Transcription of Design Summary Multi-rowQuad Flat No …
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Design Summary Multi-rowQuad Flat No …
ApplicationReportSZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)..ABSTRACTT exasInstrumentsIncorporated(TI)introduce stheMulti-rowQuadFlatNo-lead(MRQFN) ,withoutperipherallyprotrudingleads, , :100 Pin(MRQFN)PackageMRQFNP ackageDetails(1)100 Pin(MRQFN)TotalNumberofPins100 Package*Length(L)mm9 Package*Width(W)mm9 PackageThickness(T) , (JEDEC)MSL3 / 260C(1)NominalDimensionsShown(SeePackage Drawingforfullinformation)1 SZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporatedPCB LAND PAD DETAIL A Note: The PCB land pattern illustrated is specificallydesigned by part number therefore, variations inthermal pad dimensions may exist betweenpart numbers. The exposed pad sizes can beconfirmed within the product data , contact your TI customerrepresentative for further ,05 TYP0,050,400,600,250,05 TYP0,05 TYP0,05 TYP0,05 TYP0,05 TYPEXAMPLE NON-SOLDERMASK OPENING (NOTE F)0,30 ,25 TYP0,600,407,308,807,308,800,25 TYP0,600,400,600,550,550,60 SEE NOTE8,508,500,30 SQDETAIL "A" (NonSolderMaskDefined)padsoverSMD(Solder MaskDefined)pads
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
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