LGA1150 Socket — Application Guide - Intel
performance using total package power. Defined as (TCASE – TS) / Total Package Power. Ψ sa Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power. SMD The Solder Mask Defined pad is typically a pad in a flood plane where the solder ...
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