USB 3.0 Single Channel Redriver with Equalization …

1 TerminationRX+RX-DetectTX+TX-Termination 3rdGeneration State MachineLFPS AUGUST2013 REVISEDAUGUST2013 USB SingleChannelRedriverwith EqualizationCheckfor Samples:TUSB5011 FEATURESDESCRIPTIONTheTUSB501is a AggressiveLow-PowerArchitecture(Typ) GbpsSuperSpeed 126 mW ActivePowerUSBsignalstravelacrossa PCBor cable,signal 20 mW in U2/U3integritydegradesdueto 3 mW withNo Connectionby applyingequalizationthat compensateschannel AutomaticLFPSDE Controlloss,and drivesout signalswitha highdifferential ExcellentJitterand possiblechannellength,and enablessystemsto compliance. 32 inchesof FR4 4 mil StriplineTheTUSB501advancedstatemachinem akesit 3 m of 30 AWGcabletransparentto hostsand devices. IntegratedTerminationAfterpowerup, the TUSB501periodicallyperforms Small2 x 2 mm QFNP ackagereceiverdetectionon the TX it detectsa SelectableReceiverEqualization,Transmitt erSuperSpeedUSBreceiver,RX terminationbecomesDe-Emphasisand OutputSwingenabled,and the TUSB501is readyto redrive.

2 Hot-PlugCapableThereceiverequalizerhas threegainsettingsthat ESDP rotection 5 kV HBMare controlledby pin EQ: 3 dB, 6 dB, and 9 dB. Thisshouldbe set basedon amountof ,theoutputdriversupportsAPPLICATIONS configurationof De-Emphasisand OutputSwing(pins Cell Phones,Computers,DockingStations,DE and OS).Thesesettingsallowthe TUSB501to beTVs,ActiveCables,Backplanesflexiblypla cedin the SuperSpeedUSBpath, ,the TUSB501featuresreducedpowerin all link states,a strongerOS option,improvedreceiverequalizationsetti ngs, ,for full TUSB501is packagedin a small2 x 2 mm QFN,and operatesthroughan industrialtemperaturerangeof 40 C to 85 awarethat an importantnoticeconcerningavailability,st andardwarranty,and use in criticalapplicationsofTexasInstrumentsse miconductorproductsand disclaimerstheretoappearsat the end of this trademarksare the propertyof currentas of 2013,TexasInstrumentsIncorporatedProduct sconformto specificationsper the termsof the all AUGUST2013 leadsshouldbe shortedtogetheror the deviceplacedin conductivefoamduringstorageor handlingto preventelectrostaticdamageto the (TOPVIEW)PIN for 5 for 5 integratedpull-upand integratedpull-upand outputswing(differentialvoltageamplitude ).

3 2-stateinputwith 2013, AUGUST2013 REVISEDAUGUST2013 DEVICECONFIGURATIONT able1. ControlPin Effects(TypicalValues)PINDESCRIPTIONLOGI CSTATEGAINLow3 dBEQE qualizationAmountFloating6 dBHigh9 dBOUTPUTDIFFERENTIALVOLTAGEPINDESCRIPTIO NLOGICSTATEFORTHETRANSITIONBITLow930 mVppOutputSwingOSAmplitudeHigh1300mVppDE -EMPHASISRATIO(1)PINDESCRIPTIONLOGICSTAT EFOROS = LOWFOROS = HIGHLow0 dB dBDe-EmphasisDEFloating dB dBAmountHigh dB dB(1)TypicalvaluesABSOLUTEMAXIMUMRATINGS overoperatingfree-airtemperaturerange(un lessotherwisenoted)(1)MINMAXUNITS upplyvoltagerange(2)VCC any inputor outputterminalCMOS inputs + (all pins)(3) 5 ElectrostaticdischargekVCharged-devicemo del(all pins)(4) ,TSTG 65150 CMaximumjunctiontemperature,TJ-40105 C(1)Stressesbeyondthoselistedunderabsolu temaximumratingsmay causepermanentdamageto the stressratingsonly and functionaloperationof the deviceat theseor any conditionsbeyondthoseindicatedunderrecom mendedoperatingconditionsis not absolute-maximum-ratedconditionsfor extendedperiodsmay affectdevicereliability.

4 (2)All voltagevaluesare with respectto the GNDterminals.(3)Testedin accordancewith JEDECS tandard22, TestMethodA114-B.(4)Testedin accordancewith JEDECS tandard22, (1)UNITSDRF JC(top)Junction-to-case(top) C/W JTJunction-to-topcharacterizationparamet er70 JC(bottom)Junction-to-case(bottom) (1)For moreinformationabouttraditionaland new thermalmetrics,see the IC PackageThermalMetricsapplicationreport, 2013,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback3 ProductFolderLinks:TUSB501 TUSB501 SLLSEG5A AUGUST2013 (unlessotherwisenoted) 4085 CCACAC couplingcapacitor75100200nFPOWERSUPPLYCH ARACTERISTICS overoperatingfree-airtemperaturerange(un lessotherwisenoted)PARAMETERTESTCONDITIO NSMINTYP(1)MAX(2)UNITLink in U0 with ,OS = LowICC-ACTIVEA verageactivecurrentmALink in U0 with ,OS = HighLink has someactivity,not in U0,ICC-IDLEA veragecurrentin idle = LowICC-U2U3 Averagecurrentin U2/U3 Link in U2 or SuperSpeedUSBdeviceisICC-NCAveragecurren twith no TXP,TXNOS = Low126 PDPowerDissipationin U0mWOS = High145234(1)TYPvaluesuse VCC= V, TA= 25 C.

5 (2)MAXvaluesuse VCC= V, TA= 40 ELECTRICALCHARACTERISTICS overoperatingfree-airtemperaturerange(un lessotherwisenoted)PARAMETERTESTCONDITIO NSMINTYPMAXUNIT3-StateCMOSI nputs(EQ,DE) HighimpedanceVCC/ 2 VRPUI nternalpull-upresistance190k RPDI nternalpull-downresistance190k IIHHigh-levelinputcurrentVIN= V36 AIILLow-levelinputcurrentVIN= GND,VCC= V-36 A2-StateCMOSI nput(OS) HighimpedanceGNDVRPDI nternalpull-downresistance270k IIHHigh-levelinputcurrentVIN= V26 AIILLow-levelinputcurrentVIN= GND-1 A4 SubmitDocumentationFeedbackCopyright 2013, AUGUST2013 REVISEDAUGUST2013AC ELECTRICALCHARACTERISTICS overoperatingfree-airtemperaturerange(un lessotherwisenoted)PARAMETERTESTCONDITIO NSMINTYPMAXUNITD ifferentialReceiver(RXP,RXN)Inputdiffere ntialvoltageswingAC-coupleddifferentialp eak-to-peakVDIFF-pp1001200mVppsignalComm on-modevoltagebias in (DC)Presentaftera SuperSpeedUSBZRX-DIFFD ifferentialinputimpedance(DC)7291120 deviceis detectedon TXP/TXNC ommon-modeinputimpedancePresentaftera (DC)deviceis detectedon TXP,TXNP resentwhenno SuperSpeedUSBZRX-HIGH-Common-modeinputim pedancedeviceis detectedon TXP, IMP-DC-POSwith terminationdisabled(DC)Measuredoverthe rangeof 0-500mV with respectto FrequencyPeriodicSignalingBelowthe minimumis squelched100300mVppDET-DIFF-pp(LFPS)Dete ctThresholdDifferentialTransmitter(TXP,T XN)OS = Low,No load930 TransmitterdifferentialvoltageswingVTX-D IFF-PPmVpp(transition-bit)OS = High,No load1300 VTX-DE-Transmitterde-emphasisDE = Floating,OS = inputcapacitanceto GNDAt the driver7593125 Common-modeimpedanceof theMeasuredwith respectto AC driverover0-500mVITX-SCTX shortcircuitcurrentTX shortedto GND60mACommon-modevoltagebias in (DC)

6 AC common-modevoltageswinginVCM-TX-ACWithin U0 and withinLFPS100mVppactivemodeVTX-IDLE-Diff erentialvoltageswingduringTestedwith a high-passfilter010mVppDIFF-AC-ppelectric alidleVTX-CM-Absolutedeltaof DC CM voltageRestrictthe test conditionto meet100mVDeltaU1-U0duringactiveand idle states100 mVVTX-idle-diff-DC electricalidle differentialoutputVoltagemustbe low passfilteredto012mVDCvoltageremoveany AC componentDifferentialTransmitter(TXP,TXN )Outputrise, fall time20%-80%of differentialvoltagetR, tF80pssee Figure4measured1 inch fromthe outputpin20%-80%of differentialvoltagetRF-MMOutputRise,Fall time mismatch20psmeasured1 inch fromthe outputpinDe-emphasis= dB propagationtdiff-LH,Differentialpropagat iondelaydelaybetween50%levelat input290pstdiff-HLsee Figure2and outputtidleEntry,Idle entryand exit Figure3 Copyright 2013,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback5 ProductFolderLinks:TUSB501 Tdiff_LHTdiff_HLINOUT 24"1"-6"Up to 3m(30 AWG)TUSB5014"AWGJ itter Measurement ATUSB501 SLLSEG5A AUGUST2013 ELECTRICALCHARACTERISTICS(continued)over operatingfree-airtemperaturerange(unless otherwisenoted)PARAMETERTESTCONDITIONSMI NTYPMAXUNITT imingApply0 V to VCC,connectTimefrompowerapplieduntil RXSuperSpeedUSBterminationtotREADY9mster minationTX , V to VCC,andmeasurewhenZRX-DIFFis (1) (2) (3)EQ = Floating,OS = High,DJTXD eterministicjitter(2)DE = (3)See (2) (4) (3)(1)IncludesRJat 10-12.

7 (2)Measuredat the endsof referencechannelin Figure1 with ,VID= 1000mVpp, 5 Gbps, dB de-emphasisfromsource.(3)UI = 200 ps.(4)Rjcalculatedas RMSrandomjitter for JitterMeasurementSetupspacerFigure2. PropagationDelay6 SubmitDocumentationFeedbackCopyright 2013,TexasInstrumentsIncorporatedProduct FolderLinks:TUSB501 DE = 0dBTransitionbitConsecutive bitsDE = = = 0dBDE = = bitsVTX- DIFF- PP0V415mV-415mV400ps800ps0ps1200ps200ps6 00ps1000ps80%20%trtf tidleExittidleEntryVcmIN+IN-OUT+ AUGUST2013 REVISEDAUGUST2013 PARAMETERMEASUREMENTINFORMATION(continue d)Figure3. ElectricalIdle ModeExit and EntryDelayspacerFigure4. OutputRiseand Fall TimesspacerFigure5. TransmitterDifferentialVoltage,OS = LCopyright 2013,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback7 ProductFolderLinks:TUSB501 TUSB501 SLLSEG5A AUGUST2013 (continued)Figure6. Inputfor TypicalOutputMeasurementat TUSB501at TA= 25 C8 SubmitDocumentationFeedbackCopyright 2013, AUGUST2013 REVISEDAUGUST2013 PARAMETERMEASUREMENTINFORMATION(continue d)Figure7.

8 TypicalOutputEye for JitterMeasurementSetupin Figure1at TA= 25 C, DE = HIGH,OS = HIGH,EQ = NCCopyright 2013,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback9 ProductFolderLinks:TUSB501 TUSB501 SLLSEG5A AUGUST2013 (August2013)to RevisionAPage ChangedfromProductPreviewto 2013,TexasInstrumentsIncorporatedProduct FolderLinks:TUSB501 PACKAGE OPTION 1 PACKAGING INFORMATIONO rderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Op Temp ( C)Device Marking(4/5)SamplesTUSB501 DRFRACTIVEWSONDRF83000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-2-260C-1 YEAR-40 to 85T501 (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new : TI has announced that the device will be discontinued, and a lifetime-buy period is in : Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new : Device has been announced but is not in production.

9 Samples may or may not be : TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check for the latest availabilityinformation and additional product content : The Pb-Free/Green conversion plan has not been (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed by weightin homogeneous material) (3) MSL, Peak Temp.

10 -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.