumentsIncorporatedUnderst andingand InterpretingStandard-LogicDataSheets4.)

7 TheDescriptionsectionprovidesa briefdescriptionof the deviceand its functionalityFigure4. BriefDescriptionof Device5. Figure5 showsa deviceinformationdefinesthe nominalsize of the devicein eachof the DeviceInformation6. Product-developmentstagenoteat the bottomof the datasheet7. Tableof contentsto list the contentsand the link to the Revisionhistoryfor the devicementioningthe changesto the datasheetwith the RevisionHistoryTop-LevelLookat the TI December2002 RevisedJune2016 SubmitDocumentationFeedbackCopyright 2002 2016,TexasInstrumentsIncorporatedUnderst andingand Configurationand FunctionsFigure7 showsall the packageoptionsfor the showsthe functionsof eachpin sortedbythe packagelist and theircorrespondingpin Pin Configurationand FunctionsFigure8.

8 Pin (Figure9) specifiesthe stresslevelsthat,if exceeded,may causepermanentdamageto the ,theseare stressratingsonly,and functionaloperationof thedeviceat theseor any otherconditionsbeyondthoseindicatedunder RecommendedOperatingConditionsis not ,exposureto absolute-maximum-ratedconditionsfor Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)VCCS upply voltage rangeVIInput voltage range(2)VOVoltage range applied to any output in the high-impedance or power-off state(2)VOVoltage range applied to any output in the high or low state(2)(3)IIKI nput clamp currentVI< 0 IOKO utput clamp currentVO< 0 IOContinuous output currentContinuous current through VCCor GNDTstgStorage temperature rangeMINMAX UNIT V V V VCC+ V 50 mA 50 mA 50 mA 100 mA 65150 C(1) Stresses beyond those listed underAbsolute Maximum Ratingsmay cause permanent damage to the device.

9 These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated underRecommended OperatingConditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3) The value of VCCis provided in theRecommended Operating the TI LogicDataSheet7 SZZA036C December2002 RevisedJune2016 SubmitDocumentationFeedbackCopyright 2002 2016,TexasInstrumentsIncorporatedUnderst andingand InterpretingStandard-LogicDataSheetsAs Figure9 indicates,thereare two absolutemaximumsthat may be inputand outputvoltageratings,VIand VO, may be exceededif the inputand outputmaximumclamp-currentratings,IIKand IOK, are Exampleof AbsoluteMaximumRatingsSectionHelpfulHint .

10 All currentsare definedwith respectto conventionalcurrentflow into the respectiveterminalof meansthat any currentthat flowsout of the respectiveterminalis consideredto bea limitsare givenaccordingto the absolute-magnitudeconvention,with a few thisconvention,maximumrefersto the greatermagnitudelimit of a rangeof like-signedvalues;if the rangeincludesbothpositiveand negativevalues,bothlimit valuesare the smallermagnitudelimit of a rangeof like-signedvalues;if the rangeincludesbothpositiveand negativevalues,thenthe minimumis mostcommonexceptionsto the absolutemagnitudeconventionare temperatureand theselevels,zerodoesnot representthe least-possiblequantity,sothe algebraicconventionis this case,maximumrefersto the ESDR atingssectionof the datasheetspecifiesthe ElectrostaticDischargeratingsfor the devicetestedas per JEDEC(JointElectronDeviceEngineeringCoun cil) ,HBM(HumanBodyModel)and CDM(ChargedDeviceModel)specis tabulatedas per (MM)is (ESD)ElectrostaticdischargeHumanbodymode l(HBM),per ANSI/ESDA/JEDECJS-001(1)2000 VChargeddevicemodel(CDM),per JEDEC specificationJESD22-C101(2)