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Land Grid Array (LGA) Socket and Package Technology - Intel

Land Grid Array (LGA) Socket and Package Technology - Intel

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for socket Load Plate interface • Land Grid Array (no pins, exposed land pads), gold pads • Notched substrate for orientation control • Shipping Media: Thermoformed trays • Land Side Cover (LSC) to protect LGA package land pads from scratches and contamination when handled with vacuum wand or by hand. LGA Package in Thermoformed Tray

  Intel, Interface, Sockets

Download Land Grid Array (LGA) Socket and Package Technology - Intel


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