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Hermetic,Packages - Texas Instruments
Package Configuration Package Characteristics Ceramic Sidebrazed Dual-In-line Package (SB) • Through Hole Package • Brazed Straight Leads to Pads on Package Side • Gold Plate or Solder Dip Lead Finish • Multilayer Ceramic Package • Solder Seal • Footprint Compatible with Cerdip and MDIP Ceramic Leadless Chip Carrier (LCC) • …
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