Hermetic,Packages - Texas Instruments
Package Configuration Package Characteristics Ceramic Sidebrazed Dual-In-line Package (SB) • Through Hole Package • Brazed Straight Leads to Pads on Package Side • Gold Plate or Solder Dip Lead Finish • Multilayer Ceramic Package • Solder Seal • Footprint Compatible with Cerdip and MDIP Ceramic Leadless Chip Carrier (LCC) • …
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LM136-2.5,LM236-2.5,LM336-2 - TI.com
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SimpleLink™ CC3120, CC3220 Wi-Fi ... - Texas …
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www.ti.com SNVS749F - Texas Instruments
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1.8-V Micropower CMOS Operational Amplifier …
www.ti.com5 OPA2333-HT www.ti.com SBOS483I –JULY 2009–REVISED MAY 2015 Product Folder Links: OPA2333-HT Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback
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www.ti.comLMC6482 www.ti.com SNOS674E –NOVEMBER 1997–REVISED APRIL 2015 5 Pin Configuration and Functions D, DGK and P Packages 8-Pin SOIC, VSSOP and PDIP (Top View) Pin Functions PIN TYPE DESCRIPTION NO.
OPAx354 250-MHz, Rail-to-Rail I/O, CMOS …
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TMS320C28x DSP/BIOS 5.x Application …
www.ti.comSPRU625L—August 2012 API Functional Overview 9 Submit Documentation Feedback www.ti.com Naming Conventions 1.2 Naming Conventions The format for a DSP/BIOS operation name is a 3- or 4-letter prefix for the module that contains the
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