Call for Papers - エレクトロニクス実装学会
Call for Papers 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference Major Topics Advanced Packaging 2.5D/3D, Advanced CSP and POP, Advanced Flip-Chip, Automotive,
Download Call for Papers - エレクトロニクス実装学会
Information
Domain:
Source:
Link to this page:
Documents from same domain
A 36 W Wireless Power Transfer System with 82% …
www.jiep.or.jp32 Transactions of The Japan Institute of Electronics Packaging Vol. 6, No. 1, 2013 1. Introduction Recently, interest in wireless power transfer (WPT)
Low Warpage Coreless Substrate for IC Packages
www.jiep.or.jp55 Kurashina et al.: Low Warpage Coreless Substrate (1/8) 1. Background With a continuous enhancement of performance and feature downsizing of electronic products, the use of Ball grid array (BGA) packages is spreading rapidly as elec-
Comparison of Erosion Rates of SUS304 and SUS316 …
www.jiep.or.jp35 Comparison of Erosion Rates of SUS304 and SUS316 Stainless Steels by Molten Sn–3Ag–0.5Cu Solder Ikuo Shohji*, Kazuhito Sumiyoshi * and Makoto Miyazaki**
High Performance 3D Package for Wide IO Memory
www.jiep.or.jp45 Mohammed et al.: High Performance 3D Package for Wide IO Memory (3/8) Figure 8 shows that BVA offers the smallest pitch and highest IO compared to BGA (Ball Grid Array) PoP and Through Mold Via (TMV) PoP.
Micro Structure Observation and Reliability …
www.jiep.or.jp73 Orii et al.: Micro Structure Observation and Reliability Behavior (1/14) [Technical Paper] Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps
Inhibiting Cracking of Interfacial Cu6Sn5 by Ni …
www.jiep.or.jp46 Transactions of The Japan Institute of Electronics Packaging Vol. 2, No. 1, 2009 Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn- …
Mechanical Shock Durability Studies of Sn–Ag–Cu–Ni BGA ...
www.jiep.or.jp63 in Figure 3. The BGA pad surface finish consisted of ENIG, with Ni plating and Au plating from 1.6 to 2.0 μm and from 0.07 to 0.10 μm, respectively.
Reduction of the Oxide Layer on a Lead-Free Solder ...
www.jiep.or.jp1 Reduction of the Oxide Layer on a Lead-Free Solder Material by Hydrogen Radicals S. Kagata, T. Nakashima and A. Izumi Kyushu Institute of Technology, 1 …
Related documents
Confirmed Invited Speakers for Web - icm2018sf.org
www.icm2018sf.orgConfirmed Invited Speakers as of February 9, 2018 PLENARY SPEAKERS ROBERT BUHRMAN Cornell University TOMÁŠ JUNGWIRTH Academy of Sciences of the Czech Republic SATORU NAKATSUJI The University of Tokyo
PEM Technical Overview - Hinds Instruments
www.hindsinstruments.comPRODUCT BULLETIN Technology for Polarization Measurement 5 Photoelastic Modulators PEM Technical Overview OPTICAL HEAD SPECIFICATIONS Model Optical Material Nominal
IRMMW -THz 2018
irmmw-thz2018.orgMasahiko Tani, University of Fukui, Japan Toshitaka Idehara, University of Fukui, Japan Masaaki Ashida, Osaka University, Japan Iwao Hosako, NICT, Japan
The CVD diamond booklet - Diamond Materials - Advanced ...
www.diamond-materials.comThe CVD diamond booklet Page 12 Optical specifications of Diamond Materials The core competences of Diamond Materials include the manufacturing of high purity CVD ...
Modeling Dielectric Absorption in Capacitors
www.designers-guide.orgIntroduction 2 of 19 The Designer’s Guide Community www.designers-guide.org 1.0 Introduction A fundamental limitation in the accuracy of sample-and-holds and A-D converters is a phenomenon called dielectric absorption, which also goes by the names of dielectric
Man Basket Safety Training - Lick Observatory
loen.ucolick.orgthe! .'nay kŒea for to P.O„ Box Aoy modification M.nbaüet by to the if work qnå exfet.y. The Lifting is foy cr theiË to work and exceed
Terahertz Waves for Communications and Sensing
www.jhuapl.edu348 JOHNS HOPKINS APL TECHNICAL DIGEST, VOLUME 25, NUMBER 4 (2004) M. J. FITCH AND R. OSIANDER T Terahertz Waves for Communications and Sensing Michael J. Fitch and Robert Osiander he development of technology in the THz frequency band has seen rapid progress
IEEE-IMBioC 2018
www.imbioc-ieee.orgIEEE International Microwave Biomedical Conference IEEE-IMBioC 2018 June 14-15, 2018 Pennsylvania Convention Center, Philadelphia, USA www.imbioc-ieee.org 1, , , , , ,
CALL FOR PAPERS - imws-ieee.org
imws-ieee.orgIEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes Ann Arbor, Michigan, 16-18 July 2018 Conference General Chair