Transcription of Lead Free Solder Reflow - IXYS CORPORATION
{{id}} {{{paragraph}}}
1 IXYS CORPORATION - Bassett Street; Santa Clara, CA 95054; Tel: (408) 982-0700; Fax: (408) 496-0670 2006 IXYS All rights reservedAN 0601 Lead free Solder Reflow for Semiconductor Power DevicesThe solders used in the Electronic Industry arerapidly converting from Tin/Lead (Sn/Pb) solders toLead- free (Pb- free ) solders to meet newenvironmental and Green requirements. Many ofthese requirements are controlled by laws andregulations, which vary by country and has been a parallel shift for years from through-hole to surface mount assembly, which can oftencompound the Pb free soldering issues. This paperwill address the optimization of Pb free solderingconditions, with a focus on differences between Sn/Pb and Pb free soldering.
1 IXYS Corporation - www.ixys.com 3540 Bassett Street; Santa Clara, CA 95054; Tel: (408) 982-0700; Fax: (408) 496-0670 © 2006 IXYS All rights reserved
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}
Lead-Free Solder Bump Technologies for Flip-Chip, Lead-Free Solder Bump Technologies for Flip-Chip Packaging, Lead-Free LEAD Soldering Guide, Free, Environment-friendly Lead-Free Solder, Stay-Brite® silver-bearing solders, The Impact of Intermetallic Layers, The Impact of Intermetallic Layers on the Brittleness, Why Lead-free, Requirements for Electronic Grade Solder, Solders for Electronic Soldering Applications, Suitable Palladium and Gold Thickness