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Optics for EUV Lithography

Optics for EUV LithographyJune 13th, 2018 Berkeley, CA, USADr. Sascha Migura, Carl Zeiss SMT GmbH,Oberkochen, Germany2018 EUVL Workshop2 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Ernst Abbe in 1873k1is process factor is wavelengthNAis numerical apertureMoore s Law drivestherequirementson resolutionoftheopticalsystemdeterminesth eminimumfeaturesizeon a Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018100080060035025018013090654532221611 868890929496980002040812141610061718 Design rule / Resolution(nm)Increasing sequence down NA up k1downhas been repeated several times during the last 25 Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018intermediate focuscollectorreticle (mask)

Optics for EUV Lithography have evolved over three decades to a level where excellent imaging is demonstrated. Right now, the Starlith ® 3400 Optics extends EUV Lithography to 13nm single-shot resolution with high productivity for serial production. High-NA EUV Lithography enables further shrink for the

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Transcription of Optics for EUV Lithography

1 Optics for EUV LithographyJune 13th, 2018 Berkeley, CA, USADr. Sascha Migura, Carl Zeiss SMT GmbH,Oberkochen, Germany2018 EUVL Workshop2 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Ernst Abbe in 1873k1is process factor is wavelengthNAis numerical apertureMoore s Law drivestherequirementson resolutionoftheopticalsystemdeterminesth eminimumfeaturesizeon a Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018100080060035025018013090654532221611 868890929496980002040812141610061718 Design rule / Resolution(nm)Increasing sequence down NA up k1downhas been repeated several times during the last 25 Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018intermediate focuscollectorreticle (mask)

2 Waferplasmailluminatorfield facet mirrorpupil facet mirrorprojectionopticssourceEUV optical train (schematic).design scheme5 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 High-NA EUV Lithography will provide further EUV Program at ZEISS has enabled serial Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018200620092012201820032015 EUV program at ZEISS: Continuously improving shipmentSmall Field ToolMET Since mid-1999 developed in cooperation with Lawrence Livermore National Lab and Lawrence Berkeley National x mm M AG5xResolution20 nmMicro Exposure Tool7 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 20182006 Starlith 310020092012201820032015 EUV program at ZEISS.

3 Continuously improving shipmentMETS mall Field ToolNA = nmMETADTA lpha Demo x 33 mm M AG4xResolution27 nmStarlith 3100 The 1st EUV full field system: Optics for ASML ADT / Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 20182006 Starlith 310020092012201820032015 Starlith 33x0 Starlith 3400 ADT3100 EUV program at ZEISS: Continuously improving ProductionNA = nmFirst shipmentMETS mall Field ToolNA = nmMETA lpha Demo x 33 mm M AG4xResolution13 nmStarlith 3400 The solution for serial production: Optics for ASML NXE:3400B. 9 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Source: ASMLThe ZEISS Starlith 3400 capabilityHP = Half Pitch10 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, the ASML NXE:3400B : ASML11 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 OneWorld Trade Center541 mFromWikipediaIntel Core i7 layoutDisplayingtheinformationofoneNXE.

4 3400B field, requiresa TV screenof780m x Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 The Starlith 3400 projection Optics performs with improved aberrations consistent for shipped inhouseEUV qualificationWavefrontRMSD istortion13 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 The optical performance translates into world record breaking Matched Machine Overlay of for wafers (BMMO ), 76 fields (full wafer, 3 mm edge clearance), 7x7 points per field, WEC, REC corrections, ATP model appliedMatchedMachineOVL [nm]wafers14 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018A robust transmission trend for the Starlith 3400 Optics supports increased 3 ZEISS inhouseEUV qualificationSpecSpec15 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 The Starlith 3400illuminator is fully qualified @EUVand consistently meets specification for shipped measurementof22 illuminationsettingsduringsystemqualific ationslit intensity@reticlefordipolesettingideal UNICOM correctionappliedZEISS inhouseEUV qualification16 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, not mirrorsurfaceis polisheddown to~50pm Whitney Zeiss SMT GmbH.

5 Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Computer ControlledPolishingIon Beam FiguringforAtomicLevel FigureControlInterferometricSurfaceMetro logyforSpheresandAspheresRepeatability:~ 10pm rmsReproducibility:~20pm rmsManufacturing technologiesandmetrologyareclosingtheloo pforfigurecontrolon Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Polishing: Key Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Mid Spatial Frequency Roughness (MSFR) MSFR valuesherearebasedonthesame definitionasfor3100 Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018original andreducedsystemflaretosatisfyinglevels meetinga Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 20182006 Alpha Demo ToolStarlith 310020092012201820032015 Starlith 33x0 Starlith 3400 ADT31003400 High-NA EUV 33x0 EUV program at ZEISS.

6 Continuously improving ProductionDevelopmentNA = nmNA = nmNA = < 8 nmFirst shipmentMETS mall Field ToolNA = nmMET22 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 High-NA EUV Lithography will provide further EUV Program at ZEISS has enabled serial Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Ernst Abbe in 1873NA> is needed to achieve sub 8 nanometer @ k1= exposure / Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018intermediate focuscollectorreticle (mask)waferplasmailluminatorfield facet mirrorpupil facet mirrorprojectionopticssourceEUV optical train (schematic).design schemeIncreased openings of the light cones lead to bigger mirrors and bigger opticsNA25 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018NA examplesWafer levelReticle levelWe have designs for such High-NA Optics Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Extreme aspheresenablingfurtherimprovedwavefront / imagingperformanceBig last mirrordrivenbyHigh NALarge overallsizeofopticalsystemTightsurfacesp ecificationsenablinglowstraylight/ high contrastimaging Challenge to Optics technology and manufacturing No fundamental limitsThese are big optical systems with very large mirrors and extreme aspheresat increased accuracy Zeiss SMT GmbH.

7 Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 The High-NA Optics design supports a considerable reduction of the Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Half pitch pitch pitch pitch theHigh-NA EUV systemoffersthechancetobetheultimatelowe stcost/pixelprintingmachine! High-NA EUV: Ultimate resolution Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Extensions for High-NA EUV Optics manufacturing are under , GermanyHigh-NA EUV OpticsHigh-NA EUV TestingCoatingExtensions for High-NA30 Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 ConstructionstatusOctober 2017 Extensions for High-NA EUV Optics manufacturing are under Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018 Conclusions.

8 OpticsforEUV Lithographyhaveevolvedoverthreedecadesto a levelwhereexcellentimagingis demonstrated. Right now, the Starlith 3400 Optics extends EUV Lithography to 13nm single-shot resolution with high productivity for serial production. High-NA EUV Lithography enables further shrink for the semiconductor industry to continue Moore s Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, Teams at ASML & ZEISS andat ourpartnersFederal Ministry of Education and Research (Germany)DG Connect of the European Commissionfor funding of the BMBF project ETIK (16N12256K)and the projects E450 LMDAP (621280), SeNaTe (662338), TAKE5 (692522) and TAKEMI5 (737479)within the framework of the ENIAC and ECSEL Zeiss SMT GmbH, Sascha Migura 2018 EUVL WorkshopJune 13th, 2018

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