Reference Only - Murata Manufacturing
95% covered with new solder coating. Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s 7-3.Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method
Download Reference Only - Murata Manufacturing
Information
Domain:
Source:
Link to this page:
Documents from same domain
Reference Only Spec No. JENF243F-0031G-01 EMIFIL (Three ...
www.murata.com② Structure S : Built-in Ferrite Beads Type ③ Style ④ Features ⑤ Temperature Characteristics B3:±10%（-40～+85℃ at 20℃） ⑥ Rated Voltage 2A :2A→100VDC、1H→50VDC ⑦ Capacitance Marked three digits system.(Ex. 22pF→220、22000pF→223) ⑧ Lead Type Q55 : Bulk Lead Type :Straight Lead
Chip Ferrite Bead BLM31 Murata Standard Reference ...
www.murata.comPer AEC-Q200-002 Meet Table A after testing. ESD Rank: Refer to Item 3. Rating 18 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Characterization Measured : Impedance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) ...
Reference Only - Murata Manufacturing
www.murata.comPer AEC-Q200-002 Meet Table C after testing. ESD Rank: Refer to Item 3. Rating. 18 Solderbility Per J-STD-002 Method b : Not Applicable 75% of the terminations is to be soldered. 19 Electrical Characterization Measured :Capacitance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) ...
Reference Only - Murata Manufacturing
www.murata.comIt shall be soldered on the Glass-epoxy substrate. Substrate : 100mm×40mm×0.8mm Deflection : 1.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s 7-2-3 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually
Related documents
DuPont Kapton® HN
www.dupont.comSolder Float pass IPC-TM-650 Method 2.4.13A Smoke Generation D m =<1 NBS smoke chamber NFPA-258 Shrinkage, % 30 min at 150°C 120 min at 400°C 0.17 1.25 IPC-TM-650 Method 2.2.4A; ASTM D-5214-91 Limiting Oxygen Index, % 37–45 ASTM D-2863-87 Glass Transition Temperature (Tg)
This catalog covers Amphenol - Farnell
www.farnell.comproducts is the Amphenol ... Contacts are available in both solder and crimp versions. Pins and sockets are machined from copper alloy with a silver plated finish. Size 16 and 12 socket contacts incor-porate a closed entry design. Refer to pages 49, …
SOT23 - NXP
www.nxp.comsolder lands solder resist occupied area solder paste s ot0 23 _f r 0.5 (3×) 0.6 (3×) 0.6 (3×) 0.7 (3×) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm ... customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Professional Metal Film Leaded Resistors
www.vishay.comnot exceeded. Furthermore, a high level of ambient temperature or of po wer dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. These resistors do not feature a limited lifetime when operated within the permissible limits.
Thick Film Chip Resistors, Military / Established ...
www.vishay.comTermination Solder-coated nickel barrier Solder finish Tin / lead solder alloy STANDARD ELECTRICAL SPECIFICATIONS VISHAY DALE MODEL MIL-PRF-55342 STYLE MIL SPEC. SHEET TERM. CASE SIZE POWER RATING P70 °C W MAX. WORKING VOLTAGE (1) V RESISTANCE RANGE Ω TOLERANCE ± % TEMPERATURE COEFFICIENT (2) ± ppm/°C …