Search results with tag "Low warpage coreless substrate for ic packages"

Low Warpage Coreless Substrate for IC Packages

55 Kurashina et al.: Low Warpage Coreless Substrate (1/8) 1. Background With a continuous enhancement of performance and feature downsizing of electronic products, the use of Ball grid array (BGA) packages is spreading rapidly as elec-

  Packages, Substrates, Low warpage coreless substrate for ic packages, Warpage, Coreless, Low warpage coreless substrate