Call for Papers - エレクトロニクス実装学会
Call for Papers 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference Major Topics Advanced Packaging 2.5D/3D, Advanced CSP and POP, Advanced Flip-Chip, Automotive,
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A 36 W Wireless Power Transfer System with 82% …
www.jiep.or.jp32 Transactions of The Japan Institute of Electronics Packaging Vol. 6, No. 1, 2013 1. Introduction Recently, interest in wireless power transfer (WPT)
Low Warpage Coreless Substrate for IC Packages
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Comparison of Erosion Rates of SUS304 and SUS316 …
www.jiep.or.jp35 Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn–3Ag–0.5Cu Solder Ikuo Shohji*, Kazuhito Sumiyoshi * and Makoto Miyazaki**
High Performance 3D Package for Wide IO Memory
www.jiep.or.jp45 Mohammed et al.: High Performance 3D Package for Wide IO Memory (3/8) Figure 8 shows that BVA offers the smallest pitch and highest IO compared to BGA (Ball Grid Array) PoP and Through Mold Via (TMV) PoP.
Micro Structure Observation and Reliability …
www.jiep.or.jp73 Orii et al.: Micro Structure Observation and Reliability Behavior (1/14) [Technical Paper] Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps
Inhibiting Cracking of Interfacial Cu6Sn5 by Ni …
www.jiep.or.jp46 Transactions of The Japan Institute of Electronics Packaging Vol. 2, No. 1, 2009 Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn- …
Mechanical Shock Durability Studies of Sn–Ag–Cu–Ni BGA ...
www.jiep.or.jp63 in Figure 3. The BGA pad surface finish consisted of ENIG, with Ni plating and Au plating from 1.6 to 2.0 μm and from 0.07 to 0.10 μm, respectively.
Reduction of the Oxide Layer on a Lead-Free Solder ...
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