IC Reliability 20091023 - isu.edu.tw

1 1IC (IC Package Reliability Testing Introduction )Meng-Kae Shih, ASE GroupOctober 23, 2009 Presented bya2 85282 0953083610 3 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT) Stress Simulations4 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)5 Introduction 5 1. 2. 3. 6 Introduction What is stress =( ) =( )FAF: ( =N)A: ( m2 mm2) ( N/m2=Pa) (stress, ) (index) 7 Introduction (Stress) ( deformation ) (Strength of materials) (Mechanics of deformable bodies)DelaminationsPackageSolderPCBW arpage8 IntroductionNormal stress - F FF Shear stress- 9 Introduction Normal strain ( )LLLLLLLL L =H = HHHHHHHH Shear strain ( )101D Tensile Bar Test Dog Bone and Strain-meterDog bone dimensionW x L x H---10 x 60 x3 mm wLHWith strain meter11 Dog-bone Tensile Test Necking (large deformation )Fig.

2 : Animation of tensile bar : Load and extension curve of ?12 Introduction Thermal deformation25 0C125 0C-40 0 CExpandingShrinking 1 2 Fig.: Thermal bulking of railways13 Introduction Thermal strain tand (Coefficient of thermal expansions) LLT1 0CT2 0C T=T2-T1Lt =TETCt == ..LTelongation** == 14 Thermal expansion mismatchCompound 30 ppm/ CSubstrate 15 ppm/ CHeatingCoolingSubstrateCompoundEa(T), aa(T), naEb(T), ab(T), nb2 Ltt ++=101d)(141222 TTabTbababaTEEEEEEt ConvexConcave Bi-material curvatureWarpage is dependent on components thickness, Young s modulus and CTE Glass transition temperature - TgT tT Tg 1 2Tg16 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)17 StressWaferPackagePCBP roductGrinding, saw, die attach, wirebondimpact,Molding, ball mount, test, Reliability test, shipping, SMT, test, shipping, Assembling, stress, Drop, bend, vibration, Stress (thermal stress) LL LL = e*E = - * T*E19 Thermal deformation - warpage (warpage) CTE T > 0.

3 1> 2=L 1 TL 2 T+(convex)=20 Thermal deformation - warpage CompoundDieEpoxySubstrate C=10~20/40~70 ppm/oC D=3 ppm/oC E=40/200 ppm/oC S=16 ppm/oC25oCRoom temperature 25oCRoom temperature 255oCSMT reflow(Before SMT)SMT failedCTE mismatch21 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)CompoundDieEpoxySubstrate C=10~20/40~70 (PPM/oC) D=3 (PPM/oC) E=40/200 (PPM/oC) S=16 (PPM/oC)Thermal Stress (CTE mismatch)TemperatureVariationThermal Stress23 LevelT&H Cond.(oC/ %RH)Floor Life Time after Unpack12345685/85, 168 HRS85/60, 168 HRS30/60, 192 HRS30/60, 96 HRS30/60, 72 HRS30/60, 6 HRSU nlimited1 Year168 HRS (1 Week)72 HRS (3 Days)48 HRS (2 Days)6 HRSM oisture Sensitivity LevelsMoisture24 Reflow ProfileProfile condition (for Pb-free) Between 155 ~ 165 C: 60 ~ 90 sec. Above 220 C: 60 ~ 90 sec.

4 Peak temperature : 250 ~ 255 CProfile condition (for Sn-Pb) Between 145 ~ 155 C: 60 ~ 90 sec. Above 183 C: 60 ~ 90 sec. Peak temperature : 210 ~ 220 CCompoundDieEpoxySubstrateDelaminationDe laminationMoisture soak IR reflowCompoundDieEpoxySubstratePopcornPo pcornMoisture soak IR reflowCompoundDieEpoxySubstrateDie CrackDie Crack31 Solder Joint Failuree-Solder ball crack--TCTS older bump crack--TCTS older IMC crack--DropSolder bump crack--EM32 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)33 WaferFirst Level Packaging(Chip to IC packaging)Second Level Packaging(Package assembly to circuit card)Third Level Packaging(Circuit card assembly to backplane)Electron Product Component34 SPEC NumberSPEC Title64-31-0000-0137 SOP OF STATIC MTS - PULL TEST - 64-31-0000-0138 SOP OF STATIC MTS - AMD PULL TEST - AMD 64-31-0000-0139 SOP OF SURFACE MOUNT PROCEDURE FOR STRESS Reliability LAB 64-31-0000-0140 SOP OF DYE PENETRATION TEST 64-31-0000-0141 SOP OF ASE FREE DROP TESTASE 64-31-0000-0142 SOP OF KAWASAKI DROP TESTKAWASAKI.

5 64-31-0000-0143 EIAJ 3-POINT CYCLIC BENDING TEST USING IN DYNAMIC MTSEIAJ 3 64-31-0000-0144 EIAJ COMPRESSION TESTEIAJ 64-31-0000-0145 SOP OF STATIC MTS - SHEAR TEST - SPEC List Of Experiment SOP 64-31-0000-0137~64-31-0000-015435 SPEC NumberSPEC Title64-31-0000-0146 SOP OF 3-POINT BEND TEST FOR ATI BOARDATI 3 64-31-0000-0147 SOP OF JEDEC DROP TEST JEDEC 64-31-0000-0148 DIE STRENGTH TEST BY MICRO FORCE TESTERDIE - 64-31-0000-0149 SOP OF STATIC MTS - COMPRESSION TEST - 64-31-0000-0150 SOP OF MONOTONIC 3 AND 4 POINT BEND TEST 64-31-0000-0151 SOP OF COMPRESSION TEST BY MICRO FORCE TESTER 64-31-0000-0653 SOP OF SHADOW MOIRE 64-31-0000-0153 SOP OF LEAD PULL TEST BY MICRO FORCE TESTER 64-31-0000-0154 SOP OF 4-POINT CYCLIC BENDING TEST IN DYNAMIC MTS SPEC List Of Experiment SOP 64-31-0000-0137~64-31-0000-015436 Mechanical ReliabilityStrain Rate Effect02468100102030405060 True tensile stress (MPa)True tensile strain (%)Strain-rate (s-1) 10-4 10-3 10-2 10-1 High strain-rateLow strain-rateStrain-rate (log10, s-1)0-2-4-6642 Thermal stressCyclic bendDrop/shockUniaxial tensile testBall impact testHopkinson Bar testBall shear testEDEST ransition zoneMaterials become apparently stiffer at high strain rate Warpage Measurement Validate Finite Element Modeling Optimize Process & Reflow Profiles Shadow Moir 38 GratingLight SourceCCD CameraMonitorVCRC omputerSampleShadow Moir ComponentsabsourceobserverLWpD tantan+=pww (Out-of plane displacement)p (pitch) (CCD )

6 Shadow Moir - PrincipleTherMoirecan simulate soldering processes(wave, convective, IR reflow) and quantify out-of-plane displacements at any given temperature(s). Thefringe patterns and 3D surface plots shown are froman 8 X 8 multi-layer printed wiring board going through an IR reflow process. Shadow Moir Shadow Moir Measurement Results26 C150 C150 C225 C26 CShadow Moir Warpage at Different Temperature43 Die strength (Micro-force tester) For control of die crack 3-point/4-point bending Capable of 60oC to 300oC B C D E A Die Strength Test443-point bending238 LPtc =L= spant= beam widthc= half-depth of beamP= peak load in the 3-point bend test= maximum tensile stress of beam LP2C Polished wafers possess the highest die strength Die size and thickness do not cause significant effect B C D E A Beam theory (flexural strength)Die Strength Test45 Set up the fixture into MTS BarDiscDieSubstrateEpoxySchematic for pull testAdhesive strength (Material testing system)

7 For control of delamination Room temperature Dye stain to identify the failure modesPull Test46 Shear TestTwist TestTwist & Shear Tests47 SOPQFPLead Pull Tests48 Summary 1 Package-level Stress MeasurementsEvaluate solder past adhesionLead Pull TestsAvoid delaminationPull testAvoid die crackDie strength testWarpage (coplanarity on SMT)Shadow MoirePurposeTest item49 Contents Introduction to Stress Stress in a Package Phenomena Associated with Stress Reliability Tests & SPEC Board Level Reliability Tests (BLRT)50 Infant mortality regionUseful life regionWearout region( 48 ~ 1,000,000 hrs )048 TimeSHORT TERMLONG TERMRELIABILITYRELIABILITY106 Failure sample sizeFailure sample size .. , , BurnBurn--in test in test ..Bathtub Curve51 Most Reliability tests are acceleratedtest levelStrength of productsStresses on productsDistributionStress levelStrength of productsStresses on productsFailedDistributionDegradationStr ess levelStrength of productsStresses on productsDistributionAcceleratedFailedRea l case(after several years)Accelerated test(accomplished in several days)SimulationStrength distribution of fresh productsDistribution of environment stresses(Fail potential)(Failure mode) Reliability Test52 Test Methods Test Conditions1.

8 Thermal Cyclic Test-40 C ~ 125 C 2. Cyclic Bend Test1-3 mm/1-3 Hz3. JEDEC Drop/Shock TestJESD22-B110/JESD22-B1114. Free Drop TestAdjustable drop heights5. Vibration TestMIL-STD-810E6. Electromigration TestCurrent & high temperature Board Level Reliability Tests (BLRT)Joint Fatigue Life Evaluation53 BLRT: Temperature Cycling Test54 Package mounting (by Pick & Place machine)Solder pastePCBTest Procedures55 Soldering equipment & thermal tracer10 heat zones ( up / down ) Reflow equipmentTest board Thermocouple Thermal recordMeasured vehicleTest Procedures56 X-ray inspectionInspection whether the void & bridge in solder jointTest Procedures57TC chamber* Single chamber* Temperature range 55oC~150oC* Air to air type* Real time monitoring of resistance* 56 test boards of test capacity* Max. ramp up/down rate: 15oC/minDAS (data collect system)* Datalogger function* Max. 840 channels for 2-wire measurementTC Chamber & DASTC chamberDAS58+150 (+15, -0)-40 (+0, -10)M+110 (+15, -0)-55 (+0, -10)L+125 (+15, -0)-0 (+0, -10)K+100 (+15, -0)-0 (+0, -10)J+115 (+15, -0)-40 (+0, -10)I+150 (+15, -0)-55 (+0, -10)H+125 (+15, -0)-40 (+0, -10)G+150 (+15, -0)-65 (+0, -10)C+125 (+15, -0)-55 (+0, -10)B+85 (+10, -0)-55 (+0, -10)ANominalTs (max) ( C) with TolerancesNominalTs (min) ( C) with TolerancesTestConditionThermal Cycling Test Condition59-40 C ~ 125 C15min.

9 Ramp and 15min. dwell-2002040608010012005001000150020002 500 Time (second)Temperature ('C)PrescribedMeasured-50-25025507510012 5150010002000300040005000 Time (second)Temperature ('C)PrescribedMeasured0 C ~ 100 C10min. Ramp and 5min. dwellTemperature Profile60 Board sidePackage sidePackage sideBoard side Solder joint crack is common failure modeFailure Mode61 Predicted Years of Service Find Accelerated Factor (AF)62 Predicted Years of Service Find Accelerated Factor (AF)Given failure risk = 400 cycles from result of BLRT Got a predicted year of service63 Board Level Drop Test64 Four different types of drop test are performed in ASEJEDEC board-level drop methodFree drop mDrop heightHorizontal dropVertical dropPackageTest mDrop heightHorizontal dropVertical dropPackageTest boardDummy massModified free drop methodBending impact methodImpact loadingASE Capability65 Dimensions: 220 x 139 mm2. Standard drop PCB is compatible to TC test board.

10 Non-ASE-standard PCB can be also standard PCB for free dropCustomer s defined PCB for free dropASE Standard PCB66 This method is combined 4-point/3-point monotonic bend test with a high speed impact load. Maximum stroke speed in ASE is 300 mm/s by using MTS apparatus and fixtureTest apparatus and fixtureBending Impact Method67 JEDEC Board Level Drop Test68 JESD22-B110/JESD22-B111 Condition B: criterion: intermittent 1000 ohmRigid BaseStrike SurfaceDrop TableBase PlateGuide RodsDrop TableTest vehicleAccelerometerBase PlateStandoffs GoTimeAccelerationStrike surfaceJEDEC BL Drop Test (JESD22-B111)69 Comparing two familiar drop test methods: Free fall drop test An original method, economical, easy to set up apparatus. However, test results are not steady. Acceleration pulse controlled drop test (JEDEC, Nokia) More expansive methods with a threshold of test skill. Detail PCB and test procedures are proposed on JEDEC documents. Results are steady and pulse controlled board-level drop methodFree drop mDrop heightHorizontal dropVertical dropPackageTest boardWhy we prefer JEDEC drop test method?