Transcription of DEMO ONLY Version - IPC
{{id}} {{{paragraph}}}
Example: air traffic controller
DEMO ONLY Version - IPC
PhotosChip ComponentsJ-Lead ComponentsGull Wing ComponentsClass 3 Class 2 Class 1 IPC 2010 3000 Lakeside Drive, Suite 309-S Bannockburn, IL 60015-1219 +1 (tel.) +1 (fax) email: rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduc-tions of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United Rev. E 3m Rev. D 4m Rev. D 5m Rev. C 3m Rev. B 3m Rev. A 5m 1st printing 5m Association Connecting Electronics IndustriesDEMO only VersionThis is a promotional sample of the IPC Training and Reference Guide do not use this SAMPLE for training or reference is a not-for-profit association for the electronics industry. Please respect our may order printed copies from IPC at: or call (847) you for viewing this DRM-SMT-E DRM-SMT-EChip ComponentsClass 1 Class 2J-Lead ComponentsGull Wing ComponentsClass 3 Photos1 TABLE OF CONTENTS Introduction 2 Acceptance Criteria 2 Lead Free 2 Classification 3 Terminology 4 Chip Components Class 1 Dimensional Criteria 6 Class 2 Dimensional Criteria 8 Class 3 Dimensional Criteria 10 Solder Conditions Photos 12 J-Lead Components Class 1 Dimensional Criteria 18 Class 2 Dimensiona
Class 1 Class 2 Class 3 2 3 Classification Surface mount solder joint requirements are divided into three classes depending on the ultimate use, life …
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
ELECTRONICS INDUSTRIES Performance Test, Requirements for Surface Mount, SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT, O surfAce-mounT opTocoupler pAckAges, SurfAce-mounT opTocoupler pAckAges, Surface mount, Surface Mount LED Downlight Halo, Cooper, Surface Mount LED Downlight, Surface, Surface Mount Placement Equipment, Surface Mount Placement Equipment Characterization, Surface Mount Multilayer Ceramic Chip Capacitors