Transcription of Microelectronics Reliability: Physics-of-Failure ... - NASA
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Microelectronics Reliability: Physics-of-Failure ... - NASA
National Aeronautics and Space Administration Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-5 2/08. National Aeronautics and Space Administration Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance Mark White Jet Propulsion Laboratory Pasadena, California Joseph B. Bernstein University of Maryland College Park, Maryland NASA WBS: JPL Project Number: 102197.
(NBTI). In Chapter 3, the modules and processes of FaRBS reliability simulation, model parameter extraction, and derating of voltage and temperature for reliability are described. Sensitivity analysis and spacecraft, planets, instrument, C-matrix, events (SPICE) simulation of the wearout models are also discussed.
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