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RoHS Declaration - NXP

RoHS Declaration - NXP

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Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) 7(c)-I . Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 15

  Capacitors, Melting

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