Transcription of Failure Analysis (FA) Introduction (IC Failure Mode)
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Failure Analysis (FA) Introduction (IC Failure Mode)
Failure ModeFailure ModeTung-Bao Lu1 of 29 Failure Analysis (FA) IntroductionFailure Analysis (FA) Introduction ((IC Failure Mode) IC Failure Mode) Failure ModeFailure ModeTung-Bao Lu2 of 29leadframechipgold wireEMCdie-padStructure of conventional packageStructure of conventional packagePhysical Failure (Structure)- Popcorn- Delamination- Crack (Package/Die)Electrical Failure (Connection)- Open- Short- Leakage- FunctionIn-Process Failure (Production)- Front-end (before molding)- Back-end (After molding)- Testing (FT/Burn-in)Reliability Failure (Qualification)- Temperature- Humidity- Pressure- VoltageFailure ClassificationFailure ModeFailure ModeTung-Bao Lu3 of 29 Failure Mechanism(1) Moisture absorption(L-1: 85oC/85%RH) (L-3: 30oC/60%RH)(2) Moisture vaporizationduring heating(Reflow, 235oC/10s)(3) Vapor force separating(delamination)(4) Popcorn forming(package crack)(collapsed void)popcornChipdie-padleadframecrackPop corn ( )Popcorn ( ) Failure ModeFailure ModeTung-Bao Lu4 of 29 TQFP package (bottom popcorn)FBGA package (top popcorn) Failure ModeFailure ModeTung-Bao Lu5 of 29leadframechipdie-padgold wireEMC
Failure Mode Tung-Bao Lu 8 of 29 Assembly FlowAssembly Flow Lapping Dicing Die attach Wire bond Molding Marking Dejunk/Trim Plating Forming Testing Packing /Ship
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