Design Summary Multi-rowQuad Flat No …

1 ApplicationReportSZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)..ABSTRACTT exasInstrumentsIncorporated(TI)introduce stheMulti-rowQuadFlatNo-lead(MRQFN) ,withoutperipherallyprotrudingleads, , :100 Pin(MRQFN)PackageMRQFNP ackageDetails(1)100 Pin(MRQFN)TotalNumberofPins100 Package*Length(L)mm9 Package*Width(W)mm9 PackageThickness(T) , (JEDEC)MSL3 / 260C(1)NominalDimensionsShown(SeePackage Drawingforfullinformation)1 SZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporatedPCB LAND PAD DETAIL A Note: The PCB land pattern illustrated is specificallydesigned by part number therefore, variations inthermal pad dimensions may exist betweenpart numbers. The exposed pad sizes can beconfirmed within the product data , contact your TI customerrepresentative for further ,05 TYP0,050,400,600,250,05 TYP0,05 TYP0,05 TYP0,05 TYP0,05 TYPEXAMPLE NON-SOLDERMASK OPENING (NOTE F)0,30 ,25 TYP0,600,407,308,807,308,800,25 TYP0,600,400,600,550,550,60 SEE NOTE8,508,500,30 SQDETAIL "A" (NonSolderMaskDefined)padsoverSMD(Solder MaskDefined)padswhensurfacemountingMRQFN s (MRQFN)SZZA059 August2012 SubmitDocumentationFeedbackCopyright 2012, StencilDesignNotes(A)Alldimensionsarein millimeters.

2 (B)Thesedrawingsaresubjecttochangewithou tnotice.(C)PublicationIPC-7351is analternateinformationsourceforPCBlandpa tterndesigns.(D)Thesepackagesaredesigned tobesolderedtoa ,QuadFlat-PackPackages, , SLUA271, andProductDataSheetsforspecificthermalin formation,viarequirements, (E) (F)Customersshouldcontacttheirboardfabri cationsiteforrecommendedsoldermasktolera nces,recommendedviasizes,andanyviatentin grecommendationsforviasplacedin , ,powerdissipation, optionalandif usedtopsideis 0,2mmdependingonlayoutconstraints(NoteD, F above) August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporatedPCB Solder Mask Stencil Detail B 0,300,300,25 CORNERS ONLY0,25 TYP0,25 TYP0,25 TYP0,40 TYP0,55 TYP0,40 & F PCBLandPad/StencilDesignNotes ExampleStencilDesign0,1- 0,125mmThickStencil(Note E above)

3 SolderPasteRecommendationsTIrecommendsth euseoftype3 orfinersolderpastewhenmountinga : Containsfluxtoaidwettingofthesoldertothe PCBland. Theadhesivepropertiesofthepastewillholdt hecomponentin placeduringmanufacture. Pastebyvolumecontains~50% s aretypicallymanufacturedwithprintedcente rpadvolumesbetween50%and80%byareatofacil itatewettingoftheperipherysolderjointsan dtomaintaina standofffromtheboardsurface. Pasteselectionis ,"noclean"compositionsarepreferredduetot hedifficultyin (MRQFN)SZZA059 August2012 SubmitDocumentationFeedbackCopyright 2012, (NiPdAu)is (1)150to180 C 5 CTimeWithin5 C (1)Notestingusinga forcedcooldownof6 C persecondhasbeenconductedTIrecommendsfol lowingthesolderpastesupplier' ,thesolderpastemanufacturer'srecommendat ion,complexityofthePWB, ,opens, (DAP) August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporatedPhotogr aphic Cross Section ExamplesInner Row LengthThermal ViaPin Outer RowPin Inner s, TexasInstrumentsconducteda seriesofDOE s utilizingseveraldifferentSMTparametersin cluding.

4 Stencilthickness,stencilopening,PCBpadsi ze, x 3 or2 x 2 3 NorSMTR eleasemechanismcomponentthickness+ .05mmEquipmentandSettingsSolderPaste& Printer Model:MPMU ltraPrint3000 Series Paste:SenjuM705-GRN-360-KV SAC305 Type3 Speed: ( ) Pressure: 22lb ( ) Separation: ( ) UniversalGSM24688A ReflowModel: BT International:10zones X-rayforscreenprintandplacementverificat ion6 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SZZA059 August2012 SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporated3x3 DAP Pattern2x2 DAP August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012, (1)100-RKMDieSize5000 mx 5000 mTheta-JA(degC/W) (1) JEDEC testboard(JEDEC51-5)utilizinga dualsidedmetal10x 10thermalviaarrayat3wattpower& 20 C packagerepair/reworkstationis stronglyrecommendedforthisprocess.

5 ( ,Metcal,orDen-OnInst.)PackageReplacement Procedure: BakePWB& packageat125 C for9 hourspriortorework. Boardpreheat(pre-bakeis recommended) Reflowofcomponentsolder Vacuumremovalofcomponent CleaningandpreparationofPWBlands Screeningofsolderpasteeitherontotheparto rontotheboard Placementandreflowofnewcomponent InspectionofsolderjointsMRQFNR epairProcedureNotes: Reuseofa removedpackageis notrecommended. Usea packagehasexceededthefloorlife,re-bake(2 )for9 hoursat125 packagea maximumof3 times. Inspacerestrictedareaswhereprintingpaste viastencilmaynotpossible,optionsofpre-bu mpingpackageorpastedispensingmaybealtern atives. Becauseleadsarenotvisiblefromtopside,the useofa splitbeamopticalsystemis recommendedforpackagealignment. A nocleansolderis recommendedforSMTreworkduetodifficultyin cleaningunderneathmountedcomponents.

6 (2)Careshouldbetakentoinsureallcomponent sonPWBcanwithstandthebakeouttemperatureu sed8 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SZZA059 August2012 SubmitDocumentationFeedbackCopyright 2012, ( ) forthelatestinformationon100-RKM(MRQFN) August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012, lead-free/Green/RoHSavailable?compliantv ersionofMRQFN? ,reworkis possible, ,TexasInstrumentshasdevelopedsemi-automa ticSMTreworkmachinesandprofilesMRQFN s withanexternalplatingfinishthatis , is besttodiscardconstructionin ordertocomplywithlead- ,oncetheyhadMRQFN tolerance,placementaccuracy,andleadposit ionin production, duetospecifiedat , designonmyboard?onthesepackages? a tobeclassifiedasmoisturelevel3,thethisdo cumentandshouldreferencethedevice1stand2 ndreflowmustbecompletedwithinadatasheetf orspecificstencilandlandpatternweek(168h ours) thistimeframecannotbemet,it is ,theycanandtheideal2ndreflowprofileisres ultsduringprocesssetupusingX-raytoaidint hesameasthe1st( thisbulletin).

7 10 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SZZA059 August2012 SubmitDocumentationFeedbackCopyright 2012, : SolderPasteQuality- Uniformviscosity,freefromforeignmaterial s,andprocessedbefore PCBQ uality- Clean, flat , Avoidrightanglesor"T" PlacementAccuracy- MRQFN packagesself-increasetracecapacitancecau singsignalcenteraslongasa majorportion( )oftheleadis in contactwiththesolderpastecoveredlandarea ontheboard. Minimizepowersupplyloopsbykeepingpoweran dgroundtracesparallelandadjacenttoeach SolderReflowProfile- A SolderVolumeis importanttoensureoptimumcontactofallinte ndedsolderconnections. Excessamountofsolderpasteonthethermalpad duringcustomer s August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporatedIMPORTA NTNOTICET exasInstrumentsIncorporatedanditssubsidi aries(TI)reservetherighttomakecorrection s,enhancements,improvementsandotherchang estoitssemiconductorproductsandservicesp erJESD46,latestissue,andtodiscontinueany productorserviceperJESD48, (alsoreferredtohereinas components )

8 AresoldsubjecttoTI s ,in accordancewiththewarrantyin TI s ,testingofallparametersofeachcomponentis productsandapplications, ,eitherexpressorimplied,is grantedunderanypatentright,copyright,mas kworkright,orotherintellectualpropertyri ghtrelatingtoanycombination,machine,orpr ocessin licensetousesuchproductsorservicesora licensefroma thirdpartyunderthepatentsorotherintellec tualpropertyofthethirdparty,ora TIdatabooksordatasheetsis permissibleonlyif reproductionis withoutalterationandis accompaniedbyallassociatedwarranties,con ditions,limitations, is solelyresponsibleforcompliancewithallleg al,regulatoryandsafety-relatedrequiremen tsconcerningitsproducts,andanyuseofTIcom ponentsin itsapplications, hasallthenecessaryexpertisetocreateandim plementsafeguardswhichanticipatedangerou sconsequencesoffailures,monitorfailuresa ndtheirconsequences, , ,TI s goalis , FDAC lassIII(orsimilarlife-criticalmedicalequ ipment)unlessauthorizedofficersofthepart ieshaveexecuteda enhancedplastic solelyattheBuyer's risk,andthatBuyeris solelyresponsibleforcompliancewithallleg alandregulatoryrequirementsin , ; , :TexasInstruments,PostOfficeBox655303,Da llas,Texas75265 Copyright 2012,TexasInstrumentsIncorporat