Transcription of IC Reliability 20091023 - isu.edu.tw
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IC Reliability 20091023 - isu.edu.tw
1IC (IC Package Reliability Testing Introduction )Meng-Kae Shih, ASE GroupOctober 23, 2009 Presented bya2 85282 0953083610 3 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT) Stress Simulations4 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)5 Introduction 5 1. 2. 3. 6 Introduction What is stress =( ) =( )FAF: ( =N)A: ( m2 mm2) ( N/m2=Pa) (stress, ) (index) 7 Introduction (Stress) ( deformation ) (Strength of materials) (Mechanics of deformable bodies)DelaminationsPackageSolderPCBW arpage8 IntroductionNormal stress - F FF Shear stress- 9 Introduction Normal strain ( )LLLLLLLL L =H = HHHHHHHH Shear strain ( )101D Tensile Bar Test Dog Bone and Strain-meterDog bone dimensionW x L x H---10 x 60 x3 mm wLHWith strain meter11 Dog-bone Tensile Test Necking (large deformation )Fig.
20 Thermal deformation -warpage • 封裝體若有過大的翹曲度則在板廠焊接時容易斷路而使產品失效。 Compound Die Epoxy Substrate
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