SOT23 - NXP
Wave soldering footprint SOT023_fw Package life cycle status REL Major version date 18-9-2008 Minor version date 6-7-2012 Security status COMPANY PUBLIC Modified date 28-11-2012 Issue date 16-3-2006 Web publication date 28-11-2012 Initial web publication date 11-3-2011 Customer specific indicator N
Download SOT23 - NXP
Information
Domain:
Source:
Link to this page:
Documents from same domain
AN10441 Level shifting techniques in I2C-bus design
www.nxp.comDocument information AN10441 Level shifting techniques in I2C-bus design Rev. 01 — 18 June 2007 Application note Info Content Keywords I2C-bus, level shifting Abstract Logic level shifting may be required when interfacing legacy devices with
AN3234: Washing Machine Three-Phase AC …
www.nxp.comWashing Machine Three-Phase AC Induction Motor Drive, Rev. 0 Indirect Vector Control 4 Freescale Semiconductor If you are looking for more theory on the field ...
1. General description - nxp.com
www.nxp.com1. General description The TJA1044 is part of the Mantis family of high-speed CAN transceivers. It provides an interface between a Controller Area Network (CAN) protocol controller and the physical
PCA9570 Remote 4-bit general purpose outputs for 1 MHz …
www.nxp.com1. General description The PCA9570 is a CMOS device that provides 4 bits of General Purpose parallel Output (GPO) expansion in low voltage processor and handheld battery powered mobile
P82B96 Dual bidirectional bus buffer - nxp.com
www.nxp.com1. General description The P82B96 is a bipolar IC that creates a non-latching, bidirectional, logic interface between the normal I2C-bus and a range of other bus configurations.It can interface
S32K144 EVB Quick Start Guide - NXP Semiconductors
www.nxp.comJ14 SWD connector. 3 EXTERNAL USE S32K144 EVBFeatures: ... USB connector of the USB cable to micro-B port J7 on the S32K144EVB. ... Windows, Linux and Mac operating systems. Using the MSD Flash Programmer 1. Locate the .srec file of your project , file is under the
Three-Phase BLDC Motor Sensorless Control Using …
www.nxp.comThis document describes the design of a three-phase brushless DC motor (BLDC motor) drive based on Freescale’s MC56F8013 and MC56F8023 dedicated motor control device. Brushless DC motors are popular in a wide application area.
AN11443 BFU550XR ISM 433 MHz LNA design - nxp.com
www.nxp.comAN11443 BFU550XR ISM 433 MHz LNA design Rev. 1 — 23 January 2014 Application note . Document information Info Content Keywords BFU520, BFU530, BFU550 series, ISM-band, 433MHz 866MHz Abstract This document describes an ISM Frequency LNA design on BFU5xxXR Starter kit
DSP56156 16-Bit Digital Signal Processor - nxp.com
www.nxp.comThe DSP56156 is a general-purpose MPU-style Digital Signal Processor (DSP). On a single semi- conductor chip, the DSP56156 comprises a very efficient 16-bit digital signal processing core, pro-
SAA7706H Car radio Digital Signal Processor (DSP)
www.nxp.comCar radio Digital Signal Processor (DSP) SAA7706H This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
Related documents
Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 ...
www.vishay.comTotal package dissipation ambient (2 LEDs and 2 detectors, 2 channels) Ptot 350 mW Storage temperature Tstg-55 to +150 °C Operating temperature Tamb-55 to +100 °C Soldering time from 260 °C (1) Tsld 10 s ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT INPUT
LT1963A - 1.5A, Low Noise, Fast Transient Response LDO ...
www.analog.comlead based finish tape and reel part marking* package description temperature range LT1963AET-1.5 LT1963AET-1.5#TR LT1963AET-1.5 5-Lead Plastic TO-220 –40°C to 125°C LT1963AET-1.8 LT1963AET-1.8#TR LT1963AET-1.8 5-Lead Plastic TO-220 –40°C to 125°C
2.7V 4-Channel/8-Channel 10-Bit A/D Converters with SPI ...
cdn-shop.adafruit.comJan 02, 2008 · Soldering temperature of leads (10 seconds).....+300°C ESD Protection On All Pins (HBM).....≥ 4kV † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rati ng only and functional operation of ... Thermal Package Resistances
PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS
img.ozdisan.comPACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1 1. PACKAGE CLASSIFICATIONS 1.1 Packaging Trends In recent years, marked advances have been made in the electronics field. One such advance has been the progression from vacuum tubes to transistors and finally, to ICs. ICs themselves have been more highly integrated into LSIs, …
MOUNTING AND HANDLING GUIDELINES FOR …
aosmd.comthe time-temperature specification of the package is not exceeded in the soldering operation. References 1. Sanjay Havanur, Application Note: AN101-1 , June, 2007 This document contains preliminary data; supplementary data may be published at a later date. Alpha and Omega Semiconductor reserves the right to make changes at any time without notice.
Package Information : SOP8
fscdn.rohm.comSOP8 Package Information 7. Soldering conditions 7.1 Recommended temperature profile for reflow 7.2 Recommended condition for wave soldering Preheating temperature : 120 °C to 150 °C Preheating time : 60 sec MAX Soldering temperature : 260 °C ± 3 °C Soldering time : …
SMA - Diodes Incorporated
www.diodes.comSurface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.064 grams (Approximate) Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020 Package View Package Outline Dimensions SMA
SMB - Diodes Incorporated
www.diodes.comSurface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.096 grams (Approximate) Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020 Package View Package Outline Dimensions SMB SMB
Package dimensions MSOP, SSOP, TSSOP-A2 - iC-Haus
www.ichaus.deFor additional information on component handling, preconditioning and soldering conditions, refer to the relevant iC-Haus customer information files, available separately. iC-Haus Application Guide More Package Info. Title: Package dimensions MSOP, SSOP, TSSOP-A2.indd Created Date: 8/4/2006 1:07:11 PM ...