Application Note AN068 - TI.com
Application Note AN068 Adapting TI LPRF Reference Designs for Layer Stacking By Rea Schmid Keywords • Board Stacking for RF Design • VSWR changes with Stacking • Bandwidth and Layer Stacking • PCB for CC25xx Devices • 062 Mil Layer Stacking • FR4 Dielectric Material • EM for Low Power Wireless • Board performance for RF Design • …
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