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Land Grid Array (LGA) Socket and Package Technology - Intel

Land Grid Array (LGA) Socket and Package Technology - Intel

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handled with vacuum wand or by hand. LGA Package in Thermoformed Tray. Land Side Cover. Avoid touching. gold pads! Note: LGA packages dropped with or without the land side cover should be scrapped. Tab. Substrate. Stepped. IHS. Orientation. Notch. Capacitors. Gold Pads

  Intel, Vacuum

Download Land Grid Array (LGA) Socket and Package Technology - Intel


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