Transcription of MSL Ratings and Reflow Profiles (Rev. A) - TI.com
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MSL Ratings and Reflow Profiles (Rev. A) - TI.com
1 SPRABY1A February2015 RevisedDecember2018 SubmitDocumentationFeedbackCopyright 2015 2018,TexasInstrumentsIncorporatedMSLR atingsand ReflowProfilesApplicationReportSPRABY1A February2015 RevisedDecember2018 MSLR atingsandReflowProfilesAllanWebberand relationshipof MSLratingto the customerproductionfloorlife andsurfacemountreflowtemperaturesfor TI MoistureSensitivityLevel(MSL).. of Figures1 Exampleof ComponentMSLR ating,PeakReflow,and MaximumFloorLife at ,2,3 Ratingand PeakReflowLabelingExampleson Representationof the J-STD-020 ClassificationProfile(not to scale)..4 List of Tables1 FactoryFloorLife @ 30 (Tc) Basedon trademarksare the propertyof theirrespectiveowners.
• Liquidous temperature (TL) for lead-free soldering - this is approximately 217°C. This varies according to the used solder alloy. • The Peak temperature (Tp) for the reflow profile, measured at top of the package. – For the user (board assembly process), Tp must not exceed Tc as shown in Table 2. For the IC
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