Small outline package
Found 10 free book(s)![14-Lead Standard Small Outline Package [SOIC N] …](/cache/preview/f/a/1/1/8/8/6/c/thumb-fa11886c677187741ad4feccea0cdd28.jpg)
14-Lead Standard Small Outline Package [SOIC N] …
www.analog.comTitle: R-14 Author: Analog Devices, Inc. Subject: Outline Dimensions Keywords: 14-Lead Standard Small Outline Package [SOIC_N] Created Date: 7/14/2004 3:30:42 PM
![14-Lead Thin Shrink Small Outline Package [TSSOP] …](/cache/preview/9/2/c/f/0/f/5/7/thumb-92cf0f57f8718995f8c928275c7a84a9.jpg)
14-Lead Thin Shrink Small Outline Package [TSSOP] …
www.analog.coma 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters 5.10 4.50 4.40 4.30 14 8 1 7 6.40 BSC PIN 1 5.00 4.90 0.65 BSC SEATING 0.15 0.05 0.30 1.20 MAX 1.05
Features Mechanical Data - Diodes Incorporated
www.diodes.com1N4148WT Document number: DS30396 Rev. 17 - 2 © Diodes Incorporated 4 of 5 www.diodes.com March 2018 1N4148WT c Package Outline …
LM108/LM208/LM308 Operational Amplifiers
www.mit.eduLM108/LM208/LM308 Operational Amplifiers Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number LM308N NS Package Number N08E Ceramic Flatpack Package (W) Order Number LM108AW/883 or
NanoStar & NanoFree 300 m Solder Bump Wafer …
www.ti.comSBVA017 NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale Package Application 5 2 Physical Description 2.1 Package Characteristics The NanoStar package family is a Die Size BGA as identified by the JEDEC standards organiza-
Ultra-low clamping single line bidirectional ESD ...
www.st.com3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance.
LAN8720A/LAN8720Ai - Small Footprint RMII …
ww1.microchip.comSMSC LAN8720A/LAN8720Ai Revision 1.4 (08-23-12) DATASHEET PRODUCT FEATURES Datasheet LAN8720A/LAN8720Ai Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support
LM1596/LM1496 Balanced Modulator-Demodulator
www.mit.eduLM1596/LM1496 Balanced Modulator-Demodulator Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number LM1496N NS Package Number N14A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
hermetic dual-in-line ceramic packages (F3A suffix), …
www.ti.comPACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Addendum-Page 2 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device.
Optocoupler, Phototransistor Output, with Base …
www.vishay.comIL211AT, IL212AT, IL213AT www.vishay.com Vishay Semiconductors Rev. 1.9, 21-Dec-10 1 Document Number: 83615 For technical questions, contact: optocoupleranswers ...
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Standard Small Outline Package [SOIC, Analog Devices, Outline, Small Outline Package, 14) Dimensions shown in millimeters 5.10, Package Outline, PACKAGE, NanoStar & NanoFree, LAN8720A/LAN8720Ai - Small Footprint RMII, LAN8720A/LAN8720Ai Small Footprint RMII, Optocoupler, Phototransistor Output, with Base